KR960036890A - Multiple component supply device of electronic component mounter - Google Patents

Multiple component supply device of electronic component mounter Download PDF

Info

Publication number
KR960036890A
KR960036890A KR1019950007128A KR19950007128A KR960036890A KR 960036890 A KR960036890 A KR 960036890A KR 1019950007128 A KR1019950007128 A KR 1019950007128A KR 19950007128 A KR19950007128 A KR 19950007128A KR 960036890 A KR960036890 A KR 960036890A
Authority
KR
South Korea
Prior art keywords
component
supply
electronic
electronic components
bracket
Prior art date
Application number
KR1019950007128A
Other languages
Korean (ko)
Other versions
KR0140116B1 (en
Inventor
이영일
Original Assignee
배순훈
대우전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 배순훈, 대우전자 주식회사 filed Critical 배순훈
Priority to KR1019950007128A priority Critical patent/KR0140116B1/en
Publication of KR960036890A publication Critical patent/KR960036890A/en
Application granted granted Critical
Publication of KR0140116B1 publication Critical patent/KR0140116B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/028—Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

본 발명은 전자부품 장착기의 다수 전자부품을 선택적으로 공급할 수 있는 다수부품 공급장치에 관한 것으로 그 기술적인 구성은, 구동모터(1)와 연설되어 자유롭게 일정각도 회전토록 베이스부(2) 상측에 설치된 원형테이블(3)의 상측에 방사상으로 다수개 설치되는 부품 공급 브라켓트(4)와, 상기 부품 공급 브라켓트(4) 상측으로 내부에 전자부품(5)이 다수개 적층되는 부품 공급스틱(6)이 각각 입설되며, 상기 부품 고급브라켓트(4)내에 부품 공급스틱(6) 저부가 관통삽입된 하측으로 전자부품(5)을 하나씩 이송하는 이송실린더(7)와, 상기 원형테이블(3)의 일측으로 부품이송실린더(8)가 설치되며, 상기 부품 이성실린더(8) 전방 상측에는 내부에 진공관로(9)가 형성된 흡착판(10)이 착설되어 이송실린더(7)로서 공급되는 전자부품(5)을 흡착하여 노즐장착헤드(11) 위치로 이송하는 부품 이송부(12)로 이루어진다.The present invention relates to a multi-part supply device capable of selectively supplying a plurality of electronic parts of the electronic component mounter, the technical configuration of which is installed above the base part (2) so as to be freely rotated by a predetermined angle to the driving motor (1). A part supply bracket 4 radially installed on the upper side of the circular table 3 and a part supply stick 6 on which a plurality of electronic parts 5 are stacked are disposed above the part supply bracket 4. A transfer cylinder (7) for transferring the electronic components (5) one by one to the lower side through which the bottom of the component supply stick (6) is inserted through the component advanced bracket (4), and the component to one side of the circular table (3). A transfer cylinder 8 is installed, and an adsorption plate 10 having a vacuum pipe 9 formed therein is installed above the front of the component heterocylinder 8 to adsorb the electronic component 5 supplied as the transfer cylinder 7. Nozzle mounting head (1 1) consisting of a component conveying part 12 for transferring to a position.

이에 따라서, 전자부품이 공급되는 원형테이블상에 방사상으로 부품공급 브라켓트를 설치하여 상기 원형 테이블을 회전시켜 다양한 크기를 갖는 전자부품을 선택적으로 공급하여 기판상에 용이하게 장착시킬 수 있게 됨은 물론, 다수의 전자부품 공급에 따른 작업성 및 생산성을 향상시키면서 기판의 정확한 위치에 전자부품의 장착작업이 가능하게 되며, 전자부품 공급의 안정화를 이룩할 수 있는 것이다.Accordingly, by installing a component supply bracket radially on a circular table to which electronic components are supplied, the circular table can be rotated to selectively supply electronic components having various sizes to be easily mounted on a substrate. The workability and productivity according to the supply of electronic components can be improved while mounting the electronic components at the correct position of the substrate, and the stabilization of the electronic components supply can be achieved.

Description

전자부품 장착기의 다수부품 공급장치Multiple component supply device of electronic component mounter

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 따른 전자부품 장착기의 부품 공급장치를 도시한 평면 구성도, 제3도는 제2도의 정면구조도, 제4도는 본 발명인 다수 부품 공급장치의 요부 구조도.2 is a plan view showing a component supply apparatus for an electronic component mount according to the present invention, FIG. 3 is a front structural view of FIG. 2, and FIG. 4 is a main structural view of a multi-part supply apparatus of the present invention.

Claims (2)

구동모터(1)와 연설되어 자유롭게 일정각도 회전토록 베이스부(2) 상측에 설치된 원형테이블(3)의 상측에 방사상으로 다수개 설치되는 부품 공급브라켓트(4)와, 상기 부품 공급 브라켓트(4) 상측으로 내부에 전자부품(5)이 다수개 적층되는 부품 공급스틱(6)이 각각 입설되며, 상기 부품 고급브라켓트(4)내에 부품 공급스틱(6) 저부가 관통삽입된 하측으로 전자부품(5)을 하나씩 이송하는 이송실린더(7)와, 상기 원형테이블(3)의 일측으로 부품이송 실린더(8)가 설치되며, 상기 부품 이성실린더(8) 전방 상측에는 내부에 진공관로(9)가 형성된 흡착판(10)이 착설되어 이송실린더(7)로서 공급되는 전자부품(5)을 흡착하여 노즐장착헤드(11) 위치로 이송하는 부품 이송부(12)를 포함하여 구성됨을 특징으로 하는 전자부품 장착기의 다수부품 공급장치.A part supply bracket 4 radially installed on an upper side of the circular table 3 installed above the base part 2 so as to be freely rotated by a predetermined angle to the drive motor 1, and the part supply bracket 4 The component supply sticks 6 in which a plurality of electronic components 5 are stacked are respectively placed on the upper side, and the electronic component 5 is inserted into the lower part of the component supply stick 6 through the bottom of the component supply stick 6. A transfer cylinder (7) for transporting one by one, and a component transfer cylinder (8) is installed at one side of the circular table (3), and a suction plate having a vacuum tube (9) formed inside the front of the component heterocylinder (8). A plurality of electronic component mounters, comprising a component transfer section 12, which is mounted and transports the electronic component 5 supplied as the transfer cylinder 7 to the nozzle mounting head 11 position. Parts supply. 제1항에 있어서, 상기 부품 공급브라켓트(4) 상측으로 입설되는 부품공급 스틱(6)은, 부품공급 브라켓트(4)상에 지지대(13)를 개재하여 일정각도(θ) 기울어져 입설토록 되는 구성으로 이루어진 것을 특징으로 하는 전자부품 장착기의 다수부품 공급장치.The component supply stick (6) placed above the component supply bracket (4) is inclined at a predetermined angle (θ) on the component supply bracket (4) via a support (13). Multiple component supply apparatus of the electronic component mounting, characterized in that consisting of. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950007128A 1995-03-30 1995-03-30 Supplier for electronic components KR0140116B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950007128A KR0140116B1 (en) 1995-03-30 1995-03-30 Supplier for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950007128A KR0140116B1 (en) 1995-03-30 1995-03-30 Supplier for electronic components

Publications (2)

Publication Number Publication Date
KR960036890A true KR960036890A (en) 1996-10-28
KR0140116B1 KR0140116B1 (en) 1998-08-17

Family

ID=19410984

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950007128A KR0140116B1 (en) 1995-03-30 1995-03-30 Supplier for electronic components

Country Status (1)

Country Link
KR (1) KR0140116B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100724684B1 (en) * 2006-06-23 2007-06-04 동해전장 주식회사 Apparatus for distributing receptacle of relay of junction box

Also Published As

Publication number Publication date
KR0140116B1 (en) 1998-08-17

Similar Documents

Publication Publication Date Title
KR880014855A (en) Component mounting device
JPH09246779A (en) Method and device for attaching parts
JP3659003B2 (en) Electronic component mounting method
KR20000076511A (en) Absorption device
KR100363713B1 (en) Fixture jig for PCB
US6426573B1 (en) Head module having linear motor
KR960036890A (en) Multiple component supply device of electronic component mounter
JPH0330499A (en) Electronic component mounting device
KR930017481A (en) Machine for placing electronic components on a printed circuit board
JPH1070398A (en) Part mounter
KR970061040A (en) Adsorption bit changer
KR0155794B1 (en) Chip mounter
JP2002290098A (en) Electronic component mounter
KR19990086713A (en) Pick-up device
JPH0221229Y2 (en)
KR0151976B1 (en) Nozzle mounting head being able to mount a large number of nozzle mounting at electronc part mounter
CN209777632U (en) Spider hand robot equipment for carrying PCB (printed circuit board)
CN106002230A (en) Automatic screw locking machine
KR20010040454A (en) Component placement apparatus
KR0140257Y1 (en) Supplying device of stud pin for panel
KR920001173B1 (en) Bonding method of semiconductor chip
JPH0846389A (en) Part feeder
KR930000887B1 (en) Small size electronic parts loading device
JP2501085Y2 (en) Chip circuit component mounting device
JP2000103516A (en) Solder ball feeder

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee