KR970053179A - Device Arrangement Structure of Semiconductor Chip - Google Patents

Device Arrangement Structure of Semiconductor Chip Download PDF

Info

Publication number
KR970053179A
KR970053179A KR1019950057096A KR19950057096A KR970053179A KR 970053179 A KR970053179 A KR 970053179A KR 1019950057096 A KR1019950057096 A KR 1019950057096A KR 19950057096 A KR19950057096 A KR 19950057096A KR 970053179 A KR970053179 A KR 970053179A
Authority
KR
South Korea
Prior art keywords
layer
semiconductor chip
arrangement structure
peripheral circuit
present
Prior art date
Application number
KR1019950057096A
Other languages
Korean (ko)
Inventor
엄중섭
김재웅
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950057096A priority Critical patent/KR970053179A/en
Publication of KR970053179A publication Critical patent/KR970053179A/en

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

본 발명은 반도체 칩의 소자 배치 구조에 관한 것으로서, 본 발명에 의한 반도체 칩의 소자 배치 구조는 상기 셀 소자를 포함하는 제1층과, 상기 제1층 위에 형성되고, 상기 주변 회로 소자와 패드를 포함하는 제2층과, 상기 제1층과 제2층 사이에 형성되고, 상기 셀 소자와 주변 회로 소자와의 인터컨넥션을 위한 콘택이 형성된 절연층을 포함한다. 본 발명에 의하면, 칩 사이즈를 보다 작게 구성함으로써 많은 네트 다이를 확보할 수 있고, 셀 소자와 주변 회로 소자와의 공정 조건을 보다 용이하게 조정할 수 있따.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an element arrangement structure of a semiconductor chip, wherein an element arrangement structure of a semiconductor chip according to the present invention is formed on a first layer including the cell element and on the first layer. And a second layer including an insulating layer formed between the first layer and the second layer and having a contact for interconnection between the cell element and the peripheral circuit element. According to the present invention, by making the chip size smaller, many net dies can be ensured, and the process conditions of the cell element and the peripheral circuit element can be adjusted more easily.

Description

반도체 칩의 소자 배치 구조Device Arrangement Structure of Semiconductor Chip

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명의 바람직한 실시예에 따른 칩 내의 기능별 소자 배치 구조를 나타낸 도면이다.2 is a view showing a device arrangement structure for each function in a chip according to a preferred embodiment of the present invention.

Claims (1)

셀 소자와, 주변 회로 소자와, 패드를 포함하는 반도체 칩의 소자 배치 구조에 있어서, 상기 셀 소자를 포함하는 제1층과, 상기 제1층 위에 형성되고, 상기 주변 회로 소자와 패드를 포함하는 제2층과, 상기 제1층과 제2층 사이에 형성되고, 상기 셀 소자와 주변 회로 소자와의 인터컨넥션을 위한 콘택이 형성된 절연층을 포함하는 것을 특징으로 하는 반도체 칩의 소자 배치 구조.An element arrangement structure of a semiconductor chip comprising a cell element, a peripheral circuit element, and a pad, comprising: a first layer including the cell element, and formed on the first layer, wherein the peripheral circuit element and the pad are included; And a second layer and an insulating layer formed between the first layer and the second layer and having a contact for interconnection between the cell element and a peripheral circuit element. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950057096A 1995-12-26 1995-12-26 Device Arrangement Structure of Semiconductor Chip KR970053179A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950057096A KR970053179A (en) 1995-12-26 1995-12-26 Device Arrangement Structure of Semiconductor Chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950057096A KR970053179A (en) 1995-12-26 1995-12-26 Device Arrangement Structure of Semiconductor Chip

Publications (1)

Publication Number Publication Date
KR970053179A true KR970053179A (en) 1997-07-29

Family

ID=66618334

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950057096A KR970053179A (en) 1995-12-26 1995-12-26 Device Arrangement Structure of Semiconductor Chip

Country Status (1)

Country Link
KR (1) KR970053179A (en)

Similar Documents

Publication Publication Date Title
KR840000985A (en) Semiconductor integrated circuit and manufacturing method
KR920007199A (en) Semiconductor memory device
KR910010508A (en) Semiconductor devices
KR910007129A (en) Semiconductor device with input protection circuit
KR940012578A (en) Semiconductor device
KR970053179A (en) Device Arrangement Structure of Semiconductor Chip
KR910008853A (en) Semiconductor device and manufacturing method
KR900001020A (en) Semiconductor integrated circuit device
KR970023389A (en) Semiconductor memory cell placement method
KR920007093A (en) Hybrid semiconductor device
KR960032737A (en) Semiconductor memory device
KR970024153A (en) Layout to reduce cell and core contact area of semiconductor device
KR960043213A (en) Pad Arrangement Method of Semiconductor Memory Device
KR970024130A (en) Multichip Package Using Circuit Board With Via Holes
KR970024181A (en) Capacitor and resistor formation method of semiconductor device
KR940010302A (en) Semiconductor connection device
KR850005159A (en) Semiconductor integrated circuit with power supply passage to board
KR970052836A (en) Semiconductor device with dummy wiring and manufacturing method thereof
KR970053958A (en) Semiconductor chip layout
KR960039399A (en) Structure of mask rom
KR970052396A (en) Ground pad metal line structure of semiconductor chip
KR930014937A (en) Lead Frames Used in Semiconductor Devices
KR970024094A (en) Lead frame with slit on die pad
KR960015895A (en) Semiconductor devices
KR910015040A (en) High Frequency SMD Transistor with Two Emitter Terminals

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination