KR960035621U - Guide package lift guide device of semiconductor package manufacturing mold - Google Patents

Guide package lift guide device of semiconductor package manufacturing mold

Info

Publication number
KR960035621U
KR960035621U KR2019950007044U KR19950007044U KR960035621U KR 960035621 U KR960035621 U KR 960035621U KR 2019950007044 U KR2019950007044 U KR 2019950007044U KR 19950007044 U KR19950007044 U KR 19950007044U KR 960035621 U KR960035621 U KR 960035621U
Authority
KR
South Korea
Prior art keywords
guide
package
manufacturing mold
semiconductor package
guide device
Prior art date
Application number
KR2019950007044U
Other languages
Korean (ko)
Other versions
KR0129219Y1 (en
Inventor
박종문
김종환
Original Assignee
아남산업주식회사
아남정공주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아남산업주식회사, 아남정공주식회사 filed Critical 아남산업주식회사
Priority to KR2019950007044U priority Critical patent/KR0129219Y1/en
Publication of KR960035621U publication Critical patent/KR960035621U/en
Application granted granted Critical
Publication of KR0129219Y1 publication Critical patent/KR0129219Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
KR2019950007044U 1995-04-10 1995-04-10 Semiconductor package guide post information system KR0129219Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950007044U KR0129219Y1 (en) 1995-04-10 1995-04-10 Semiconductor package guide post information system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950007044U KR0129219Y1 (en) 1995-04-10 1995-04-10 Semiconductor package guide post information system

Publications (2)

Publication Number Publication Date
KR960035621U true KR960035621U (en) 1996-11-21
KR0129219Y1 KR0129219Y1 (en) 1999-02-01

Family

ID=19410913

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950007044U KR0129219Y1 (en) 1995-04-10 1995-04-10 Semiconductor package guide post information system

Country Status (1)

Country Link
KR (1) KR0129219Y1 (en)

Also Published As

Publication number Publication date
KR0129219Y1 (en) 1999-02-01

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
LAPS Lapse due to unpaid annual fee