KR970053733A - Lead frame with curved leads - Google Patents
Lead frame with curved leads Download PDFInfo
- Publication number
- KR970053733A KR970053733A KR1019950049162A KR19950049162A KR970053733A KR 970053733 A KR970053733 A KR 970053733A KR 1019950049162 A KR1019950049162 A KR 1019950049162A KR 19950049162 A KR19950049162 A KR 19950049162A KR 970053733 A KR970053733 A KR 970053733A
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- lead
- wire
- leads
- integration
- Prior art date
Links
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- Lead Frames For Integrated Circuits (AREA)
Abstract
본 발명은 리드 프레임의 구조에 관한 것으로서, 더욱 상세하게는 리드 프레임에 연결되는 와이어의 집적도를 향상시키기 위하여 리드 프레임에 다운셋을 줌으로써 리드 프레임의 리드 간격이 넓어짐과 동시에 와이어 본딩의 집적도를 향상시키기 위한 리드 프레밍에 관한 것이다.The present invention relates to a structure of a lead frame, and more particularly, to improve the degree of integration of wire bonding while increasing the lead spacing of the lead frame by giving a downset to the lead frame in order to improve the degree of integration of the wires connected to the lead frame. Relates to lead framing.
본 발명은, 다이패드와 금속선이 연결되는 내부리드와 상기 내부리드와 일체형인 외부리드를 갖는 리드 프레임에 있어서, 상기 내부리드가 서로 단락되는 것을 방지하기 위해 근접해있는 리드의 높이가 각각 다르도록 단차를 갖는 것을 특징으로 하는 와이어 본딩 집적화를 위한 리드 프레임을 제공한다.The present invention provides a lead frame having an inner lead to which a die pad and a metal wire are connected, and an outer lead integral with the inner lead, wherein the heights of adjacent leads are different so as to prevent the inner leads from being shorted to each other. It provides a lead frame for wire bonding integration having a.
따라서, 상기 전술한 바에 의하면, 종래의 리드 프레임으로 불가능한 다수의 반도체 칩을 탑재할 수 있고, 와이어의 길이를 줄임과 동시에 몰딩공정에서 발생하는 와이어 스위핑현상에 의한 전기적인 단락을 방지할 수 있는 이점(利點)이 있다.Therefore, according to the above, it is possible to mount a large number of semiconductor chips that are impossible with the conventional lead frame, and to reduce the length of the wire and at the same time to prevent the electrical short circuit caused by the wire sweeping phenomenon occurring in the molding process. There is (利 點).
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2A도는 본 발명의 리드 프레임의 구조를 보여주는 일부 평면도, 제2B도는 본 발명의 리드 프레임을 보여주는 단면도.Figure 2A is a partial plan view showing the structure of the lead frame of the present invention, Figure 2B is a cross-sectional view showing the lead frame of the present invention.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950049162A KR970053733A (en) | 1995-12-13 | 1995-12-13 | Lead frame with curved leads |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950049162A KR970053733A (en) | 1995-12-13 | 1995-12-13 | Lead frame with curved leads |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970053733A true KR970053733A (en) | 1997-07-31 |
Family
ID=66594023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950049162A KR970053733A (en) | 1995-12-13 | 1995-12-13 | Lead frame with curved leads |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970053733A (en) |
-
1995
- 1995-12-13 KR KR1019950049162A patent/KR970053733A/en not_active Application Discontinuation
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |