KR970030733A - Leadframe with heat sink with tie-resistant tie bar - Google Patents

Leadframe with heat sink with tie-resistant tie bar Download PDF

Info

Publication number
KR970030733A
KR970030733A KR1019950039640A KR19950039640A KR970030733A KR 970030733 A KR970030733 A KR 970030733A KR 1019950039640 A KR1019950039640 A KR 1019950039640A KR 19950039640 A KR19950039640 A KR 19950039640A KR 970030733 A KR970030733 A KR 970030733A
Authority
KR
South Korea
Prior art keywords
leadframe
heat sink
tie
tie bar
die pad
Prior art date
Application number
KR1019950039640A
Other languages
Korean (ko)
Inventor
김기영
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950039640A priority Critical patent/KR970030733A/en
Publication of KR970030733A publication Critical patent/KR970030733A/en

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

본 발명은 히트 싱크를 갖는 리드프레임에 관한 것으로, 리드프레임 스트립의 각 히트 싱크를 연결하는 타이 바를 리드프레임의 다이패드 인접부에 타이 바를 형성시켜 성형 공정시에 발생하는 프래쉬를 방지하고 리드프레임의 저면에 노치를 형성하여 응력을 분산시킬 수 있는 특징을 가진다.The present invention relates to a lead frame having a heat sink, wherein a tie bar connecting each heat sink of the lead frame strip forms a tie bar adjacent to the die pad of the lead frame to prevent a flash occurring during the molding process and It has a feature that can form a notch on the bottom to disperse the stress.

Description

프래쉬 방지용 타이 바가 형성된 히트 싱크를 갖는 리드프레임Leadframe with heat sink with tie-resistant tie bar

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제 2도는 본 발명에 의한 프래쉬 방지용 타이 바가 형성된 히트 싱크를 갖는 리드 프레임을 나타내는 평면도.2 is a plan view showing a lead frame having a heat sink in which a tie rod for preventing collision according to the present invention is formed.

제 3도는 제 2도의 A-A'선 단면도.3 is a cross-sectional view taken along the line AA ′ of FIG. 2.

제 4도는 본 발명에 의한 프래쉬 방지용 타이 바가 형성된 히트 싱크를 갖는 리드프레임을 적용한 패키지를 나타내는 평면도.4 is a plan view showing a package to which a lead frame having a heat sink having a tie rod for preventing splash according to the present invention is applied.

Claims (3)

칩이 안착될 다이패드와, 그 다이패드에 이격되어 일측면 상에 형성된 내부리드들과, 그 내부리드들에 각기 대응하여 이체형으로 형성된 외부리드들과, 상기 다이패드의 다른 면상에 형성된 히트 싱크와, 상기 히트 싱크에 인접되게 형성된 타이 바를 포함하는 리드프레임에 있어서, 상기 타이 바가 상기 다이패드에 인접되게 형성되어 성형 공정에 의해 발생되는 프래쉬를 방지하는 것을 특징으로 하는 프래쉬 방지용 타이 바가 형성된 히트 싱크를 갖는 리드프레임.A die pad on which a chip is to be seated, inner leads formed on one side of the die pad, spaced apart from the die pads, outer leads formed in a two-piece shape corresponding to the inner leads, and a heat formed on the other side of the die pad A lead frame comprising a sink and a tie bar formed adjacent to the heat sink, wherein the tie bar is formed adjacent to the die pad to prevent a flash generated by a forming process. Leadframe with sink. 제 1항에 있어서, 상기 리드프레임의 저면에 응력 방지용 노치가 형성된 것을 특징으로 하는 프래쉬 방지용 타이 바가 형성된 히트 싱크를 갖는 리드프레임.The leadframe having a heat sink having a tie rod for preventing a collision, wherein the notch for preventing stress is formed on a bottom surface of the leadframe. 제 2항에 있어서, 상기 노치의 방향이 상기 내부리드들과 상기 외부리ㄷ,들의 형성 방향과 동일한 것을 특징으로 하는 프래쉬 방지용 타이 바가 형성된 히트 싱크를 갖는 리드프레임.3. The leadframe having a heat sink having a flash preventing tie bar according to claim 2, wherein the notch has the same direction as that of the inner leads and the outer leads. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950039640A 1995-11-03 1995-11-03 Leadframe with heat sink with tie-resistant tie bar KR970030733A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950039640A KR970030733A (en) 1995-11-03 1995-11-03 Leadframe with heat sink with tie-resistant tie bar

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950039640A KR970030733A (en) 1995-11-03 1995-11-03 Leadframe with heat sink with tie-resistant tie bar

Publications (1)

Publication Number Publication Date
KR970030733A true KR970030733A (en) 1997-06-26

Family

ID=66587453

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950039640A KR970030733A (en) 1995-11-03 1995-11-03 Leadframe with heat sink with tie-resistant tie bar

Country Status (1)

Country Link
KR (1) KR970030733A (en)

Similar Documents

Publication Publication Date Title
KR920702549A (en) Semiconductor device and manufacturing method thereof
KR970030733A (en) Leadframe with heat sink with tie-resistant tie bar
KR940016723A (en) Semiconductor lead frame
KR970024106A (en) Upset Adjusted Lead Frame and Semiconductor Chip Packages Using the Same
KR910007117A (en) Resin Sealed Semiconductor Device
KR970053745A (en) Lead frame to prevent wire sweeping
KR970013262A (en) Leadframe with Extended Internal Leads
KR970030735A (en) Lead frame with resin dambar fixing protrusion
KR970024105A (en) Lead frame with resin dambar fixing protrusion
KR970024097A (en) Lead frame of semiconductor chip package with external lead separated from adjacent lead frame device metal
KR970053736A (en) Leadframes for Semiconductor Packages
KR970053717A (en) Chip package with bent die pad structure
KR960026708A (en) Leadframes for Semiconductor Package Manufacturing
KR970018283A (en) Semiconductor Chip Package Using Tie Bar
KR970024094A (en) Lead frame with slit on die pad
KR970013277A (en) Leadframe with grooves for preventing defects in packages
KR970018465A (en) Lead frame of semiconductor package
KR950015670A (en) Mold device of semiconductor package
KR970030736A (en) Semiconductor package with improved leadframe
KR960010206A (en) Mold method and mold mold structure of semiconductor package
KR940016706A (en) Semiconductor package
KR970008530A (en) Surface-mount leadframes, semiconductor packages using the same, and manufacturing methods thereof
KR970003873A (en) Semiconductor package
KR960043131A (en) Semiconductor Package with Flash Removal Tape
KR970008540A (en) Lead Structure of Semiconductor Package Leadframe

Legal Events

Date Code Title Description
N231 Notification of change of applicant
WITN Withdrawal due to no request for examination