KR970052818U - 반도체소자의 제조에 사용되는 식각장비 - Google Patents

반도체소자의 제조에 사용되는 식각장비

Info

Publication number
KR970052818U
KR970052818U KR2019960003368U KR19960003368U KR970052818U KR 970052818 U KR970052818 U KR 970052818U KR 2019960003368 U KR2019960003368 U KR 2019960003368U KR 19960003368 U KR19960003368 U KR 19960003368U KR 970052818 U KR970052818 U KR 970052818U
Authority
KR
South Korea
Prior art keywords
semiconductor devices
equipment used
manufacturing semiconductor
etching equipment
etching
Prior art date
Application number
KR2019960003368U
Other languages
English (en)
Other versions
KR0135795Y1 (ko
Inventor
박용현
현종선
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR2019960003368U priority Critical patent/KR0135795Y1/ko
Publication of KR970052818U publication Critical patent/KR970052818U/ko
Application granted granted Critical
Publication of KR0135795Y1 publication Critical patent/KR0135795Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR2019960003368U 1996-02-28 1996-02-28 반도체소자의 제조에 사용되는 식각장비 KR0135795Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019960003368U KR0135795Y1 (ko) 1996-02-28 1996-02-28 반도체소자의 제조에 사용되는 식각장비

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019960003368U KR0135795Y1 (ko) 1996-02-28 1996-02-28 반도체소자의 제조에 사용되는 식각장비

Publications (2)

Publication Number Publication Date
KR970052818U true KR970052818U (ko) 1997-09-08
KR0135795Y1 KR0135795Y1 (ko) 1999-03-20

Family

ID=19451121

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019960003368U KR0135795Y1 (ko) 1996-02-28 1996-02-28 반도체소자의 제조에 사용되는 식각장비

Country Status (1)

Country Link
KR (1) KR0135795Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100460799B1 (ko) * 1997-06-23 2005-05-17 삼성전자주식회사 플라즈마처리장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100460799B1 (ko) * 1997-06-23 2005-05-17 삼성전자주식회사 플라즈마처리장치

Also Published As

Publication number Publication date
KR0135795Y1 (ko) 1999-03-20

Similar Documents

Publication Publication Date Title
KR970052818U (ko) 반도체소자의 제조에 사용되는 식각장비
KR960019164U (ko) 반도체디바이스용 소켓
KR970052833U (ko) 반도체 제조 장치
KR970015307U (ko) 반도체 웨이퍼 에칭장치
KR970056059U (ko) 반도체 제조장비의 식각장치
KR970059843U (ko) 웨이퍼의 에칭장치
KR970064182U (ko) 반도체 웨이퍼 식각 장치
KR970015296U (ko) 반도체 웨이퍼 식각장치
KR950028650U (ko) 반도체 웨이퍼 식각장비
KR970052816U (ko) 반도체 제조 장치
KR970052819U (ko) 반도체 제조 장치
KR960015587U (ko) 반도체 소자의 제조장비
KR950031473U (ko) 반도체 웨이퍼 건조장치
KR970015297U (ko) 반도체 웨이퍼 식각장치
KR970015295U (ko) 반도체 웨이퍼 식각장치
KR950007353U (ko) 반도체 제조장치
KR960019150U (ko) 반도체제조장치의웨이퍼장착장치
KR980005379U (ko) 반도체 소자 제조용 식각장치
KR970046742U (ko) 반도체 식각장치
KR970046659U (ko) 반도체 식각장치
KR960019095U (ko) 반도체 소자 건식 식각 장치
KR970056034U (ko) 반도체 제조장치
KR970059814U (ko) 반도체 제조장치
KR970059821U (ko) 반도체 제조 장치
KR970064169U (ko) 반도체 제조 장치

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20051007

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee