KR960035604U - Forming device of semiconductor package - Google Patents

Forming device of semiconductor package

Info

Publication number
KR960035604U
KR960035604U KR2019950006870U KR19950006870U KR960035604U KR 960035604 U KR960035604 U KR 960035604U KR 2019950006870 U KR2019950006870 U KR 2019950006870U KR 19950006870 U KR19950006870 U KR 19950006870U KR 960035604 U KR960035604 U KR 960035604U
Authority
KR
South Korea
Prior art keywords
semiconductor package
forming device
package
semiconductor
forming
Prior art date
Application number
KR2019950006870U
Other languages
Korean (ko)
Other versions
KR0127522Y1 (en
Inventor
정명국
박종문
Original Assignee
아남산업주식회사
아남정공주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아남산업주식회사, 아남정공주식회사 filed Critical 아남산업주식회사
Priority to KR2019950006870U priority Critical patent/KR0127522Y1/en
Publication of KR960035604U publication Critical patent/KR960035604U/en
Application granted granted Critical
Publication of KR0127522Y1 publication Critical patent/KR0127522Y1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019950006870U 1995-04-07 1995-04-07 Forming apparatus for semiconductor package KR0127522Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950006870U KR0127522Y1 (en) 1995-04-07 1995-04-07 Forming apparatus for semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950006870U KR0127522Y1 (en) 1995-04-07 1995-04-07 Forming apparatus for semiconductor package

Publications (2)

Publication Number Publication Date
KR960035604U true KR960035604U (en) 1996-11-21
KR0127522Y1 KR0127522Y1 (en) 1998-12-01

Family

ID=19410799

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950006870U KR0127522Y1 (en) 1995-04-07 1995-04-07 Forming apparatus for semiconductor package

Country Status (1)

Country Link
KR (1) KR0127522Y1 (en)

Also Published As

Publication number Publication date
KR0127522Y1 (en) 1998-12-01

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
LAPS Lapse due to unpaid annual fee