KR970052412A - Method for manufacturing metal wiring in semiconductor device - Google Patents
Method for manufacturing metal wiring in semiconductor device Download PDFInfo
- Publication number
- KR970052412A KR970052412A KR1019950061984A KR19950061984A KR970052412A KR 970052412 A KR970052412 A KR 970052412A KR 1019950061984 A KR1019950061984 A KR 1019950061984A KR 19950061984 A KR19950061984 A KR 19950061984A KR 970052412 A KR970052412 A KR 970052412A
- Authority
- KR
- South Korea
- Prior art keywords
- metal wiring
- semiconductor device
- manufacturing
- wiring
- manufacturing metal
- Prior art date
Links
Abstract
본 발명은 반도체 장치의 배선 구조 제조 방법에 관한 것으로서, 장벽 금속 상부의 자연 산화막을 제거하고 금속 배선을 하여 장벽 금속 간의 화합물 형성을 원활하게 하여 막 계면 구조를 안정되게 한다. 그럼으로써 금속 배선의 일렉트로 마이그레이션 신뢰성을 크게 향상하고, 컨택 홀 부위의 컨택 저항을 감소시켜 소자 특성을 개선하는 배선 구조의 제조 방법이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a wiring structure of a semiconductor device, wherein the natural oxide film on the barrier metal is removed and the metal wiring is performed to facilitate compound formation between the barrier metals, thereby making the film interface structure stable. Thereby, it is a manufacturing method of the wiring structure which greatly improves the electromigration reliability of metal wiring, and reduces the contact resistance of a contact hole site | part, and improves a device characteristic.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2도의 (가) 내지 (라)는 본 발명에 의한 금속 배선의 제조 방법을 그 공정 순서에 따라 도시한 단면도이다.2A to 2D are cross-sectional views showing a method for manufacturing a metal wiring according to the present invention in accordance with the order of the steps thereof.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950061984A KR970052412A (en) | 1995-12-28 | 1995-12-28 | Method for manufacturing metal wiring in semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950061984A KR970052412A (en) | 1995-12-28 | 1995-12-28 | Method for manufacturing metal wiring in semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970052412A true KR970052412A (en) | 1997-07-29 |
Family
ID=66621649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950061984A KR970052412A (en) | 1995-12-28 | 1995-12-28 | Method for manufacturing metal wiring in semiconductor device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970052412A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100400248B1 (en) * | 2001-04-06 | 2003-10-01 | 주식회사 하이닉스반도체 | Method for forming the line in semiconductor device |
-
1995
- 1995-12-28 KR KR1019950061984A patent/KR970052412A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100400248B1 (en) * | 2001-04-06 | 2003-10-01 | 주식회사 하이닉스반도체 | Method for forming the line in semiconductor device |
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Legal Events
Date | Code | Title | Description |
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WITN | Withdrawal due to no request for examination |