KR970022352A - Handler with Multiple Test Structures for Semiconductor Devices - Google Patents

Handler with Multiple Test Structures for Semiconductor Devices Download PDF

Info

Publication number
KR970022352A
KR970022352A KR1019950037825A KR19950037825A KR970022352A KR 970022352 A KR970022352 A KR 970022352A KR 1019950037825 A KR1019950037825 A KR 1019950037825A KR 19950037825 A KR19950037825 A KR 19950037825A KR 970022352 A KR970022352 A KR 970022352A
Authority
KR
South Korea
Prior art keywords
test
semiconductor device
loading unit
defective
handler
Prior art date
Application number
KR1019950037825A
Other languages
Korean (ko)
Inventor
박윤순
오창수
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950037825A priority Critical patent/KR970022352A/en
Publication of KR970022352A publication Critical patent/KR970022352A/en

Links

Abstract

본 발명은 하나의 반도체 장치에 대하여 복수의 특성 테스트를 연속적으로 하나의 설비로 수행할 수 있도록 한 반도체 장치의 다중 테스트 구조를 갖는 핸들러에 관한 것이다.The present invention relates to a handler having a multi-test structure of a semiconductor device, which enables a plurality of characteristic tests to be continuously performed with one facility for one semiconductor device.

본 발명에 따른 반도체 장치의 다중 테스트 구조를 갖는 핸들러는, 자재로딩부; 양품로딩부; 불량품로딩부; 자재로딩부로부터 반도체 장치를 로딩하여 제1자동테스트장치로부터 인가되는 특성 테스트 신호를 이용하여 테스트 공정을 수행하는 제1테스트 사이트; 제1테스트 사이트에서 양품으로 판정된 반도체 장치를 로딩하여 후속 테스트 공정으로 로딩시키기 위하여 임시대기 시키는 버퍼; 및 버퍼에 대기된 반도체 장치를 로딩하여 제2자동테스트장치로부터 인가되는 특성 테스트 신호를 이용하여 테스트 공정을 수행하는 제2테스트 사이트; 를 포함하여 구성됨을 특징으로 한다.A handler having multiple test structures of a semiconductor device according to the present invention includes: a material loading unit; Good quality loading part; Defective product loading unit; A first test site which loads the semiconductor device from the material loading unit and performs a test process using a characteristic test signal applied from the first automatic test apparatus; A buffer which temporarily loads the semiconductor device determined as good at the first test site and waits for loading into a subsequent test process; And a second test site which loads the semiconductor device held in the buffer and performs a test process using the characteristic test signal applied from the second automatic test device. Characterized in that configured to include.

본 발명에 의하면, 만일 설비가 단일화 되며, 작업성이 향상되고, 공정이 효율적으로 수행될 수 있는 효과가 있다.According to the present invention, if the equipment is unified, workability is improved, and the process can be efficiently performed.

Description

반도체 장치의 다중 테스트 구조를 갖는 핸들러Handler with Multiple Test Structures for Semiconductor Devices

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 반도체 장치의 전특성을 테스트하기 위한 종래의 자동테스트 장치에 연결된 핸들러를 나타내는 도면이다,1 is a diagram illustrating a handler connected to a conventional automatic test apparatus for testing all characteristics of a semiconductor device.

제2도는 하나의 반도체 장치에 대하여 각 특성별로 테스트 공정을 수행하기 위한 종래의 다수의 자동테스트장치에 각각 핸들러가 연결된 것을 나타내는 도면이다,FIG. 2 is a diagram illustrating that a handler is connected to a plurality of conventional automatic test apparatuses for performing a test process for each characteristic of one semiconductor device.

제3도는 본 발명에 따른 반도체 장치의 다중 테스트 구조를 갖는 핸들러의 실시예를 나타내는 도면이다.3 is a diagram illustrating an embodiment of a handler having multiple test structures of a semiconductor device according to the present invention.

Claims (1)

복수개의 자동테스트장치로써 하나의 반도체 장치에 대하여 복수의 특성을 테스트하여 양품과 불량품을 구분하여 로딩시키는 반도체 장치의 다중 테스트 구조를 갖는 핸들러에 있어서; 테스트할 반도체 장치를 대기시키는 자재로딩부; 양품으로 판정된 반도체 장치가 로딩되는 양품로딩부; 불량품으로 판정된 반도체 장치가 로딩되는 불량품로딩부; 상기 자재로딩부로부터 상기 반도체 장치를 로딩하여 제1자동 테스트장치로부터 인가되는 특성 테스트 신호를 이용하여 테스트 공정을 거친 후, 상기 반도체 장치가 불량으로 판정되면 상기 불량품로딩부로 로딩시키는 제1테스트 사이트; 상기 제1테스트 사이트에서 양품으로 판정된 상기 반도에 장치를 로딩하여 후속 테스트 공정으로 로딩시키기 위하여 임시대기 시키는 버퍼; 및 상기 버퍼에 대기된 반도체 장치를 로딩하여 제2자동테스트장치로부터 인가되는 특성 테스트 신호를 이용하여 테스트 공정을 거친 후, 불량품이면 상기 불량품로딩부로 로딩하고 양품이면 상기 양품로딩부로 구동시키는 제2테스트 사이트; 를 포함하여 구성됨을 특징으로 하는 반도에 장치의 다중 테스트 구조를 갖는 핸들러.A handler having a multi-test structure of a semiconductor device configured to test a plurality of characteristics with respect to a single semiconductor device using a plurality of automatic test devices to separately load good and defective products; A material loading unit waiting the semiconductor device to be tested; A good quality loading unit into which a semiconductor device judged as good quality is loaded; A defective article loading unit in which a semiconductor device determined as defective is loaded; A first test site which loads the semiconductor device from the material loading unit and performs a test process using a characteristic test signal applied from a first automatic test apparatus, and then loads the semiconductor device into the defective product loading unit if it is determined that the semiconductor device is defective; A buffer for temporarily loading a device on the peninsula determined as good at the first test site for loading into a subsequent test process; And a second test which loads the semiconductor device in the buffer and performs a test process using the characteristic test signal applied from the second automatic test apparatus, and if the defective product is loaded into the defective loading unit, and if the defective product is loaded into the defective loading unit site; Handler having multiple test structures of the device on the peninsula, characterized in that it comprises a. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950037825A 1995-10-28 1995-10-28 Handler with Multiple Test Structures for Semiconductor Devices KR970022352A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950037825A KR970022352A (en) 1995-10-28 1995-10-28 Handler with Multiple Test Structures for Semiconductor Devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950037825A KR970022352A (en) 1995-10-28 1995-10-28 Handler with Multiple Test Structures for Semiconductor Devices

Publications (1)

Publication Number Publication Date
KR970022352A true KR970022352A (en) 1997-05-28

Family

ID=66584880

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950037825A KR970022352A (en) 1995-10-28 1995-10-28 Handler with Multiple Test Structures for Semiconductor Devices

Country Status (1)

Country Link
KR (1) KR970022352A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100361810B1 (en) * 1999-11-12 2002-11-23 미래산업 주식회사 modular RAM mounting test handler and method for testing of modular RAM using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100361810B1 (en) * 1999-11-12 2002-11-23 미래산업 주식회사 modular RAM mounting test handler and method for testing of modular RAM using the same

Similar Documents

Publication Publication Date Title
TW365596B (en) Semiconductor test device
TW369692B (en) Test and burn-in apparatus, in-line system using the apparatus, and test method using the system
US20050083076A1 (en) Dynamically switched voltage screen
MY124258A (en) Method of testing electronic components and testing apparatus for electronic components
KR960019643A (en) Large integrated circuit with modular probe structure
KR950004473A (en) Test method and test system of device under test
KR970022352A (en) Handler with Multiple Test Structures for Semiconductor Devices
BR9712762A (en) Process for testing the reliability of a tester, especially an empty bottle inspection device
KR900000708A (en) Inspection method and device for semiconductor device
KR970067751A (en) Semiconductor inspection device
JPS593371A (en) Testing method of semiconductor device
US20030062917A1 (en) Semiconductor inspection device
KR930006962B1 (en) Semiconductor testing method
JPH10275835A (en) Wafer test device
KR0177987B1 (en) Multiple semiconductor chip test method
KR970016607A (en) Device and method for testing characteristics of semiconductor integrated circuits
KR200146658Y1 (en) Test apparatus for semiconductor device
JPH01167681A (en) Semiconductor product inspection instrument
JPH102935A (en) Ic tester
KR970048553A (en) Electrical die sorting inspection device
JPH01203983A (en) Ic test system
JPS5946561A (en) Inspector for electronic appliance
KR970048540A (en) Control device for testing characteristics of automotive battery and its method
KR960019633A (en) Inking device and bad die inking method on wafer using same
JPH0235382A (en) Preparing method of inspection program for integrated circuit and inspecting method of integrated circuit

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination