KR970003749U - 전자부품 사출물의 결합구조 - Google Patents

전자부품 사출물의 결합구조

Info

Publication number
KR970003749U
KR970003749U KR2019950013971U KR19950013971U KR970003749U KR 970003749 U KR970003749 U KR 970003749U KR 2019950013971 U KR2019950013971 U KR 2019950013971U KR 19950013971 U KR19950013971 U KR 19950013971U KR 970003749 U KR970003749 U KR 970003749U
Authority
KR
South Korea
Prior art keywords
electronic parts
injection structure
parts injection
electronic
parts
Prior art date
Application number
KR2019950013971U
Other languages
English (en)
Other versions
KR0123227Y1 (ko
Inventor
박창원
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR2019950013971U priority Critical patent/KR0123227Y1/ko
Publication of KR970003749U publication Critical patent/KR970003749U/ko
Application granted granted Critical
Publication of KR0123227Y1 publication Critical patent/KR0123227Y1/ko

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/12Resilient or clamping means for holding component to structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
KR2019950013971U 1995-06-20 1995-06-20 전자부품 사출물의 결합구조 KR0123227Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950013971U KR0123227Y1 (ko) 1995-06-20 1995-06-20 전자부품 사출물의 결합구조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950013971U KR0123227Y1 (ko) 1995-06-20 1995-06-20 전자부품 사출물의 결합구조

Publications (2)

Publication Number Publication Date
KR970003749U true KR970003749U (ko) 1997-01-24
KR0123227Y1 KR0123227Y1 (ko) 1998-12-15

Family

ID=19415958

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950013971U KR0123227Y1 (ko) 1995-06-20 1995-06-20 전자부품 사출물의 결합구조

Country Status (1)

Country Link
KR (1) KR0123227Y1 (ko)

Also Published As

Publication number Publication date
KR0123227Y1 (ko) 1998-12-15

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