KR970053162A - 와이어본딩머신의 와이어 공급장치 - Google Patents

와이어본딩머신의 와이어 공급장치 Download PDF

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Publication number
KR970053162A
KR970053162A KR1019950047412A KR19950047412A KR970053162A KR 970053162 A KR970053162 A KR 970053162A KR 1019950047412 A KR1019950047412 A KR 1019950047412A KR 19950047412 A KR19950047412 A KR 19950047412A KR 970053162 A KR970053162 A KR 970053162A
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KR
South Korea
Prior art keywords
wire
compressed air
clamper
branch pipe
supply
Prior art date
Application number
KR1019950047412A
Other languages
English (en)
Other versions
KR0166819B1 (ko
Inventor
정기원
Original Assignee
문정환
Lg 반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, Lg 반도체 주식회사 filed Critical 문정환
Priority to KR1019950047412A priority Critical patent/KR0166819B1/ko
Publication of KR970053162A publication Critical patent/KR970053162A/ko
Application granted granted Critical
Publication of KR0166819B1 publication Critical patent/KR0166819B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

본 발명은 다이본딩이 완료된 상태에서 다이의 패드와 리드프레임의 인너리드사이에 와이어를 본딩하는 와이어본딩머신에서 캐필러리측으로 와이어를 공급하는 장치에 관한 것으로써, 좀더 구체적으로는 스풀에 감긴 와이어가 풀릴 때 와이어 브레이크불량 및 와이어가 빠지는 현상을 미연에 방지하기 위한 것이다.
이를 위해, 한쌍의 가이더(4a)(4b) 사이에 와이어 텐션부(5)를 설치하고 설치판(3)의 직하방에는 제1,2와이어 클램퍼 및 캐필러리(8)를 차례로 설치하여 스풀(2)에 감겨진 와이어(1)를 송급하도록 된 것에 있어서, 상기 와이어 텐션부(5)로 압축공기를 공급하는 공급관(10)에 분기관(11)을 연결하여 상기 분기관상에 스피드 콘트롤러(13)를 설치하고 상기 분기관(11)은 압축공기의 공급에 의해 동작하는 공지의 압축공기 와이어 클램퍼(14)와 연결하여 상기 압축공기 와이어 클램퍼(14)가 제2와이어 클램퍼역할을 하도록 된 것이다.

Description

와이어본딩 머신의 와이어 공급장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명이 적용된 장치의 구성도.

Claims (1)

  1. 한쌍의 가이더사이에 와이어 텐션부를 설치하고 설치판의 직하방에는 제1,2와이어 클램퍼 및 캐필러리를 차례로 설치하여 스풀에 감겨진 와이어를 송급하도록된 것에 있어서, 상기 와이어 텐션부로 압축공기를 공급하는 공급관에 분기관을 연결하여 상기 분기관상에 스피드 콘트롤러를 설치하고 상기 분기관은 압축공기의 공급에 의해 동작하는 공지의 압축공기 와이어 클램퍼와 연결하여 상기 압축공기 와이어 클램퍼가 제2와이어 클램퍼역할을 하도록 구성됨을 특징으로 하는 와이어본딩머신의 와이어 공급장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950047412A 1995-12-07 1995-12-07 와이어 본딩머신의 와이어 공급장치 KR0166819B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950047412A KR0166819B1 (ko) 1995-12-07 1995-12-07 와이어 본딩머신의 와이어 공급장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950047412A KR0166819B1 (ko) 1995-12-07 1995-12-07 와이어 본딩머신의 와이어 공급장치

Publications (2)

Publication Number Publication Date
KR970053162A true KR970053162A (ko) 1997-07-29
KR0166819B1 KR0166819B1 (ko) 1999-02-01

Family

ID=19438267

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950047412A KR0166819B1 (ko) 1995-12-07 1995-12-07 와이어 본딩머신의 와이어 공급장치

Country Status (1)

Country Link
KR (1) KR0166819B1 (ko)

Also Published As

Publication number Publication date
KR0166819B1 (ko) 1999-02-01

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