KR970052414A - How to Fill Metals into Contact Holes in Semiconductor Devices - Google Patents

How to Fill Metals into Contact Holes in Semiconductor Devices Download PDF

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Publication number
KR970052414A
KR970052414A KR1019950061987A KR19950061987A KR970052414A KR 970052414 A KR970052414 A KR 970052414A KR 1019950061987 A KR1019950061987 A KR 1019950061987A KR 19950061987 A KR19950061987 A KR 19950061987A KR 970052414 A KR970052414 A KR 970052414A
Authority
KR
South Korea
Prior art keywords
metal
contact hole
depositing
semiconductor devices
contact holes
Prior art date
Application number
KR1019950061987A
Other languages
Korean (ko)
Inventor
심상철
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950061987A priority Critical patent/KR970052414A/en
Publication of KR970052414A publication Critical patent/KR970052414A/en

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  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

본 발명은 반도체 장치의 제조 방법에 관한 것으로서, 2차 금속 증착 후에 고온 고압으로 플로우시킴으로써, 1차로 증착한 금속에 발생하였을 미세 보이드 등의 결함이 제거되고 금속막의 두께에 관계없이 콘택 홀에 금속막을 채워 넣을 수 있으며 딤플링 현상도 방지하는 반도체 장치의 콘택 홀에 금속을 채우는 방법이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor device, wherein by flowing at a high temperature and high pressure after secondary metal deposition, defects such as fine voids that may have occurred in the first deposited metal are removed, and a metal film is formed in the contact hole regardless of the thickness of the metal film. It is a method of filling a metal into a contact hole of a semiconductor device that can be filled and prevents dimples.

Description

반도체 장치의 콘택홀에 금속을 채우는 방법How to fill metal into contact hole of semiconductor device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도의 (가) 내지 (라)는 본 발명에 의한 반도체 장치의 콘택 홀에 금속을 채우는 방법을 그 공정 순서에 따라 도시한 단면도이다.2A to 2D are cross-sectional views showing a method of filling metal into a contact hole of a semiconductor device according to the present invention in the order of the steps thereof.

Claims (1)

반도체 기판에 불순물 확산 영역을 형성하고, 상기 기판 상층부에 절연막을 증착하는 제1단계, 사진식각법으로 상기 절연막의 일부를 제거하여 콘택 홀을 형성하고, 장벽 금속을 증착하고 어닐링을 실시하는 제2단계, 제1금속막을 증착하고 폴로우시켜 금속으로 콘택 홀 내부를 채우는 제3단계, 상기 기판 상층부에 제2금속막을 증착하는 제4단계, 고압, 고온의 조건에서 상기 제2금속막을 플로우시키는 제5단계를 포함하는 반도체 장치의 콘택 홀에 금속을 채우는 방법.A first step of forming an impurity diffusion region in a semiconductor substrate, depositing an insulating film on the upper layer of the substrate, and removing a part of the insulating film by photolithography to form a contact hole, depositing a barrier metal, and performing annealing A third step of depositing and following a first metal film to fill the contact hole with a metal, a fourth step of depositing a second metal film on an upper layer of the substrate, and a second metal film flowing under high pressure and high temperature conditions A method for filling metal into a contact hole of a semiconductor device comprising five steps. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950061987A 1995-12-28 1995-12-28 How to Fill Metals into Contact Holes in Semiconductor Devices KR970052414A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950061987A KR970052414A (en) 1995-12-28 1995-12-28 How to Fill Metals into Contact Holes in Semiconductor Devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950061987A KR970052414A (en) 1995-12-28 1995-12-28 How to Fill Metals into Contact Holes in Semiconductor Devices

Publications (1)

Publication Number Publication Date
KR970052414A true KR970052414A (en) 1997-07-29

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ID=66621699

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950061987A KR970052414A (en) 1995-12-28 1995-12-28 How to Fill Metals into Contact Holes in Semiconductor Devices

Country Status (1)

Country Link
KR (1) KR970052414A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100271403B1 (en) * 1998-03-04 2000-12-01 황인길 Method for making contactor hole of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100271403B1 (en) * 1998-03-04 2000-12-01 황인길 Method for making contactor hole of semiconductor device

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