KR970003873A - Semiconductor package - Google Patents

Semiconductor package Download PDF

Info

Publication number
KR970003873A
KR970003873A KR1019950018557A KR19950018557A KR970003873A KR 970003873 A KR970003873 A KR 970003873A KR 1019950018557 A KR1019950018557 A KR 1019950018557A KR 19950018557 A KR19950018557 A KR 19950018557A KR 970003873 A KR970003873 A KR 970003873A
Authority
KR
South Korea
Prior art keywords
die
semiconductor package
wire
region
bonding pad
Prior art date
Application number
KR1019950018557A
Other languages
Korean (ko)
Inventor
홍성학
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019950018557A priority Critical patent/KR970003873A/en
Publication of KR970003873A publication Critical patent/KR970003873A/en

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

본 발명은 반도체 패캐이지에 관한 것으로서, 버스바 상부에 에폭시 수지를 이용하여 다이를 부착함으로서 충분한 본딩 공간을 확보할 수 있고, 또한 버스바의 다이 부착 영역과 다이와 와이어로 본딩되는 본딩 패드 영역간에는 하향 절곡된 형태의 다운 셋을 구성하여 버스 바와 다이를 부착하는데 이용되는 에폭시 수지가 버스 바의 본딩 패드영역으로의 흘러가는 것을 방지할 수 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package, in which a sufficient bonding space can be secured by attaching a die to an upper portion of a busbar by using an epoxy resin, and further, a downward direction is provided between a die attaching region of the busbar and a bonding pad region bonded by a die and a wire. A bent downset can be constructed to prevent the epoxy resin used to attach the bus bars and dies to the bonding pad region of the bus bars.

Description

반도체 패캐이지Semiconductor package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 이용된 리드 프레임의 일부 사시도, 제2도는 제1도에 도시된 리드 프레임을 이용하여 패캐이지화한 상태의 단면도.1 is a partial perspective view of a lead frame used in the present invention, and FIG. 2 is a cross-sectional view of the lead frame shown in FIG.

Claims (3)

반도체 패캐이지에 있어서, 버스바 상부에 에폭시 수지를 이용하여 다이를 접착하고, 다이와 내부 리드간에 와이어 본딩한 후 봉지제로 몰딩함으로써 이루어지는 것을 특징으로 하는 반도체 패캐이지.A semiconductor package, comprising: bonding a die to an upper portion of a bus bar using an epoxy resin, wire bonding between the die and the inner lead, and molding the encapsulant. 제1항에 있어서, 상기 버스바는 다이가 부착되는 영역과 다이와 와이어로 본딩되는 본딩 패드영역으로 구분되는 것을 특징으로 하는 반도체 패캐이지.The semiconductor package of claim 1, wherein the bus bar is divided into a region to which a die is attached and a bonding pad region to be bonded by a die and a wire. 제2항에 있어서, 상기 버스바의 다이 부착 영역과 다이와 와이어로 본딩되는 본딩 패드 영역간에는 하향절곡된 형태의 다운 셋이 구성되는 것을 특징으로 하는 반도체 패캐이지.The semiconductor package of claim 2, wherein a downset of a downwardly bent shape is formed between the die attach region of the busbar and the bonding pad region bonded with the die and the wire. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950018557A 1995-06-30 1995-06-30 Semiconductor package KR970003873A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950018557A KR970003873A (en) 1995-06-30 1995-06-30 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950018557A KR970003873A (en) 1995-06-30 1995-06-30 Semiconductor package

Publications (1)

Publication Number Publication Date
KR970003873A true KR970003873A (en) 1997-01-29

Family

ID=66526621

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950018557A KR970003873A (en) 1995-06-30 1995-06-30 Semiconductor package

Country Status (1)

Country Link
KR (1) KR970003873A (en)

Similar Documents

Publication Publication Date Title
KR960009136A (en) Semiconductor package and manufacturing method
KR950009988A (en) Resin-sealed semiconductor device
KR940022767A (en) Semiconductor device without flag and manufacturing method thereof
KR880011939A (en) Assembly method of semiconductor laser
KR920005307A (en) Manufacturing method and manufacturing apparatus of resin encapsulated semiconductor device
KR920702549A (en) Semiconductor device and manufacturing method thereof
KR980006174A (en) Rip Lead Package
KR970024071A (en) Improved plastic encapsulated semiconductor device having wing leads and method for manufacturing the same
KR970003873A (en) Semiconductor package
KR910001949A (en) Flagless Leadframes, Packages and Methods
KR970024106A (en) Upset Adjusted Lead Frame and Semiconductor Chip Packages Using the Same
KR970018465A (en) Lead frame of semiconductor package
KR860007736A (en) Lead frame using semiconductor device, manufacturing method thereof and manufacturing method
KR970053745A (en) Lead frame to prevent wire sweeping
KR940016716A (en) Leadframe Structure for Mounting Rectangular Dies
KR930011190A (en) Semiconductor leadframe
KR970030744A (en) Package with leadframe with internal leads extending across the diepad
KR950034719A (en) Lead frame and package device manufacturing method including the lead frame
KR940018957A (en) Resin-sealed semiconductor device and grid flame
KR970030693A (en) Semiconductor package
KR930001398A (en) Semiconductor package
KR970024057A (en) High Reliability Semiconductor Chip Packages
KR970053681A (en) Package with die pad structure to prevent package cracking
KR960043143A (en) Lead Frames for Semiconductor Packages
KR970030726A (en) Ball Grid Array Package with Lead Frame

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application