KR930011190A - Semiconductor leadframe - Google Patents

Semiconductor leadframe Download PDF

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Publication number
KR930011190A
KR930011190A KR1019910020267A KR910020267A KR930011190A KR 930011190 A KR930011190 A KR 930011190A KR 1019910020267 A KR1019910020267 A KR 1019910020267A KR 910020267 A KR910020267 A KR 910020267A KR 930011190 A KR930011190 A KR 930011190A
Authority
KR
South Korea
Prior art keywords
lead
semiconductor chip
semiconductor
wire
bonding portion
Prior art date
Application number
KR1019910020267A
Other languages
Korean (ko)
Inventor
신상철
이상혁
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019910020267A priority Critical patent/KR930011190A/en
Publication of KR930011190A publication Critical patent/KR930011190A/en

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

이 발명은 반도체 칩에 구성한 집적회로와 외부단자를 전기적으로 연결시키기 위해 상기 반도체 칩과 와이어본딩되는 반도체 리드 프레임의 내부리드에 관한 것으로서, 상기 반도체 칩의 와이어 본딩부와 내부 리드의 와이어 본딩부가 동일 수평선상에 위치되게 함으로써 와이어 와이어 본딩길이가 단축되고, 와이어가 반도체 칩의 상측 모서리부에 접촉되지 않으며, 와이어 본딩 높이가 낮아지는 것에 의해 반도체 패키지의 박형화를 이룰 수 있는 반도체 리드 프레임이다.The present invention relates to an internal lead of a semiconductor lead frame wire-bonded with the semiconductor chip in order to electrically connect an integrated circuit and an external terminal configured in the semiconductor chip, wherein the wire bonding portion of the semiconductor chip and the wire bonding portion of the internal lead are the same. The wire lead bonding length is shortened by being positioned on the horizontal line, the wire is not in contact with the upper edge portion of the semiconductor chip, and the semiconductor lead frame can be made thinner by reducing the wire bonding height.

Description

반도체 리드 프레임Semiconductor leadframe

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 이 발명에 따른 반도체 패키지를 설명하기 위한 단면도이다.2 is a cross-sectional view illustrating a semiconductor package according to the present invention.

Claims (1)

반도체 칩(11)이 부착되는 패드(12)와, 상기 패드(12)의 주위로 배치되어 반도체 칩(11)과 전기적으로 연결되는 내부리드(14a)와, 상기 내부리드(14a)에 연이어 일체로 형성된 것으로 외부단자와의 접속을 위한 외부리드(14b)로 이루어진 반도체 리드프레임에 있어서, 상기 내부리드(14a)의 와이어 본딩부 위치가 패드(12)상에 부착된 반도체 칩(11)의 와이어 본딩부 위치와 동일수평선상 주위에 놓이도록 내부리드(14a)를 상향 절곡하여 됨을 특징으로 하는 반도체 리드 프레임.A pad 12 to which the semiconductor chip 11 is attached, an inner lead 14a disposed around the pad 12 and electrically connected to the semiconductor chip 11, and integrally connected to the inner lead 14a. A semiconductor lead frame comprising an external lead 14b for connecting to an external terminal, wherein the wire bonding portion position of the internal lead 14a is attached to the pad 12. A semiconductor lead frame, characterized in that the inner lead (14a) is bent upward so as to lie around the same horizontal line as the position of the bonding portion. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910020267A 1991-11-14 1991-11-14 Semiconductor leadframe KR930011190A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910020267A KR930011190A (en) 1991-11-14 1991-11-14 Semiconductor leadframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910020267A KR930011190A (en) 1991-11-14 1991-11-14 Semiconductor leadframe

Publications (1)

Publication Number Publication Date
KR930011190A true KR930011190A (en) 1993-06-23

Family

ID=67348858

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910020267A KR930011190A (en) 1991-11-14 1991-11-14 Semiconductor leadframe

Country Status (1)

Country Link
KR (1) KR930011190A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100481927B1 (en) * 1997-11-19 2005-08-11 삼성전자주식회사 Semiconductor Package and Manufacturing Method
KR20120012894A (en) * 2010-08-03 2012-02-13 엘지이노텍 주식회사 Light emitting device package and lighting system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100481927B1 (en) * 1997-11-19 2005-08-11 삼성전자주식회사 Semiconductor Package and Manufacturing Method
KR20120012894A (en) * 2010-08-03 2012-02-13 엘지이노텍 주식회사 Light emitting device package and lighting system

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