KR960035637U - Semiconductor package trim/form process cam block device - Google Patents

Semiconductor package trim/form process cam block device

Info

Publication number
KR960035637U
KR960035637U KR2019950007088U KR19950007088U KR960035637U KR 960035637 U KR960035637 U KR 960035637U KR 2019950007088 U KR2019950007088 U KR 2019950007088U KR 19950007088 U KR19950007088 U KR 19950007088U KR 960035637 U KR960035637 U KR 960035637U
Authority
KR
South Korea
Prior art keywords
semiconductor package
block device
cam block
form process
package trim
Prior art date
Application number
KR2019950007088U
Other languages
Korean (ko)
Other versions
KR200201327Y1 (en
Inventor
양성연
Original Assignee
현대반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대반도체주식회사 filed Critical 현대반도체주식회사
Priority to KR2019950007088U priority Critical patent/KR200201327Y1/en
Publication of KR960035637U publication Critical patent/KR960035637U/en
Application granted granted Critical
Publication of KR200201327Y1 publication Critical patent/KR200201327Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019950007088U 1995-04-11 1995-04-11 Cam block apparatus of semiconductor package trim/foam process KR200201327Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950007088U KR200201327Y1 (en) 1995-04-11 1995-04-11 Cam block apparatus of semiconductor package trim/foam process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950007088U KR200201327Y1 (en) 1995-04-11 1995-04-11 Cam block apparatus of semiconductor package trim/foam process

Publications (2)

Publication Number Publication Date
KR960035637U true KR960035637U (en) 1996-11-21
KR200201327Y1 KR200201327Y1 (en) 2000-11-01

Family

ID=19410949

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950007088U KR200201327Y1 (en) 1995-04-11 1995-04-11 Cam block apparatus of semiconductor package trim/foam process

Country Status (1)

Country Link
KR (1) KR200201327Y1 (en)

Also Published As

Publication number Publication date
KR200201327Y1 (en) 2000-11-01

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Legal Events

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E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090727

Year of fee payment: 10

EXPY Expiration of term