KR970022343A - Semiconductor test device that connects power pin of test board with software - Google Patents
Semiconductor test device that connects power pin of test board with software Download PDFInfo
- Publication number
- KR970022343A KR970022343A KR1019950034958A KR19950034958A KR970022343A KR 970022343 A KR970022343 A KR 970022343A KR 1019950034958 A KR1019950034958 A KR 1019950034958A KR 19950034958 A KR19950034958 A KR 19950034958A KR 970022343 A KR970022343 A KR 970022343A
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- South Korea
- Prior art keywords
- test
- control block
- power
- package
- semiconductor
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Abstract
본 발명은 반도체 보드나 패키지를 시험할 때에 시험보드의 전력핀 연결을 소프트웨어적으로 할 수 있게 하는 반도체 시험 장치에 관한 것으로서, 시험받고자 하는 반도체 패키지의 각 입출력핀과 연결되는 입출력 제어 블록; 시험받고자 하는 반도체 패키지의 각 전력핀과 연결되는 전력제어 블록; 및 반도체 패키지의 핀의 용도에 따라 시험장치에서 구동되는 프로그램으로 상기 입출력제어블럭 및 상기 전력제어 블록을 상기 시험받고자 하는 반도체 패키지의 핀에 절환하는 절환부를 포함함을 특징으로 한다.The present invention relates to a semiconductor test apparatus which enables software to connect power pins of a test board when testing a semiconductor board or a package, and includes: an input / output control block connected to each input / output pin of a semiconductor package to be tested; A power control block connected to each power pin of the semiconductor package to be tested; And a switching unit for switching the input / output control block and the power control block to the pins of the semiconductor package to be tested by a program driven by the test apparatus according to the use of the pins of the semiconductor package.
본 발명에 의하면 선연결로 발생되는 저항과 인덕턴스 및 캐패시턴스를 줄여 전력 노이즈 문제가 개선된다. 테스트 장비 개선과 프로그램상에서 제어를 통해 각 제품의 전력핀을 하드웨어적으로 연결할 필요가 없다. 또한 테스트 프로그램만 변경함으로씨 패키지를 시험할 때 동일 형태의 패키지로 제작된 제품을 테스트 보드를 교체하지 않고 사용할 수 있다.According to the present invention, the power noise problem is improved by reducing the resistance, inductance and capacitance generated by the wire connection. Test equipment improvements and programmatic control eliminate the need to hardware-connect each product's power pins. In addition, by changing only the test program, products of the same type can be used to test C package without replacing the test board.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제1도는 종래의 시험보드 제작시 해당 전력핀을 하드웨어적으로 연결하는 방식을 도시한 블록도이다,1 is a block diagram showing a method of connecting the power pin in hardware when manufacturing a conventional test board,
제2도는 본 발명에 의한 시험보드 제작시 해당 전력핀을 소프트웨어적으로 연결하는 방식을 도시한 블록도이다,2 is a block diagram showing a method of connecting a corresponding power pin in software when manufacturing a test board according to the present invention.
제3도는 제2도의 블록도를 보다 상세하게 도시한 상세 블럭도이다.FIG. 3 is a detailed block diagram showing the block diagram of FIG. 2 in more detail.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950034958A KR970022343A (en) | 1995-10-11 | 1995-10-11 | Semiconductor test device that connects power pin of test board with software |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950034958A KR970022343A (en) | 1995-10-11 | 1995-10-11 | Semiconductor test device that connects power pin of test board with software |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970022343A true KR970022343A (en) | 1997-05-28 |
Family
ID=66583709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950034958A KR970022343A (en) | 1995-10-11 | 1995-10-11 | Semiconductor test device that connects power pin of test board with software |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970022343A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100445795B1 (en) * | 1997-06-19 | 2005-05-24 | 삼성전자주식회사 | Semiconductor chip test apparatus |
-
1995
- 1995-10-11 KR KR1019950034958A patent/KR970022343A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100445795B1 (en) * | 1997-06-19 | 2005-05-24 | 삼성전자주식회사 | Semiconductor chip test apparatus |
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| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Withdrawal due to no request for examination |