KR980004169A - IC card with chip embedded in card body - Google Patents

IC card with chip embedded in card body Download PDF

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Publication number
KR980004169A
KR980004169A KR1019960026238A KR19960026238A KR980004169A KR 980004169 A KR980004169 A KR 980004169A KR 1019960026238 A KR1019960026238 A KR 1019960026238A KR 19960026238 A KR19960026238 A KR 19960026238A KR 980004169 A KR980004169 A KR 980004169A
Authority
KR
South Korea
Prior art keywords
card
chip
patterns
card body
chip embedded
Prior art date
Application number
KR1019960026238A
Other languages
Korean (ko)
Inventor
조영래
강사윤
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960026238A priority Critical patent/KR980004169A/en
Publication of KR980004169A publication Critical patent/KR980004169A/en

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Abstract

본 발명은 아이씨 카드에 관한 것으로서, 종래의 카드 몸체에 형성된 홈에 반도체 칩 패키지를 내장하는 대신에 칩 자체를 내장함으로써, 종래의 내장된 반도체 칩 패키지에 사용된 인쇄회로기판의 사용을 생략하고, 아이씨 카드의 제조 공정을 단순화시켜 제조 비용을 절감할 수 있는 장점이 있다.The present invention relates to an IC card, in which a chip itself is embedded in a groove formed in a card body instead of embedding the semiconductor chip package, the use of a printed circuit board used in a conventional embedded semiconductor chip package is omitted, The manufacturing process of the IC card can be simplified and the manufacturing cost can be reduced.

Description

카드 몸체에 칩이 내장된 아이씨 카드IC card with chip embedded in card body

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제1도는 종래 기술에 의한 반도체 칩 패키지가 내장된 아이씨 카드의 단면도.1 is a sectional view of an IC card having a semiconductor chip package according to a related art.

제2도는 본 발명에 의한 칩이 내장된 아이씨 카드의 단면도.FIG. 2 is a sectional view of an IC card having a chip according to the present invention; FIG.

Claims (2)

복수개의 본딩패드를 갖는 칩과; 일면에 홈이 형성되어 있으며, 상기 홈 상면에 상기 칩이 접착되어 있으며, 상기 칩이 접착된 면상 주변에 상기 본딩패드들에 각기 대응되어 전기적으로 연결된 내부 패턴들과, 상기 일면의 홈 주변에 형성된 외부 패턴들, 및 상기 내부 패턴들과 대응된 상기 외부 패턴들을 각기 전기적으로 연결하는 연결 패턴을 포함하는 카드 몸체; 및 상기 칩과 내부 패턴들이 보호되기 위해 봉지하는 성형수지;를 포함하는 것을 특징으로 하는 카드 몸체에 칩이 내장된 아이씨 카드(IC card).A chip having a plurality of bonding pads; Wherein the chip is bonded to the upper surface of the groove and is electrically connected to the bonding pads on the periphery of the bonded chip, A card body including external patterns, and a connection pattern electrically connecting the external patterns corresponding to the internal patterns, respectively; And a molding resin that encapsulates the chip and the inner patterns to be protected. The IC card includes a chip in the card body. 제1항에 있어서, 상기 연결 패턴이 상기 홈의 벽면 상에 구리 도금방법에 의해 형성되는 것을 특징으로 하는 카드 몸체에 칩이 내장된 아이씨 카드.The IC card according to claim 1, wherein the connection pattern is formed on a wall surface of the groove by a copper plating method. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960026238A 1996-06-29 1996-06-29 IC card with chip embedded in card body KR980004169A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960026238A KR980004169A (en) 1996-06-29 1996-06-29 IC card with chip embedded in card body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960026238A KR980004169A (en) 1996-06-29 1996-06-29 IC card with chip embedded in card body

Publications (1)

Publication Number Publication Date
KR980004169A true KR980004169A (en) 1998-03-30

Family

ID=66241434

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960026238A KR980004169A (en) 1996-06-29 1996-06-29 IC card with chip embedded in card body

Country Status (1)

Country Link
KR (1) KR980004169A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100702940B1 (en) * 2000-07-28 2007-04-03 삼성테크윈 주식회사 Integrated circuit card and the fabrication method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100702940B1 (en) * 2000-07-28 2007-04-03 삼성테크윈 주식회사 Integrated circuit card and the fabrication method thereof

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