KR970030696A - Plastic Ball Grid Array Package with Printed Circuit Board with Locking Holes - Google Patents
Plastic Ball Grid Array Package with Printed Circuit Board with Locking Holes Download PDFInfo
- Publication number
- KR970030696A KR970030696A KR1019950040240A KR19950040240A KR970030696A KR 970030696 A KR970030696 A KR 970030696A KR 1019950040240 A KR1019950040240 A KR 1019950040240A KR 19950040240 A KR19950040240 A KR 19950040240A KR 970030696 A KR970030696 A KR 970030696A
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- printed circuit
- grid array
- ball grid
- array package
- Prior art date
Links
Abstract
본 발명은 플라스틱 볼 그리드 어레이 패키지에 관한 것으로, 더욱 상세하게는 플라스틱 볼 그리드 어레이 패키지의 인쇄회로기판에 록킹 홀을 형성하고 반도체 칩을 실장한 후 에폭시 수지를 주입하여 성형할 때 상기 경화된 에폭시 성형수지와 인쇄회로기판 사이에 비틀림이 발생시 록킹 홀이 록킹 효과를 발휘하여 인쇄회로기판과 에폭시 성형수지간의 균열을 방지하기 위한 록킹 홀이 형성된 인쇄회로기판을 구비한 플라스틱 볼 그리드 어레이 패키지에 관한 것이다. 본 발명은, 인쇄회로기판에 반도체 칩이 실장되고 상기 반도체 칩을 보호하기 위해 에폭시 수지로 몰딩된 볼 그리드 어레이 패키지에 있어서, 상기 에폭시 성형수지로 봉지되는 인쇄회로기판의 양측에 록킹 홀을 형성하여 상기 에폭시 성형수지가 록킹 홀에 충전되도록 형성되어진 록킹 홀이 형성된 인쇄회로기판을 구비한 볼 그리드 어레이 패키지인 것을 특징으로 한다. 따라서, 본 발명에 따른 구조에 따르면, 패키지의 휨을 방지하고 인쇄회로기판과 에폭시 성형수지와의 계면에 발생하는 갈라짐 현상을 방지함으로써 제품의 생산성을 향상시키고 고신뢰성을 향상시킬 수 있는 이점(利點)이 있다.The present invention relates to a plastic ball grid array package, and more particularly, to forming a locking hole in a printed circuit board of a plastic ball grid array package, mounting a semiconductor chip, and injecting an epoxy resin into the cured epoxy molding. The present invention relates to a plastic ball grid array package having a printed circuit board having a locking hole for preventing a crack between the printed circuit board and the epoxy molding resin when the torsion occurs between the resin and the printed circuit board. The present invention provides a ball grid array package in which a semiconductor chip is mounted on a printed circuit board and molded in an epoxy resin to protect the semiconductor chip, and forming locking holes on both sides of the printed circuit board encapsulated with the epoxy molding resin. The epoxy molding resin is characterized in that the ball grid array package having a printed circuit board having a locking hole is formed to be filled in the locking hole. Therefore, according to the structure according to the present invention, it is possible to prevent the warpage of the package and to prevent cracking occurring at the interface between the printed circuit board and the epoxy molding resin to improve the productivity of the product and improve the high reliability (신 There is).
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제 2a도는 본 발명의 록킹 홀이 형성된 인쇄회로기판을 구비한 플라스틱 볼 그리드 어레이 패키지의 구조를 나타내는 단면도.Figure 2a is a cross-sectional view showing the structure of a plastic ball grid array package having a printed circuit board with a locking hole of the present invention.
제 2b도는 본 발명의 록킹 홀이 형성된 인쇄회로기판을 구비한 플라스틱 볼 그리드 어레이 패키지의 다른 실시예를 나타내는 단면도.Figure 2b is a cross-sectional view showing another embodiment of a plastic ball grid array package having a printed circuit board having a locking hole of the present invention.
제 2c도는 본 발명의 록킹 홀이 형성된 인쇄회로기판을 구비한 플라스틱 볼 그리드 어레이 패키지의 구조를 나타내는 단면도.Figure 2c is a cross-sectional view showing the structure of a plastic ball grid array package having a printed circuit board with a locking hole of the present invention.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950040240A KR970030696A (en) | 1995-11-08 | 1995-11-08 | Plastic Ball Grid Array Package with Printed Circuit Board with Locking Holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950040240A KR970030696A (en) | 1995-11-08 | 1995-11-08 | Plastic Ball Grid Array Package with Printed Circuit Board with Locking Holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970030696A true KR970030696A (en) | 1997-06-26 |
Family
ID=66587466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950040240A KR970030696A (en) | 1995-11-08 | 1995-11-08 | Plastic Ball Grid Array Package with Printed Circuit Board with Locking Holes |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970030696A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040036002A (en) * | 2002-10-23 | 2004-04-30 | 엠텍비젼 주식회사 | Printed Circuit Substrate for use in a Semiconductor Package with Locking-Holes and Semiconductor Package using the Substrate |
| US9373574B2 (en) | 2012-07-05 | 2016-06-21 | Samsung Electronics Co., Ltd. | Semiconductor packages and methods of forming the same |
-
1995
- 1995-11-08 KR KR1019950040240A patent/KR970030696A/en not_active Application Discontinuation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040036002A (en) * | 2002-10-23 | 2004-04-30 | 엠텍비젼 주식회사 | Printed Circuit Substrate for use in a Semiconductor Package with Locking-Holes and Semiconductor Package using the Substrate |
| US9373574B2 (en) | 2012-07-05 | 2016-06-21 | Samsung Electronics Co., Ltd. | Semiconductor packages and methods of forming the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application |