KR970018284A - Molding Method for Preventing Flow of Heat Dissipating Part of Semiconductor Chip Package - Google Patents

Molding Method for Preventing Flow of Heat Dissipating Part of Semiconductor Chip Package Download PDF

Info

Publication number
KR970018284A
KR970018284A KR1019950033393A KR19950033393A KR970018284A KR 970018284 A KR970018284 A KR 970018284A KR 1019950033393 A KR1019950033393 A KR 1019950033393A KR 19950033393 A KR19950033393 A KR 19950033393A KR 970018284 A KR970018284 A KR 970018284A
Authority
KR
South Korea
Prior art keywords
semiconductor chip
chip package
heat dissipation
molding
die pad
Prior art date
Application number
KR1019950033393A
Other languages
Korean (ko)
Inventor
홍성호
김강수
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950033393A priority Critical patent/KR970018284A/en
Publication of KR970018284A publication Critical patent/KR970018284A/en

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

하부 금형 다이의 상부면으로 돌출되는 고정 핀이 리드프레임의 다이 패드의 고정용 홈에 삽입되도록 하여 반도체 칩 패키지의 성형 수지의 몸체를 성형하는 동안 열 방출부를 고정하여 그 열 방출부가 유동하는 것을 방지함으로써 완성되는 반도체 칩 패키지의 몸체의 외관상 불량 발생이 억제될 수 있다.Fixing pins protruding to the upper surface of the lower mold die are inserted into the fixing grooves of the die pad of the leadframe to fix the heat dissipation portion during molding of the molding resin body of the semiconductor chip package, thereby preventing the heat dissipation portion from flowing. As a result, appearance defects of the body of the semiconductor chip package to be completed can be suppressed.

인쇄회로기판의 BT(Bismaleimide Triazine) 레진상의 금 도금된 다이 패드와, 종래의 접착제 사이에 접착 강화제가 추가로 개재되어 반도체 칩이 그 다이 패드상에 견고하게 접착됨으로써 그 다이 패드와 반도체 칩 사이의 박리가 발생하는 것이 방지되어볼 그리드 패키지의 신뢰성이 향상되는 효과가 있다.The gold-plated die pad on the BT (Bismaleimide Triazine) resin of the printed circuit board and an adhesive enhancer are additionally interposed between the conventional adhesive so that the semiconductor chip is firmly adhered to the die pad, thereby Peeling is prevented from occurring, so that the reliability of the ball grid package is improved.

Description

반도체 칩 패키지의 열 방출부의 유동방지를 위한 성형방법Molding Method for Preventing Flow of Heat Dissipating Part of Semiconductor Chip Package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명에 의한 반도체 칩 패키지의 열 방출부의 유동 방지를 위한 성형방법으로 제조된 반도체 칩 패키지의 구조를 나타낸 단면도,2 is a cross-sectional view showing the structure of a semiconductor chip package manufactured by a molding method for preventing the flow of the heat discharge portion of the semiconductor chip package according to the present invention,

제3도는 본 발명에 의한 반도체 칩 패키지의 열 방출부의 유동 방지를 위한 성형방법에 적용되는 하부 금형 다이에 열 방출부가 놓여진 상태를 나타낸 단면도이다.3 is a cross-sectional view illustrating a state in which a heat dissipation part is placed on a lower die die which is applied to a molding method for preventing flow of the heat dissipation part of a semiconductor chip package according to the present invention.

Claims (4)

하부 금형 다이의 고정 핀에 의하여 열 방출부를 고정하는 단계와, 그 열 방출부상에 리드프레임의 다이패드를 놓는 단계와, 그 열 방출부의 하면이 노출되도록 반도체 칩 패키지의 성형 수지의 몸체를 성형하는 단계를 포함하는 반도체 칩 패키지의 열 방출부의 유동 방지를 위한 성형 방법.Fixing the heat dissipation part by a fixing pin of the lower mold die, placing a die pad of the lead frame on the heat dissipation part, and molding a body of the molding resin of the semiconductor chip package so that the bottom surface of the heat dissipation part is exposed. Forming method for preventing the flow of the heat discharge portion of the semiconductor chip package comprising a step. 제1항에 있어서, 상기 열 방출부의 하면에 상기 고정 핀에 해당하는 고정용 홈이 형성되어 있는 것을 특징으로 하는 반도체 칩 패키지의 열 방출부의 유동 방지를 위한 성형 방법.The molding method of claim 1, wherein a fixing groove corresponding to the fixing pin is formed on a lower surface of the heat dissipating unit. 제1항에 있어서, 상기 성형 단계가 진행되는 동안 성형 수지가 상기 다이 패드와 열 방출부사이에 유입되는 것을 방지하기 위하여 고정 핀이 상기 열 방출부의 하면을 밀어 올리는 것을 특징으로 하는 반도체 칩 패키지의 열 방출부의 유동 방지를 위한 성형 방법.The semiconductor chip package of claim 1, wherein a fixing pin pushes up a lower surface of the heat dissipation part to prevent a molding resin from flowing between the die pad and the heat dissipation part during the molding step. Molding method for preventing the flow of the discharge portion. 제1항에 있어서, 상기 열 방출부의 노출된 하면에 상기 고정 핀에 해당하는 고정용 홈이 노출되어 있는 것을 특징으로 하는 반도체 칩 패키지의 열 방출부의 유동 방지를 위한 성형 방법.The molding method of claim 1, wherein a fixing groove corresponding to the fixing pin is exposed on the exposed lower surface of the heat dissipating unit.
KR1019950033393A 1995-09-30 1995-09-30 Molding Method for Preventing Flow of Heat Dissipating Part of Semiconductor Chip Package KR970018284A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950033393A KR970018284A (en) 1995-09-30 1995-09-30 Molding Method for Preventing Flow of Heat Dissipating Part of Semiconductor Chip Package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950033393A KR970018284A (en) 1995-09-30 1995-09-30 Molding Method for Preventing Flow of Heat Dissipating Part of Semiconductor Chip Package

Publications (1)

Publication Number Publication Date
KR970018284A true KR970018284A (en) 1997-04-30

Family

ID=66582415

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950033393A KR970018284A (en) 1995-09-30 1995-09-30 Molding Method for Preventing Flow of Heat Dissipating Part of Semiconductor Chip Package

Country Status (1)

Country Link
KR (1) KR970018284A (en)

Similar Documents

Publication Publication Date Title
US6869811B2 (en) Methods for transfer molding encapsulation of a semiconductor die with attached heat sink
US5474958A (en) Method for making semiconductor device having no die supporting surface
KR930022534A (en) Thermally Reinforced Semiconductor Device and Manufacturing Method Thereof
KR950001998A (en) Semiconductor device having a small die pad and manufacturing method thereof
US6617525B2 (en) Molded stiffener for flexible circuit molding
US5874783A (en) Semiconductor device having the inner end of connector leads displaced onto the surface of semiconductor chip
JPH098186A (en) Semiconductor integrated circuit device and its manufacture
KR970018284A (en) Molding Method for Preventing Flow of Heat Dissipating Part of Semiconductor Chip Package
KR950025966A (en) Ball Grid Array Leadframe
JPH0846100A (en) Semiconductor integrated circuit device
JPH05102216A (en) Semiconductor device
KR100208471B1 (en) Molding method of bga package with a heat sink
KR200276091Y1 (en) Molding mold for manufacturing ball grid array semiconductor package using flexible circuit board
KR0119757Y1 (en) Semiconductor package
KR0133386Y1 (en) Semiconductor package
KR100197876B1 (en) Semiconductor package and method of manufacturing the same
KR950013049B1 (en) Multi chip loc package
KR19980068771A (en) LOS Type Semiconductor Package
KR200167587Y1 (en) Semiconductor package
JPH0521646A (en) Semiconductor device
KR970013137A (en) Manufacturing method of a multichip package having a chip cavity
KR970030696A (en) Plastic Ball Grid Array Package with Printed Circuit Board with Locking Holes
KR19980026146A (en) Bottom Lead Package for Heat Dissipation
KR20010036276A (en) module
KR19980019660A (en) COB package using printed circuit board to improve adhesion

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination