KR970003873A - Semiconductor package - Google Patents
Semiconductor package Download PDFInfo
- Publication number
- KR970003873A KR970003873A KR1019950018557A KR19950018557A KR970003873A KR 970003873 A KR970003873 A KR 970003873A KR 1019950018557 A KR1019950018557 A KR 1019950018557A KR 19950018557 A KR19950018557 A KR 19950018557A KR 970003873 A KR970003873 A KR 970003873A
- Authority
- KR
- South Korea
- Prior art keywords
- die
- semiconductor package
- wire
- region
- bonding pad
- Prior art date
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
본 발명은 반도체 패캐이지에 관한 것으로서, 버스바 상부에 에폭시 수지를 이용하여 다이를 부착함으로서 충분한 본딩 공간을 확보할 수 있고, 또한 버스바의 다이 부착 영역과 다이와 와이어로 본딩되는 본딩 패드 영역간에는 하향 절곡된 형태의 다운 셋을 구성하여 버스 바와 다이를 부착하는데 이용되는 에폭시 수지가 버스 바의 본딩 패드영역으로의 흘러가는 것을 방지할 수 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package, in which a sufficient bonding space can be secured by attaching a die to an upper portion of a busbar by using an epoxy resin, and further, a downward direction is provided between a die attaching region of the busbar and a bonding pad region bonded by a die and a wire. A bent downset can be constructed to prevent the epoxy resin used to attach the bus bars and dies to the bonding pad region of the bus bars.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제1도는 본 발명에 이용된 리드 프레임의 일부 사시도, 제2도는 제1도에 도시된 리드 프레임을 이용하여 패캐이지화한 상태의 단면도.1 is a partial perspective view of a lead frame used in the present invention, and FIG. 2 is a cross-sectional view of the lead frame shown in FIG.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950018557A KR970003873A (en) | 1995-06-30 | 1995-06-30 | Semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950018557A KR970003873A (en) | 1995-06-30 | 1995-06-30 | Semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970003873A true KR970003873A (en) | 1997-01-29 |
Family
ID=66526621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950018557A KR970003873A (en) | 1995-06-30 | 1995-06-30 | Semiconductor package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970003873A (en) |
-
1995
- 1995-06-30 KR KR1019950018557A patent/KR970003873A/en not_active Application Discontinuation
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |