KR960032747U - Socket for semiconductor package inspection - Google Patents

Socket for semiconductor package inspection

Info

Publication number
KR960032747U
KR960032747U KR2019950003641U KR19950003641U KR960032747U KR 960032747 U KR960032747 U KR 960032747U KR 2019950003641 U KR2019950003641 U KR 2019950003641U KR 19950003641 U KR19950003641 U KR 19950003641U KR 960032747 U KR960032747 U KR 960032747U
Authority
KR
South Korea
Prior art keywords
socket
semiconductor package
package inspection
inspection
semiconductor
Prior art date
Application number
KR2019950003641U
Other languages
Korean (ko)
Other versions
KR0128245Y1 (en
Inventor
서정윤
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950003641U priority Critical patent/KR0128245Y1/en
Publication of KR960032747U publication Critical patent/KR960032747U/en
Application granted granted Critical
Publication of KR0128245Y1 publication Critical patent/KR0128245Y1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
KR2019950003641U 1995-03-03 1995-03-03 Socket for inspecting semiconductor package KR0128245Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950003641U KR0128245Y1 (en) 1995-03-03 1995-03-03 Socket for inspecting semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950003641U KR0128245Y1 (en) 1995-03-03 1995-03-03 Socket for inspecting semiconductor package

Publications (2)

Publication Number Publication Date
KR960032747U true KR960032747U (en) 1996-10-24
KR0128245Y1 KR0128245Y1 (en) 1998-12-01

Family

ID=19408706

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950003641U KR0128245Y1 (en) 1995-03-03 1995-03-03 Socket for inspecting semiconductor package

Country Status (1)

Country Link
KR (1) KR0128245Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101016019B1 (en) * 2008-09-09 2011-02-23 주식회사 오킨스전자 Burn-In Socket for WELP Type Package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101016019B1 (en) * 2008-09-09 2011-02-23 주식회사 오킨스전자 Burn-In Socket for WELP Type Package

Also Published As

Publication number Publication date
KR0128245Y1 (en) 1998-12-01

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090727

Year of fee payment: 12

EXPY Expiration of term