DE69512898T2 - Hochfeste lötlegierung - Google Patents

Hochfeste lötlegierung

Info

Publication number
DE69512898T2
DE69512898T2 DE69512898T DE69512898T DE69512898T2 DE 69512898 T2 DE69512898 T2 DE 69512898T2 DE 69512898 T DE69512898 T DE 69512898T DE 69512898 T DE69512898 T DE 69512898T DE 69512898 T2 DE69512898 T2 DE 69512898T2
Authority
DE
Germany
Prior art keywords
solder alloy
strength solder
strength
alloy
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69512898T
Other languages
English (en)
Other versions
DE69512898D1 (de
Inventor
Toranosuke Nihon Alm Kawaguchi
Takayuki Nihon Almit C Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Almit Co Ltd
Original Assignee
Nihon Almit Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Almit Co Ltd filed Critical Nihon Almit Co Ltd
Publication of DE69512898D1 publication Critical patent/DE69512898D1/de
Application granted granted Critical
Publication of DE69512898T2 publication Critical patent/DE69512898T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE69512898T 1994-06-13 1995-03-23 Hochfeste lötlegierung Expired - Fee Related DE69512898T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6154244A JP3045453B2 (ja) 1994-06-13 1994-06-13 高強度半田合金
PCT/JP1995/000531 WO1995034401A1 (fr) 1994-06-13 1995-03-23 Alliage de soudage a haute resistance

Publications (2)

Publication Number Publication Date
DE69512898D1 DE69512898D1 (de) 1999-11-25
DE69512898T2 true DE69512898T2 (de) 2000-05-18

Family

ID=15579990

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69512898T Expired - Fee Related DE69512898T2 (de) 1994-06-13 1995-03-23 Hochfeste lötlegierung

Country Status (11)

Country Link
EP (1) EP0748666B1 (de)
JP (1) JP3045453B2 (de)
KR (1) KR0175079B1 (de)
CN (1) CN1124471A (de)
AU (1) AU679631B2 (de)
CA (1) CA2162263A1 (de)
DE (1) DE69512898T2 (de)
FI (1) FI960630A0 (de)
RU (1) RU2132265C1 (de)
TW (1) TW315339B (de)
WO (1) WO1995034401A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11145615B2 (en) 2015-09-17 2021-10-12 Fuji Electric Co., Ltd. Solder material for semiconductor device

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6224690B1 (en) * 1995-12-22 2001-05-01 International Business Machines Corporation Flip-Chip interconnections using lead-free solders
US5851482A (en) * 1996-03-22 1998-12-22 Korea Institute Of Machinery & Metals Tin-bismuth based lead-free solder for copper and copper alloys
KR19980041034A (ko) * 1996-11-30 1998-08-17 이형도 납함량이 적은 전자부품용 땜납
CN104313390B (zh) * 2014-11-05 2016-09-14 常熟市慧丰塑料制品有限公司 一种高强拉伸索具
CN104985351A (zh) * 2015-06-30 2015-10-21 苏州华日金菱机械有限公司 一种用于较厚板材的焊接焊料
CN105195915B (zh) * 2015-10-30 2017-05-24 苏州优诺电子材料科技有限公司 一种低温无铅焊料合金
MY193399A (en) * 2016-09-27 2022-10-11 Metallo Belgium Improved solder and method for producing high purity lead
CN106903452A (zh) * 2017-05-02 2017-06-30 泰州朗瑞新能源科技有限公司 一种铸造锡铅焊接材料及其制备方法
CN107984110A (zh) * 2017-11-08 2018-05-04 昆明理工大学 一种低温无铅焊料合金
CN108060329A (zh) * 2017-12-11 2018-05-22 广西趣创想创客空间管理有限责任公司 一种锡锑焊料合金及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2937438A (en) * 1958-07-14 1960-05-24 Lloyd C Lemon Method for joining aluminum to stainless steel
FR1280923A (fr) * 1960-01-30 1962-01-08 Eikasu Kinzokukogyo Kabushiki Soudure résistant à la corrosion pour alliages légers
US3839023A (en) * 1969-07-15 1974-10-01 Redemat Sa Creep resistant lead alloys
JPS5524720A (en) * 1978-08-10 1980-02-22 Asahi Glass Co Ltd Solder for hard-to-solder material
JPS63123594A (ja) * 1986-11-12 1988-05-27 Toshiba Corp 低温接合用合金
JPH02280991A (ja) * 1989-04-19 1990-11-16 Nippon Telegr & Teleph Corp <Ntt> はんだ材料
JPH03188254A (ja) * 1989-12-16 1991-08-16 Mitsubishi Electric Corp はんだめっき銅合金材
RU1785858C (ru) * 1990-04-03 1993-01-07 Ростовский инженерно-строительный институт Припой дл бесфлюсовой пайки алюмини и его сплавов
DE4015574A1 (de) * 1990-05-15 1991-11-21 Vacuumschmelze Gmbh Metallegierung zum hartloeten

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11145615B2 (en) 2015-09-17 2021-10-12 Fuji Electric Co., Ltd. Solder material for semiconductor device

Also Published As

Publication number Publication date
EP0748666B1 (de) 1999-10-20
AU2082595A (en) 1996-01-05
EP0748666A4 (de) 1998-11-11
TW315339B (de) 1997-09-11
CN1124471A (zh) 1996-06-12
RU2132265C1 (ru) 1999-06-27
FI960630A (fi) 1996-02-12
JPH10235491A (ja) 1998-09-08
WO1995034401A1 (fr) 1995-12-21
KR960702784A (ko) 1996-05-23
DE69512898D1 (de) 1999-11-25
JP3045453B2 (ja) 2000-05-29
EP0748666A1 (de) 1996-12-18
FI960630A0 (fi) 1996-02-12
CA2162263A1 (en) 1995-12-14
AU679631B2 (en) 1997-07-03
KR0175079B1 (ko) 1999-02-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee