KR960702784A - 고강도 땜납합금(high strength solder alloy) - Google Patents

고강도 땜납합금(high strength solder alloy)

Info

Publication number
KR960702784A
KR960702784A KR1019950705547A KR19950705547A KR960702784A KR 960702784 A KR960702784 A KR 960702784A KR 1019950705547 A KR1019950705547 A KR 1019950705547A KR 19950705547 A KR19950705547 A KR 19950705547A KR 960702784 A KR960702784 A KR 960702784A
Authority
KR
South Korea
Prior art keywords
solder alloy
strength solder
strength
alloy
high strength
Prior art date
Application number
KR1019950705547A
Other languages
English (en)
Other versions
KR0175079B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR960702784A publication Critical patent/KR960702784A/ko
Application granted granted Critical
Publication of KR0175079B1 publication Critical patent/KR0175079B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1019950705547A 1994-06-13 1995-03-23 고강도 땜납합금 KR0175079B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP6154244A JP3045453B2 (ja) 1994-06-13 1994-06-13 高強度半田合金
JP94-154244 1994-06-13
PCT/JP1995/000531 WO1995034401A1 (fr) 1994-06-13 1995-03-23 Alliage de soudage a haute resistance

Publications (2)

Publication Number Publication Date
KR960702784A true KR960702784A (ko) 1996-05-23
KR0175079B1 KR0175079B1 (ko) 1999-02-18

Family

ID=15579990

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950705547A KR0175079B1 (ko) 1994-06-13 1995-03-23 고강도 땜납합금

Country Status (11)

Country Link
EP (1) EP0748666B1 (ko)
JP (1) JP3045453B2 (ko)
KR (1) KR0175079B1 (ko)
CN (1) CN1124471A (ko)
AU (1) AU679631B2 (ko)
CA (1) CA2162263A1 (ko)
DE (1) DE69512898T2 (ko)
FI (1) FI960630A0 (ko)
RU (1) RU2132265C1 (ko)
TW (1) TW315339B (ko)
WO (1) WO1995034401A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980041034A (ko) * 1996-11-30 1998-08-17 이형도 납함량이 적은 전자부품용 땜납

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6224690B1 (en) * 1995-12-22 2001-05-01 International Business Machines Corporation Flip-Chip interconnections using lead-free solders
US5851482A (en) * 1996-03-22 1998-12-22 Korea Institute Of Machinery & Metals Tin-bismuth based lead-free solder for copper and copper alloys
CN104313390B (zh) * 2014-11-05 2016-09-14 常熟市慧丰塑料制品有限公司 一种高强拉伸索具
CN104985351A (zh) * 2015-06-30 2015-10-21 苏州华日金菱机械有限公司 一种用于较厚板材的焊接焊料
JP6516013B2 (ja) 2015-09-17 2019-05-22 富士電機株式会社 半導体装置用はんだ材
CN105195915B (zh) * 2015-10-30 2017-05-24 苏州优诺电子材料科技有限公司 一种低温无铅焊料合金
CN109923225B (zh) * 2016-09-27 2021-08-10 梅塔洛比利时公司 改进型焊料及用于生产高纯铅的方法
CN106903452A (zh) * 2017-05-02 2017-06-30 泰州朗瑞新能源科技有限公司 一种铸造锡铅焊接材料及其制备方法
CN107984110A (zh) * 2017-11-08 2018-05-04 昆明理工大学 一种低温无铅焊料合金
CN108060329A (zh) * 2017-12-11 2018-05-22 广西趣创想创客空间管理有限责任公司 一种锡锑焊料合金及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2937438A (en) * 1958-07-14 1960-05-24 Lloyd C Lemon Method for joining aluminum to stainless steel
FR1280923A (fr) * 1960-01-30 1962-01-08 Eikasu Kinzokukogyo Kabushiki Soudure résistant à la corrosion pour alliages légers
US3839023A (en) * 1969-07-15 1974-10-01 Redemat Sa Creep resistant lead alloys
JPS5524720A (en) * 1978-08-10 1980-02-22 Asahi Glass Co Ltd Solder for hard-to-solder material
JPS63123594A (ja) * 1986-11-12 1988-05-27 Toshiba Corp 低温接合用合金
JPH02280991A (ja) * 1989-04-19 1990-11-16 Nippon Telegr & Teleph Corp <Ntt> はんだ材料
JPH03188254A (ja) * 1989-12-16 1991-08-16 Mitsubishi Electric Corp はんだめっき銅合金材
RU1785858C (ru) * 1990-04-03 1993-01-07 Ростовский инженерно-строительный институт Припой дл бесфлюсовой пайки алюмини и его сплавов
DE4015574A1 (de) * 1990-05-15 1991-11-21 Vacuumschmelze Gmbh Metallegierung zum hartloeten

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980041034A (ko) * 1996-11-30 1998-08-17 이형도 납함량이 적은 전자부품용 땜납

Also Published As

Publication number Publication date
EP0748666B1 (en) 1999-10-20
FI960630A (fi) 1996-02-12
AU2082595A (en) 1996-01-05
CN1124471A (zh) 1996-06-12
EP0748666A4 (en) 1998-11-11
FI960630A0 (fi) 1996-02-12
TW315339B (ko) 1997-09-11
DE69512898T2 (de) 2000-05-18
DE69512898D1 (de) 1999-11-25
RU2132265C1 (ru) 1999-06-27
AU679631B2 (en) 1997-07-03
EP0748666A1 (en) 1996-12-18
JPH10235491A (ja) 1998-09-08
WO1995034401A1 (fr) 1995-12-21
CA2162263A1 (en) 1995-12-14
KR0175079B1 (ko) 1999-02-18
JP3045453B2 (ja) 2000-05-29

Similar Documents

Publication Publication Date Title
DE69502867D1 (de) Hochfeste Aluminiumlegierung
DE69304231D1 (de) Hochfeste Aluminiumlegierung
GB2319039B (en) Solder alloy
DE69431001D1 (de) Lötpaste
DE69418532D1 (de) Bleifreies, Zinn-Antimon-Wismut-Kupfer-Weichlot
SG54608A1 (en) High strength lead-free solder materials
DE59706801D1 (de) Löt-/entlötvorrichtung
DE69423405D1 (de) Verbinden von Nickel-Titan-Legierungen
DE69523862D1 (de) Bleifreies Weichlot
DE69300010D1 (de) Hochfeste Aluminiumlegierung.
HU9601296D0 (en) Leadless aluminium alloy
IL132555A0 (en) Lead-free solder
KR960701233A (ko) 반고체 처리된 마그네슘-베릴륨 합금(semi-solid processed magnesium-berylliua alloys)
ZA956356B (en) Welding complicated difficult-to-weld metal components
DE69509299D1 (de) Hartlotlegierungspaste
GB9413791D0 (en) Gold alloy
PL306733A1 (en) Copper based alloy
KR960702784A (ko) 고강도 땜납합금(high strength solder alloy)
DE69310954D1 (de) Hochfestige, rasch erstarrte Legierung
DE69708217D1 (de) Hochfeste Aluminiumlegierung
AU5979394A (en) High-strength soldering alloy
DE69325426D1 (de) Lötbare Legierungen
DE69612258D1 (de) Niedrigschmelzende Weichlotlegierung enthaltende Gegenstände
TR27562A (tr) Lehim pastasi.
IL115501A0 (en) Alloy solder clad substrate

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20010727

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee