KR970015322U - Curl block structure of molding die for semiconductor device package process - Google Patents

Curl block structure of molding die for semiconductor device package process

Info

Publication number
KR970015322U
KR970015322U KR2019950024962U KR19950024962U KR970015322U KR 970015322 U KR970015322 U KR 970015322U KR 2019950024962 U KR2019950024962 U KR 2019950024962U KR 19950024962 U KR19950024962 U KR 19950024962U KR 970015322 U KR970015322 U KR 970015322U
Authority
KR
South Korea
Prior art keywords
semiconductor device
molding die
device package
block structure
package process
Prior art date
Application number
KR2019950024962U
Other languages
Korean (ko)
Other versions
KR200202053Y1 (en
Inventor
배태원
조양근
Original Assignee
현대반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대반도체주식회사 filed Critical 현대반도체주식회사
Priority to KR2019950024962U priority Critical patent/KR200202053Y1/en
Publication of KR970015322U publication Critical patent/KR970015322U/en
Application granted granted Critical
Publication of KR200202053Y1 publication Critical patent/KR200202053Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR2019950024962U 1995-09-15 1995-09-15 Cull block structure of molding die for semiconductor device package KR200202053Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950024962U KR200202053Y1 (en) 1995-09-15 1995-09-15 Cull block structure of molding die for semiconductor device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950024962U KR200202053Y1 (en) 1995-09-15 1995-09-15 Cull block structure of molding die for semiconductor device package

Publications (2)

Publication Number Publication Date
KR970015322U true KR970015322U (en) 1997-04-28
KR200202053Y1 KR200202053Y1 (en) 2000-11-15

Family

ID=19423437

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950024962U KR200202053Y1 (en) 1995-09-15 1995-09-15 Cull block structure of molding die for semiconductor device package

Country Status (1)

Country Link
KR (1) KR200202053Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100304921B1 (en) * 1998-12-29 2001-11-02 마이클 디. 오브라이언 structure for mold die in fabrication of semiconductor package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100304921B1 (en) * 1998-12-29 2001-11-02 마이클 디. 오브라이언 structure for mold die in fabrication of semiconductor package

Also Published As

Publication number Publication date
KR200202053Y1 (en) 2000-11-15

Similar Documents

Publication Publication Date Title
KR970015322U (en) Curl block structure of molding die for semiconductor device package process
KR960038721U (en) Semiconductor mold die
KR960038739U (en) Leadframe Positioning Device for Semiconductor Mold Dies
KR960035637U (en) Semiconductor package trim/form process cam block device
KR960029741U (en) Mold for molding semiconductor package
KR970046763U (en) Device for taking out molded products of semiconductor mold
KR970003476A (en) Method of forming junction region of semiconductor device
KR970046939U (en) Molding press molding device for manufacturing semiconductor package
KR970046865U (en) Lead frame transfer device for trim/forming equipment for semiconductor package manufacturing
KR940021340U (en) Upper mold die structure of mold for molding semiconductor package
KR960038740U (en) Lead frame positioning device for semiconductor mold die
KR960035604U (en) Forming device of semiconductor package
KR960027798U (en) Semiconductor package lead forming device
KR970046768U (en) Slush Cutting Molding Device of Ultra-thin Semiconductor Package
KR960035621U (en) Guide package lift guide device of semiconductor package manufacturing mold
KR970025835U (en) Trim die holder for semiconductor package manufacturing equipment
KR970046767U (en) Molding Device for LOC Package
KR970003278U (en) Book mold for semiconductor package molding
KR950021402U (en) Structure of punch part of mold for lead molding of semiconductor package
KR950028718U (en) Center Block of Mold for Molding Semiconductor Package
KR960003103U (en) Mold for molding semiconductor package
KR970046976U (en) Leadframe Structure for Semiconductor Package
KR960035607U (en) Mold for package molding
KR970046937U (en) Mold heating device for molding press for manufacturing semiconductor package
KR950028670U (en) Semiconductor mold die

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090727

Year of fee payment: 10

EXPY Expiration of term