KR970003749U - 전자부품 사출물의 결합구조 - Google Patents
전자부품 사출물의 결합구조Info
- Publication number
- KR970003749U KR970003749U KR2019950013971U KR19950013971U KR970003749U KR 970003749 U KR970003749 U KR 970003749U KR 2019950013971 U KR2019950013971 U KR 2019950013971U KR 19950013971 U KR19950013971 U KR 19950013971U KR 970003749 U KR970003749 U KR 970003749U
- Authority
- KR
- South Korea
- Prior art keywords
- electronic parts
- injection structure
- parts injection
- electronic
- parts
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950013971U KR0123227Y1 (ko) | 1995-06-20 | 1995-06-20 | 전자부품 사출물의 결합구조 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950013971U KR0123227Y1 (ko) | 1995-06-20 | 1995-06-20 | 전자부품 사출물의 결합구조 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970003749U true KR970003749U (ko) | 1997-01-24 |
KR0123227Y1 KR0123227Y1 (ko) | 1998-12-15 |
Family
ID=19415958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950013971U KR0123227Y1 (ko) | 1995-06-20 | 1995-06-20 | 전자부품 사출물의 결합구조 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0123227Y1 (ko) |
-
1995
- 1995-06-20 KR KR2019950013971U patent/KR0123227Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0123227Y1 (ko) | 1998-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20020418 Year of fee payment: 5 |
|
LAPS | Lapse due to unpaid annual fee |