KR970052733A - Wafer Chucks for Silicon Wet Etch for X-ray Mask Fabrication - Google Patents

Wafer Chucks for Silicon Wet Etch for X-ray Mask Fabrication Download PDF

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Publication number
KR970052733A
KR970052733A KR1019950052662A KR19950052662A KR970052733A KR 970052733 A KR970052733 A KR 970052733A KR 1019950052662 A KR1019950052662 A KR 1019950052662A KR 19950052662 A KR19950052662 A KR 19950052662A KR 970052733 A KR970052733 A KR 970052733A
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KR
South Korea
Prior art keywords
wafer
wet etching
silicon wet
wafer chuck
ray mask
Prior art date
Application number
KR1019950052662A
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Korean (ko)
Other versions
KR0160907B1 (en
Inventor
최상수
전영진
정해빈
이종현
유형준
Original Assignee
양승택
한국전자통신연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 양승택, 한국전자통신연구원 filed Critical 양승택
Priority to KR1019950052662A priority Critical patent/KR0160907B1/en
Publication of KR970052733A publication Critical patent/KR970052733A/en
Application granted granted Critical
Publication of KR0160907B1 publication Critical patent/KR0160907B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

본 발명은 X-선 마스크 제작을 위한 실리콘 습식식각용 웨이퍼 척에 관한 것이다.The present invention relates to a wafer chuck for silicon wet etching for fabricating an X-ray mask.

좀 더 구체적으로, 본 발명은 X-선 마스크 제작공정중 실리콘의 습식식각시 웨이퍼의 외주연 부분이 식각액과 접촉하는 것을 방지하거나 웨이퍼의 일면에 실장된 소자가 식각액과 접촉하는 것을 방지할 수 있는 실리콘 습식식각용 웨이퍼 척에 관한 것이다.More specifically, the present invention can prevent the outer periphery of the wafer from contacting the etchant during wet etching of the silicon during the X-ray mask fabrication process, or prevent the device mounted on one side of the wafer from contacting the etchant. A wafer chuck for silicon wet etching.

본 발명의 실리콘 습식식각용 웨이퍼 척은 X-선 마스크 제작을 위한 실리콘 습식식각용 웨이퍼 척에 있어서, 단면에 L자 형상으로 절곡된 환 형상을 지니고 절곡된 평탄면의 중앙에는 O-링(11)이 부설되어 웨이퍼(50) 일면의 외주연 부분을 안착시키는 위한 하부 지지부(10); 및, 환 형상을 지니고 하면 중앙에 O-링(21)이 부설되며 상기한 하부 지지부(10)의 절곡면에 내설되어 웨이퍼(50) 타면의 외주연 부분을 고정하기 위한 상부 지지부(20)를 포함하는 것을 특징으로 한다.The silicon wet etching wafer chuck of the present invention is a silicon wet etching wafer chuck for X-ray mask fabrication, having an annular shape bent in an L shape at a cross section and having an O-ring (11) in the center of the bent flat surface. A lower support portion 10 for laying the outer peripheral portion of one surface of the wafer 50; And, when having an annular shape O-ring (21) is placed in the center and is installed on the bent surface of the lower support 10, the upper support 20 for fixing the outer peripheral portion of the other surface of the wafer 50 It is characterized by including.

Description

X-선 마스크 제작을 위한 실리콘 습식식각용 웨이퍼 척Wafer Chucks for Silicon Wet Etch for X-ray Mask Fabrication

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3a도 및 제3b도는 본 발명의 일 실시예에 따른 실리콘 습식식각용 웨이퍼 척의 장착된 상태를 나타낸 장착상태도의 평면도 및 단면도.3a and 3b are a plan view and a cross-sectional view of a mounting state diagram showing the mounting state of the wafer chuck for silicon wet etching according to an embodiment of the present invention.

제4a도 및 제4b도는 제3도에 도시된 웨이퍼 척이 장착되는 상태를 나타낸 장착상태도 및 분해사시도.4A and 4B are mounting state diagrams and exploded perspective views showing a state in which the wafer chuck shown in FIG. 3 is mounted.

Claims (4)

X-선 마스크 제작을 위한 실리콘 습식식각용 웨이퍼 척에 있어서, 단면에 “L”자 형상으로 절곡된 환형상을 지니고 절곡된 평탄면의 중앙에는 O-링(11)이 부설되어 웨이퍼(50) 일면의 외주연 부분을 안착시키기 위한 하부 지지부(10); 및, 환 형상을 지니고 하면 중앙에 O-링(21)이 부설되며 상기한 하부 지지부(10)의 절곡면에 내설되어 웨이퍼(50) 타면의 외주연 부분을 고정하기 위한 상부 지지부(20)를 포함하는 것을 특징으로 하는 실리콘 습식식각용 웨이퍼 척.In the wafer chuck for silicon wet etching for X-ray mask fabrication, an O-ring (11) is placed at the center of the bent flat surface having an annular shape bent in an “L” shape on a cross-section and the wafer 50 A lower support portion 10 for seating an outer circumferential portion of one surface; And, when having an annular shape O-ring (21) is placed in the center and is installed on the bent surface of the lower support 10, the upper support 20 for fixing the outer peripheral portion of the other surface of the wafer 50 Wafer chuck for silicon wet etching, characterized in that it comprises. 제1항에 있어서, 상기한 상부 지지부(20)의 개구부에는 개구부를 봉쇄하는 덮개(22)가 상부 지지부(20)의 일면에 추가로 부설된 것을 특징으로 하는 실리콘 습식식각용 웨이퍼 척.The wafer chuck for silicon wet etching according to claim 1, wherein a cover (22) for sealing the opening is additionally attached to one surface of the upper support (20) in the opening of the upper support (20). 제1항 또는 제2항에 있어서, 상기한 상부 지지부(20) 및 하부 지지부(10)는 테프론으로 형성된 것을 특징으로 하는 실리콘 습식식각용 웨이퍼 척.The wafer chuck of claim 1, wherein the upper support part (20) and the lower support part (10) are formed of Teflon. 제1항 또는 제2항에 있어서, 상기한 하부 지지부(10)와 상부 지지부(20)는 나합되도록, 하부 지지부(10)의 절곡 측면 및 상부 지지부(10)의 외측면에는 나사산이 형성된 것을 특징으로 하는 실리콘 습식식각용 웨이퍼 척.The method of claim 1 or claim 2, wherein the lower support portion 10 and the upper support portion 20 is screwed on the bent side of the lower support portion 10 and the outer surface of the upper support portion 10 to be combined. Wafer chuck for silicon wet etching. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950052662A 1995-12-20 1995-12-20 Wafer chuck for silicon wet etching to fabricate x-ray mask KR0160907B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950052662A KR0160907B1 (en) 1995-12-20 1995-12-20 Wafer chuck for silicon wet etching to fabricate x-ray mask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950052662A KR0160907B1 (en) 1995-12-20 1995-12-20 Wafer chuck for silicon wet etching to fabricate x-ray mask

Publications (2)

Publication Number Publication Date
KR970052733A true KR970052733A (en) 1997-07-29
KR0160907B1 KR0160907B1 (en) 1999-02-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950052662A KR0160907B1 (en) 1995-12-20 1995-12-20 Wafer chuck for silicon wet etching to fabricate x-ray mask

Country Status (1)

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KR (1) KR0160907B1 (en)

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Publication number Publication date
KR0160907B1 (en) 1999-02-01

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