KR960035604U - Forming device of semiconductor package - Google Patents
Forming device of semiconductor packageInfo
- Publication number
- KR960035604U KR960035604U KR2019950006870U KR19950006870U KR960035604U KR 960035604 U KR960035604 U KR 960035604U KR 2019950006870 U KR2019950006870 U KR 2019950006870U KR 19950006870 U KR19950006870 U KR 19950006870U KR 960035604 U KR960035604 U KR 960035604U
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor package
- forming device
- package
- semiconductor
- forming
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950006870U KR0127522Y1 (en) | 1995-04-07 | 1995-04-07 | Forming apparatus for semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950006870U KR0127522Y1 (en) | 1995-04-07 | 1995-04-07 | Forming apparatus for semiconductor package |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960035604U true KR960035604U (en) | 1996-11-21 |
KR0127522Y1 KR0127522Y1 (en) | 1998-12-01 |
Family
ID=19410799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950006870U KR0127522Y1 (en) | 1995-04-07 | 1995-04-07 | Forming apparatus for semiconductor package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0127522Y1 (en) |
-
1995
- 1995-04-07 KR KR2019950006870U patent/KR0127522Y1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0127522Y1 (en) | 1998-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
LAPS | Lapse due to unpaid annual fee |