KR970024063A - Multi-chip package in which circuit wiring is formed on die pad of lead frame - Google Patents
Multi-chip package in which circuit wiring is formed on die pad of lead frame Download PDFInfo
- Publication number
- KR970024063A KR970024063A KR1019950038168A KR19950038168A KR970024063A KR 970024063 A KR970024063 A KR 970024063A KR 1019950038168 A KR1019950038168 A KR 1019950038168A KR 19950038168 A KR19950038168 A KR 19950038168A KR 970024063 A KR970024063 A KR 970024063A
- Authority
- KR
- South Korea
- Prior art keywords
- circuit wiring
- die pad
- chip package
- lead frame
- adhesive
- Prior art date
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
본 발명은 멀티 칩 패키지에 관한 것으로, 더욱 상세하게는 기판의 배선 회로를 리드프레임 제작 시에 리드프레임의 다이패드에 형성하여 패키지 제조 단가를 낮출 수 있게 하고 또한 이에 따른 회로 배선 기판의 삭제로 박형의 패키지를 제조할 수 있는 동시에 작업성이 용이한 패키지를 제조할 수 있는 것이다.The present invention relates to a multi-chip package, and more particularly, to form a wiring circuit of the substrate on the die pad of the lead frame at the time of manufacturing the lead frame to reduce the manufacturing cost of the package and to eliminate the circuit wiring board accordingly It is possible to manufacture a package can be manufactured at the same time easy workability of the package.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제 3A도∼제 3F도는 본 발명에 의한 기판 상의 회로 배선의 형성 단계를 나타내는 공정도,3A to 3F are process drawings showing the step of forming circuit wiring on a substrate according to the present invention;
제 4도는 본 발명에 의한 회로 배선을 리드프레임의 다이패드 상에 형성한 멀티 칩 패키지를 나타내는 단면도.4 is a cross-sectional view showing a multi-chip package in which the circuit wiring according to the present invention is formed on a die pad of a lead frame.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950038168A KR970024063A (en) | 1995-10-30 | 1995-10-30 | Multi-chip package in which circuit wiring is formed on die pad of lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950038168A KR970024063A (en) | 1995-10-30 | 1995-10-30 | Multi-chip package in which circuit wiring is formed on die pad of lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970024063A true KR970024063A (en) | 1997-05-30 |
Family
ID=66584909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950038168A KR970024063A (en) | 1995-10-30 | 1995-10-30 | Multi-chip package in which circuit wiring is formed on die pad of lead frame |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970024063A (en) |
-
1995
- 1995-10-30 KR KR1019950038168A patent/KR970024063A/en not_active Application Discontinuation
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |