KR970005713B1 - Process for correcting warped surface of plastic encapsulated semiconductor device - Google Patents

Process for correcting warped surface of plastic encapsulated semiconductor device Download PDF

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Publication number
KR970005713B1
KR970005713B1 KR93014810A KR930014810A KR970005713B1 KR 970005713 B1 KR970005713 B1 KR 970005713B1 KR 93014810 A KR93014810 A KR 93014810A KR 930014810 A KR930014810 A KR 930014810A KR 970005713 B1 KR970005713 B1 KR 970005713B1
Authority
KR
South Korea
Prior art keywords
semiconductor device
encapsulated semiconductor
plastic encapsulated
warped surface
correcting
Prior art date
Application number
KR93014810A
Other languages
English (en)
Other versions
KR940006253A (ko
Inventor
Hideyuki Nichikawa
Original Assignee
Nec Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Kk filed Critical Nec Kk
Publication of KR940006253A publication Critical patent/KR940006253A/ko
Priority to KR2019940017905U priority Critical patent/KR0139947Y1/ko
Priority to DE69423395T priority patent/DE69423395T2/de
Priority to EP94305576A priority patent/EP0637169B1/en
Priority to US08/283,805 priority patent/US5502487A/en
Priority to JP6180264A priority patent/JPH07154693A/ja
Application granted granted Critical
Publication of KR970005713B1 publication Critical patent/KR970005713B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR93014810A 1992-07-31 1993-07-31 Process for correcting warped surface of plastic encapsulated semiconductor device KR970005713B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR2019940017905U KR0139947Y1 (ko) 1993-07-31 1994-07-19 캠코더의 문자신호 표시장치
DE69423395T DE69423395T2 (de) 1993-07-31 1994-07-28 Zeichensignalanzeige für einen Camcorder
EP94305576A EP0637169B1 (en) 1993-07-31 1994-07-28 Character signal display for a camcorder
US08/283,805 US5502487A (en) 1993-07-31 1994-08-01 Character signal display for a camcorder using existent synchronization signals for character display
JP6180264A JPH07154693A (ja) 1993-07-31 1994-08-01 文字表示装置及びその文字表示方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP20516492 1992-07-31
JP92-205164 1992-07-31

Publications (2)

Publication Number Publication Date
KR940006253A KR940006253A (ko) 1994-03-23
KR970005713B1 true KR970005713B1 (en) 1997-04-19

Family

ID=16502487

Family Applications (1)

Application Number Title Priority Date Filing Date
KR93014810A KR970005713B1 (en) 1992-07-31 1993-07-31 Process for correcting warped surface of plastic encapsulated semiconductor device

Country Status (2)

Country Link
US (1) US5492866A (ko)
KR (1) KR970005713B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110036663A (ko) * 2009-10-02 2011-04-08 신에쓰 가가꾸 고교 가부시끼가이샤 펠리클의 제조 방법

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5622731A (en) * 1993-09-10 1997-04-22 Fierkens; Richard H. J. Automatic post mold curing apparatus for use in providing encapsulated semiconductor chips and method therefor
US6388338B1 (en) * 1995-04-28 2002-05-14 Stmicroelectronics Plastic package for an integrated electronic semiconductor device
JP3093960B2 (ja) * 1995-07-06 2000-10-03 株式会社三井ハイテック 半導体回路素子搭載基板フレームの製造方法
SG66313A1 (en) * 1996-06-20 2001-01-16 Advanced Systems Automation Method and apparatus for reducing warpage in semiconductor
JP3087709B2 (ja) * 1997-12-08 2000-09-11 日本電気株式会社 半導体装置およびその製造方法
US6224936B1 (en) 1998-10-07 2001-05-01 Micron Technology, Inc. Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
US6711947B2 (en) * 2001-06-13 2004-03-30 Rem Scientific Enterprises, Inc. Conductive fluid logging sensor and method
US6988879B2 (en) * 2002-10-18 2006-01-24 Asm Technology Singapore Pte Ltd Apparatus and method for reducing substrate warpage
US7172927B2 (en) * 2003-12-18 2007-02-06 Freescale Semiconductor, Inc. Warpage control of array packaging
US6929485B1 (en) * 2004-03-16 2005-08-16 Agilent Technologies, Inc. Lead frame with interdigitated pins
US7214548B2 (en) * 2004-08-30 2007-05-08 International Business Machines Corporation Apparatus and method for flattening a warped substrate
US7803662B2 (en) * 2007-09-24 2010-09-28 Freescale Semiconductor, Inc. Warpage control using a package carrier assembly
US8642445B2 (en) * 2012-03-29 2014-02-04 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for reducing package warpage
JP7024464B2 (ja) * 2018-02-02 2022-02-24 浜名湖電装株式会社 電気部品製造装置および電気部品の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5655057A (en) * 1979-10-12 1981-05-15 Fujitsu Ltd Manufacture of semiconductor device
JPS6053036A (ja) * 1983-09-02 1985-03-26 Mitsubishi Electric Corp 半導体素子の製造方法
JPS63291419A (ja) * 1987-05-24 1988-11-29 Tatsumo Kk 加熱処理装置
JPS6457630A (en) * 1987-08-28 1989-03-03 Oki Electric Ind Co Ltd Method and device for preventing warpage of semiconductor device
JPH02105447A (ja) * 1988-10-13 1990-04-18 Nec Corp Ｉｃ外部リード曲げ成形金型
JPH02146753A (ja) * 1988-11-28 1990-06-05 Mitsubishi Electric Corp 半導体装置の製造装置
JPH02197399A (ja) * 1989-01-26 1990-08-03 Citizen Watch Co Ltd プレス加工方法とその装置
JP2748629B2 (ja) * 1990-01-22 1998-05-13 住友電気工業株式会社 半導体装置収納用ハウジングおよびその製造方法
JP2899130B2 (ja) * 1991-05-09 1999-06-02 日立テクノエンジニアリング株式会社 高真空ホットプレス

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110036663A (ko) * 2009-10-02 2011-04-08 신에쓰 가가꾸 고교 가부시끼가이샤 펠리클의 제조 방법

Also Published As

Publication number Publication date
KR940006253A (ko) 1994-03-23
US5492866A (en) 1996-02-20

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