KR970053544A - Semiconductor device with dummy metal pattern - Google Patents
Semiconductor device with dummy metal pattern Download PDFInfo
- Publication number
- KR970053544A KR970053544A KR1019950057112A KR19950057112A KR970053544A KR 970053544 A KR970053544 A KR 970053544A KR 1019950057112 A KR1019950057112 A KR 1019950057112A KR 19950057112 A KR19950057112 A KR 19950057112A KR 970053544 A KR970053544 A KR 970053544A
- Authority
- KR
- South Korea
- Prior art keywords
- metal pattern
- semiconductor device
- dummy metal
- region
- pattern density
- Prior art date
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
본 발명은 더미메탈패턴이 형성된 반도체 장치에 관해 게시한다. 종래의 반도체 장치는 메탈패턴밀도가 낮은 영역은 과식각되는 현상이 발생할 수 있었다. 그러나 본 발명에서는 메탈패턴밀도가 낮은 영역이 과식각되는 현상을 방지하기 위하여 메탈패턴밀도가 낮은 영역에 더미메탈패턴을 형성함으로써 반도체 장치내의 메틸패턴밀도를 균등하게 하여 부분적으로 과식각되는 현상을 방지할 수 있다.The present invention discloses a semiconductor device in which a dummy metal pattern is formed. In the conventional semiconductor device, a region where the metal pattern density is low may be overetched. However, in the present invention, in order to prevent overetching of a region having a low metal pattern density, a dummy metal pattern is formed in a region having a low metal pattern density to equalize methyl pattern density in a semiconductor device, thereby preventing partial overetching. can do.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2도는 본 발명에 의하여 더미메탈패턴을 갖는 반도체 장치의 평면도이다.2 is a plan view of a semiconductor device having a dummy metal pattern according to the present invention.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950057112A KR970053544A (en) | 1995-12-26 | 1995-12-26 | Semiconductor device with dummy metal pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950057112A KR970053544A (en) | 1995-12-26 | 1995-12-26 | Semiconductor device with dummy metal pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970053544A true KR970053544A (en) | 1997-07-31 |
Family
ID=66618993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950057112A KR970053544A (en) | 1995-12-26 | 1995-12-26 | Semiconductor device with dummy metal pattern |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970053544A (en) |
-
1995
- 1995-12-26 KR KR1019950057112A patent/KR970053544A/en not_active Application Discontinuation
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR930006917A (en) | Metal wiring structure of semiconductor device | |
KR970053544A (en) | Semiconductor device with dummy metal pattern | |
KR930017125A (en) | Semiconductor chip with dummy pattern | |
KR920008197A (en) | High temperature heat treatment jig | |
KR920007509A (en) | Thin memory module | |
KR970053325A (en) | Wafer transfer device | |
KR970049005A (en) | Method of forming fine contact pattern of semiconductor device | |
KR950021050A (en) | Wafer step relaxation method | |
KR910013528A (en) | Design method of power and ground metal wiring | |
KR970023618A (en) | Semiconductor device with conductive layer for noise reduction | |
KR970023756A (en) | Spacer Formation Method of Semiconductor Device | |
KR920001678A (en) | Manufacturing method of aluminum oxide film formation of metal wiring | |
KR970028813A (en) | Reticle for Semiconductor Device Manufacturing | |
KR970052361A (en) | Contact Forming Method of Semiconductor Device | |
KR970024181A (en) | Capacitor and resistor formation method of semiconductor device | |
KR970052481A (en) | Bottom electrode of semiconductor manufacturing apparatus | |
KR930017109A (en) | Etching of Compound Semiconductor Devices | |
KR970067847A (en) | Bit line formation method | |
KR970023918A (en) | TAB tape with holes formed to prevent disconnection of conductive patterns | |
KR850008537A (en) | Mercy Bell's manufacturing method | |
KR970052374A (en) | Layout of semiconductor devices | |
KR930014937A (en) | Lead Frames Used in Semiconductor Devices | |
KR930014891A (en) | How to arrange indirect layers | |
KR940015695A (en) | Pattern formation method of semiconductor device | |
KR970024300A (en) | Thin film transistor manufacturing process using shadow mask |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |