KR970058474A - 전자파 차폐용 케이스 - Google Patents

전자파 차폐용 케이스 Download PDF

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Publication number
KR970058474A
KR970058474A KR1019950052565A KR19950052565A KR970058474A KR 970058474 A KR970058474 A KR 970058474A KR 1019950052565 A KR1019950052565 A KR 1019950052565A KR 19950052565 A KR19950052565 A KR 19950052565A KR 970058474 A KR970058474 A KR 970058474A
Authority
KR
South Korea
Prior art keywords
case
electromagnetic shielding
electromagnetic waves
shielding case
shielding
Prior art date
Application number
KR1019950052565A
Other languages
English (en)
Inventor
김재욱
Original Assignee
정몽원
만도기계 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 정몽원, 만도기계 주식회사 filed Critical 정몽원
Priority to KR1019950052565A priority Critical patent/KR970058474A/ko
Priority to DE19653196A priority patent/DE19653196A1/de
Priority to JP8339753A priority patent/JPH09183945A/ja
Priority to CN96114325A priority patent/CN1158349A/zh
Publication of KR970058474A publication Critical patent/KR970058474A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/128—Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Paints Or Removers (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

본 발명은 전기 전자 제품의 작동에 의하여 발생되는 전자파를 차폐시키기 위한 케이스에 관한 것으로 상기 케이스는 캠퍼술포닉 산이 도핑된 폴리 아닐린이 그의 표면상에 도포되어 있으며 이에 의해서 전기 전자 제품의 작동에 의하여 발생되는 전자파를 효과적으로 차폐시킬 수 있다.

Description

전자파 차폐용 케이스
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명에 따른 차폐 재료의 전자파 차폐 효과를 나타낸 그래프.

Claims (2)

  1. 전기 전자 제품의 작동에 의하여 발생되는 전자파를 차폐시키기 위한 케이스에 있어서, 그의 표면상에 캠퍼술포닉 산이 도핑된 폴리 아닐린이 도포되어 있는 것을 특징으로 하는 전자파 차폐용 케이스.
  2. 제1항에 있어서, 상기 캠퍼술포닉 산이 도핑된 폴리아닐린은 스프레이 코팅 공정에 의하여 도포되는 것을 특징으로 하는 전자파 차폐용 케이스.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950052565A 1995-12-20 1995-12-20 전자파 차폐용 케이스 KR970058474A (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019950052565A KR970058474A (ko) 1995-12-20 1995-12-20 전자파 차폐용 케이스
DE19653196A DE19653196A1 (de) 1995-12-20 1996-12-19 Leitfähiges mit Kampfersulfonsäure dotiertes Polyanilin
JP8339753A JPH09183945A (ja) 1995-12-20 1996-12-19 ショウノウスルホン酸でドーピングされた伝導性ポリアニリン
CN96114325A CN1158349A (zh) 1995-12-20 1996-12-20 掺杂有樟脑磺酸的导电性聚苯胺

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950052565A KR970058474A (ko) 1995-12-20 1995-12-20 전자파 차폐용 케이스

Publications (1)

Publication Number Publication Date
KR970058474A true KR970058474A (ko) 1997-07-31

Family

ID=19441742

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950052565A KR970058474A (ko) 1995-12-20 1995-12-20 전자파 차폐용 케이스

Country Status (4)

Country Link
JP (1) JPH09183945A (ko)
KR (1) KR970058474A (ko)
CN (1) CN1158349A (ko)
DE (1) DE19653196A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020082243A (ko) * 2001-04-19 2002-10-31 주식회사 두람하이테크 전자기파 차폐 특성을 갖는 고분자 수지 조성물 및 그제조방법

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU9637798A (en) * 1997-11-07 1999-05-31 Bicc Public Limited Company Conductive polymer compositions
DE10038201A1 (de) * 2000-08-04 2002-02-14 Siemens Axiva Gmbh & Co Kg Neue Elektrolyte für Elektrolytkondensatoren und deren Verwendung
WO2005090446A1 (en) * 2004-03-18 2005-09-29 Ormecon Gmbh A composition comprising a conductive polymer in colloidal form and carbon
EP1884354A4 (en) * 2005-05-27 2008-08-06 Idemitsu Kosan Co MULTILAYER BODY OF A CONDUCTIVE POLYMER
TWI551637B (zh) * 2009-06-12 2016-10-01 Idemitsu Kosan Co Π conjugated polymer composition
CN103137848B (zh) * 2013-02-06 2016-04-13 中国科学院上海硅酸盐研究所 获得高性能聚苯胺基热电材料的方法
CN114133653A (zh) * 2021-12-08 2022-03-04 崔俊 一种防静电eva及其制备方法
CN115433511B (zh) * 2022-10-21 2023-06-23 吉林大学 一种掺合型水性聚氨酯基电磁屏蔽涂料及其制备方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100261971B1 (ko) * 1991-06-12 2000-07-15 스미스 폴 처리가능한 형의 전기전도성 폴리아닐린 및 그로부터 형성된 전도성 제품

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020082243A (ko) * 2001-04-19 2002-10-31 주식회사 두람하이테크 전자기파 차폐 특성을 갖는 고분자 수지 조성물 및 그제조방법

Also Published As

Publication number Publication date
JPH09183945A (ja) 1997-07-15
DE19653196A1 (de) 1997-06-26
CN1158349A (zh) 1997-09-03

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