KR970052696A - 교반기가 장착된 웨이퍼 세정 장치 - Google Patents

교반기가 장착된 웨이퍼 세정 장치 Download PDF

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Publication number
KR970052696A
KR970052696A KR1019950065736A KR19950065736A KR970052696A KR 970052696 A KR970052696 A KR 970052696A KR 1019950065736 A KR1019950065736 A KR 1019950065736A KR 19950065736 A KR19950065736 A KR 19950065736A KR 970052696 A KR970052696 A KR 970052696A
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KR
South Korea
Prior art keywords
unit
drive unit
wafer cleaning
air
cleaning apparatus
Prior art date
Application number
KR1019950065736A
Other languages
English (en)
Other versions
KR0170214B1 (ko
Inventor
황경석
이준규
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950065736A priority Critical patent/KR0170214B1/ko
Priority to TW085111287A priority patent/TW304900B/zh
Priority to JP31530596A priority patent/JP3632334B2/ja
Priority to US08/768,709 priority patent/US5901716A/en
Publication of KR970052696A publication Critical patent/KR970052696A/ko
Application granted granted Critical
Publication of KR0170214B1 publication Critical patent/KR0170214B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B3/00—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
    • B05B3/14—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with oscillating elements; with intermittent operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

본 발명은 교반기가 장착된 웨이퍼 세정 장치에 관한 것으로서, 본 발명은 웨이퍼의 클리닝을 짧은 시간 내에 완벽하게 실행할 수 있는 교반기가 장착된 웨이퍼 세정 장치를 제공하는데 그 목적을 두고 있다.
상기의 목적을 달성하기 위한 본 발명에 의한 교반기가 장착된 웨이퍼 세정 장치는 압축된 공기가 주입되는 공기 주입부와, 상기 공기 주입부에 주입된 공기에 의해 좌우 운동하는 수평 구동부와, 상기 수평 구동부의 좌우 운동에 의해 상하 운동하는 수직 구동부와, 상기 수평 구동부와 수직 구동부에 연결되어 상하 좌우 교반 운동을 하면서 탈 이온수를 분사하는 분사부로 구성됨을 특징으로 한다.

Description

교반기가 장착된 웨이퍼 세정 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명에 의한 교반기가 장착된 웨이퍼 세정 장치를 개략적으로 도시한 평면도.

Claims (2)

  1. 압축된 공기의 주입되는 공기 주입부와, 상기 공기 주입부에 주입된 공기에 의해 좌우 운동하는 수평 구동부와, 상기 수평 구동부의 좌우 운동에 의해 상하 운동하는 수직 구동부와, 상기 수평 구동부와 수직 구동부에 연결되어 상하 좌우 교반 운동을 하면서 탈 이온수를 분사하는 분사부로 구성됨을 특징으로 하는 교반기가 장착된 웨이퍼 세정 장치.
  2. 제1항에 있어서, 상기 수평 구동부와 수직 구동부는 분사부위 분사 각도가 45°이상될 수 있도록 교반됨을 특징으로 하는 교반기가 장착된 웨이퍼 세정 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950065736A 1995-12-29 1995-12-29 교반기가 장착된 웨이퍼 세정 장치 KR0170214B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019950065736A KR0170214B1 (ko) 1995-12-29 1995-12-29 교반기가 장착된 웨이퍼 세정 장치
TW085111287A TW304900B (en) 1995-12-29 1996-09-16 Wafer cleaning apparatus
JP31530596A JP3632334B2 (ja) 1995-12-29 1996-11-26 ウェーハ洗浄装置
US08/768,709 US5901716A (en) 1995-12-29 1996-12-18 Wafer cleaning apparatus with rotating cleaning solution injection nozzles

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950065736A KR0170214B1 (ko) 1995-12-29 1995-12-29 교반기가 장착된 웨이퍼 세정 장치

Publications (2)

Publication Number Publication Date
KR970052696A true KR970052696A (ko) 1997-07-29
KR0170214B1 KR0170214B1 (ko) 1999-03-30

Family

ID=19447144

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950065736A KR0170214B1 (ko) 1995-12-29 1995-12-29 교반기가 장착된 웨이퍼 세정 장치

Country Status (4)

Country Link
US (1) US5901716A (ko)
JP (1) JP3632334B2 (ko)
KR (1) KR0170214B1 (ko)
TW (1) TW304900B (ko)

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US6199568B1 (en) * 1997-10-20 2001-03-13 Dainippon Screen Mfg. Co., Ltd. Treating tank, and substrate treating apparatus having the treating tank
TW471010B (en) 2000-09-28 2002-01-01 Applied Materials Inc Wafer cleaning equipment
US7371467B2 (en) * 2002-01-08 2008-05-13 Applied Materials, Inc. Process chamber component having electroplated yttrium containing coating
US7297247B2 (en) * 2003-05-06 2007-11-20 Applied Materials, Inc. Electroformed sputtering target
KR100692125B1 (ko) * 2003-10-30 2007-03-12 현대자동차주식회사 무단 변속기의 벨트 윤활 제어장치
DE102005015758A1 (de) * 2004-12-08 2006-06-14 Astec Halbleitertechnologie Gmbh Verfahren und Vorrichtung zum Ätzen von in einer Ätzlösung aufgenommenen Substraten
JP2007229614A (ja) * 2006-02-28 2007-09-13 Fujitsu Ltd 洗浄装置、洗浄方法および製品の製造方法
JP4705517B2 (ja) * 2006-05-19 2011-06-22 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、プログラム、および記録媒体
KR100962520B1 (ko) * 2008-05-29 2010-06-14 세메스 주식회사 케미컬 분사 장치 및 이를 포함하는 기판 처리 장치
CN102569010B (zh) * 2010-12-22 2015-07-08 中芯国际集成电路制造(上海)有限公司 一种晶圆清洗装置
US9175392B2 (en) * 2011-06-17 2015-11-03 Intermolecular, Inc. System for multi-region processing

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US1927665A (en) * 1926-11-19 1933-09-19 Ind Improvements Inc Dishwashing machine
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Also Published As

Publication number Publication date
TW304900B (en) 1997-05-11
US5901716A (en) 1999-05-11
JP3632334B2 (ja) 2005-03-23
KR0170214B1 (ko) 1999-03-30
JPH09186124A (ja) 1997-07-15

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