KR970046880U - Wafer alignment device of taping equipment - Google Patents

Wafer alignment device of taping equipment

Info

Publication number
KR970046880U
KR970046880U KR2019950038010U KR19950038010U KR970046880U KR 970046880 U KR970046880 U KR 970046880U KR 2019950038010 U KR2019950038010 U KR 2019950038010U KR 19950038010 U KR19950038010 U KR 19950038010U KR 970046880 U KR970046880 U KR 970046880U
Authority
KR
South Korea
Prior art keywords
alignment device
wafer alignment
taping equipment
taping
equipment
Prior art date
Application number
KR2019950038010U
Other languages
Korean (ko)
Other versions
KR0127357Y1 (en
Inventor
박신규
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950038010U priority Critical patent/KR0127357Y1/en
Publication of KR970046880U publication Critical patent/KR970046880U/en
Application granted granted Critical
Publication of KR0127357Y1 publication Critical patent/KR0127357Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR2019950038010U 1995-12-04 1995-12-04 Wafer aligning device for taping apparatus KR0127357Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950038010U KR0127357Y1 (en) 1995-12-04 1995-12-04 Wafer aligning device for taping apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950038010U KR0127357Y1 (en) 1995-12-04 1995-12-04 Wafer aligning device for taping apparatus

Publications (2)

Publication Number Publication Date
KR970046880U true KR970046880U (en) 1997-07-31
KR0127357Y1 KR0127357Y1 (en) 1998-12-01

Family

ID=19431877

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950038010U KR0127357Y1 (en) 1995-12-04 1995-12-04 Wafer aligning device for taping apparatus

Country Status (1)

Country Link
KR (1) KR0127357Y1 (en)

Also Published As

Publication number Publication date
KR0127357Y1 (en) 1998-12-01

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20040618

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee