KR970053213A - 와이어본딩장치 - Google Patents

와이어본딩장치 Download PDF

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KR970053213A
KR970053213A KR1019960073568A KR19960073568A KR970053213A KR 970053213 A KR970053213 A KR 970053213A KR 1019960073568 A KR1019960073568 A KR 1019960073568A KR 19960073568 A KR19960073568 A KR 19960073568A KR 970053213 A KR970053213 A KR 970053213A
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signal
diameter
ball
wire
discharge
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KR1019960073568A
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KR100231688B1 (ko
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미츠히로 나카오
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니시무로 타이조
가부시키가이샤 도시바
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    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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Abstract

본 발명은, 조건의 설정, 조정에 요하는 시간이 짧고, 신뢰성이 높은 와이어본딩장치를 제공함에 그 목적이 있다.
본 발명은 토치전극과, 캐필러리, 스타트신호에 따라 방전개시의 타이밍신호를 발생시키는 타이밍발생회로(12a), 방전전류설정신호(9) 및 방전개시의 타이밍신호에 의해 방전전류설정신호(9)에 따른 전류를 상기 급속세선과 상기 토치전극에 공급하여 방전을 발생시켜 급속세선의 선단을 용융시켜 볼을 형성하고, 스톱신호(81)에 의해 방전전류의 값(9)의 전류설정신호에 따른 전류의 공급을 정지하는 고압전원회로(13a), 금속세선과 토치전극 사이의 전압을 검출하여 전압신호로서 출력하는 고전압검지회로(14a), 목표치의 볼직경을 나타내는 신호(d), 와이어직경을 나타내는 신호(a), 상기 전압신호가 입력되어 볼의 직경을 산출하는 볼직경산출회로(16) 및, 볼직경산출회로의 출력인 상기 볼의 직경을 표시하는 볼직경표시장치(17)를 구비하고 있다.

Description

와이어본딩장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시형태에 다른 와이어본딩장치의 일부의 구성을 나타낸 도.

Claims (4)

  1. 토치전극(4)과, 이 토치전극의 가까이에 배치되고, 본딩용 금속세선을 상기 토치전극의 근방에 인도하는 캐필러리(1), 스타트신호에 따라 방전개시의 타이밍신호를 발생시키는 타이밍발생회로(12,12a,12b) 스톱신호 및 방전전류설정신호가 입력되는 입력단자를 갖추고, 상기 방전개시의 타이밍신호가 공급된 경우 상기 방전전류설정신호에 따른 전류를 상기 금속세선과 상기 토치전극에 공급하여 방전을 발생시켜 상기 금속세선의 선단을 용융시켜 볼을 형성하고, 상기 스톱신호가 입력된 경우 상기 방전전류설정신호에 따른 전류의 공급을 정지하는 고압전원회로(13,13a), 상기 금속세선과 토치전극 사이의 전압을 검출하여 전압신호로서 출력하는 고전압검지회로(14,14a), 목표치의 볼직경을 나타내는 신호 및 상기 금속세선의 와이어직경을 나타내는 신호가 입력되는 입력단자를 갖추고, 상기 전압신호가 입력되어 상기 전압신호의 값과 상기 목표치의 볼직경을 나타내는 신호와 와이어직경을 나타내는 신호에 의해 상기 금속세선의 선단에 형성되는 볼의 직경을 산출하는 볼직경산출회로(16) 및, 이 볼직경산출회로의 출력인 상기 볼의 직경을 표시하는 볼직경표시장치(17)를 구비하여 구성된 것을 특징으로 하는 와이어본딩장치.
  2. 제1항에 있어서, 상기 타이밍발생회로는 상기 방전개시의 타이밍신호를 볼직경산출회로에 공급하고, 상기 볼직경산출회로는 상기 방전개시의 타이밍신호가 공급된 경우 상기 전압신호의 최소치 및 최대치를 검출함과 더불어 상기 전압신호의 최소치 및 최대치와 그 경우 이외의 상기 전압신호와 함께 상기 목표치의 볼직경을 나타내는 신호와 와이어직경을 나타내는 신호에 의해 상기 볼의 직경을 산출하는 것을 특징으로 하는 와이어본딩장치.
  3. 토치전극(4)과, 이 토치전극의 가까이에 배치되고, 본딩용 금속세선을 상기 토치전극의 근방에 인도하는 캐필러리(1), 스타트신호에 따라 방전개시의 타이밍신호를 발생시키는 타이밍발생회로(12,12a,12b), 스톱신호 및 방전전류설정신호가 입력되는 입력단자를 갖추고, 상기 방전개시의 타이밍신호가 공급된 경우 상기 방전전류설정신호에 따른 전류를 상기 금속세선과 상기 토치전극에 공급하여 방전을 발생시켜 상기 금속세선의 선단을 용융시켜 볼을 형성하고, 상기 스톱신호가 입력된 경우 상기 방전전류설정신호에 따른 전류의 공급을 정지하고 고압전원회로(13,13a), 상기 금속세선과 토치전극 사이의 전압을 검출하여 전압신호로서 출력하는 고전압검지회로(14,14a), 목표치의 볼직경을 나타내는 신호 및 상기 금속세선의 와이어직경을 나타내는 신호가 입력되는 입력단자를 갖추고, 상기 방전개시의 타이밍신호가 입력된 경우 입력된 상기 목표치의 볼직경을 나타내는 신호 및 상기 와이어직경을 나타내는 신호에 의해 상기 방전전류의 값을 산출하여 상기 방전전류설정신호를 출력하는 방전전류설정회로(22) 및, 상기 목표치의 볼직경을 나타내는 신호와 상기 와이어직경을 나타내는 신호 및 상기 전압신호가 입력되고, 상기 목표치의 볼직경을 나타내는 신호와 상기 와이어직경을 나타내는 신호 및 상기 전압신호에 의해 상기 금속세선의 선단에 형성되는 상기 볼의 직경을 산출함과 더불어 상기 목표치의 볼직경과 비교하여 형성된 상기 볼의 직경이 상기 목표치의 볼직경과 동일한 것으로 판정한 경우 상기 스톱신호를 상기 고전압전원회로에 공급하는 볼직경판정회로(23)를 구비하여 구성된 것을 특징으로 하는 와이어본딩장치.
  4. 제3항에 있어서, 상기 목표치의 볼직경을 나타내는 신호와 상기 와이어직경을 나타내는 신호가 입력되고, 상기 방전전류설정회로와 상기 볼직경판정회로에 설정조건의 초기치를 공급하는 초기치설정회로(24)를 구비하고, 상기 방전전류설저회로는 상기 목표치의 볼직경을 나타내는 신호 및 상기 와이어직경을 나타내는 신호와 더불어 상기 초기치에 의해 상기 방전전류의 값을 산출하며, 상기 타이밍발생회로는 상기 방전개시의 타이밍신호를 볼직경판정회로에 공급하고, 상기 볼직경판정회로는 상기 방전개시의 타이밍신호가 공급된 경우 상기 전압신호의 최소치 및 최대치를 검출함과 더불어 상기 전압신호의 최소치 및 최대치와 그 경우 이외의 상기 전압신호와 상기 초기치와 더불어 상기 목표치의 볼직경을 나타내는 신호 및 상기 와이어직경을 나타내는 신호에 의해 상기 볼의 직경을 산출하는 것을 특징으로 하는 와이어본딩장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960073568A 1995-12-27 1996-12-27 와이어본딩장치 KR100231688B1 (ko)

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JP3370543B2 (ja) * 1997-02-24 2003-01-27 株式会社新川 ワイヤボンディング装置用放電異常検出装置及びその方法
US6062462A (en) * 1997-08-12 2000-05-16 Kulicke And Soffa Investments, Inc. Apparatus and method for making predetermined fine wire ball sizes
US6133540A (en) * 1998-08-03 2000-10-17 International Business Machines Corporation Apparatus and method for producing punch pin with spherical head
AU5438000A (en) * 2000-06-13 2001-12-24 Asm Technology Singapore Pte Ltd. A method of and apparatus for monitoring a ball forming process
US6898849B2 (en) * 2000-09-27 2005-05-31 Texas Instruments Incorporated Method for controlling wire balls in electronic bonding
TWI271247B (en) * 2003-03-21 2007-01-21 Esec Trading Sa Wire bonder
JP4530984B2 (ja) * 2005-12-28 2010-08-25 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
KR101236795B1 (ko) 2010-03-29 2013-02-25 앰코 테크놀로지 코리아 주식회사 반도체 패키지 제조용 와이어 본더의 바값 측정 시스템
JP2012244093A (ja) * 2011-05-24 2012-12-10 Renesas Electronics Corp 半導体装置の製造方法

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JPH06101491B2 (ja) * 1989-01-07 1994-12-12 三菱電機株式会社 ワイヤボンデイング方法及びその装置
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