KR970064186U - Semiconductor package lead inspection device - Google Patents

Semiconductor package lead inspection device

Info

Publication number
KR970064186U
KR970064186U KR2019960013493U KR19960013493U KR970064186U KR 970064186 U KR970064186 U KR 970064186U KR 2019960013493 U KR2019960013493 U KR 2019960013493U KR 19960013493 U KR19960013493 U KR 19960013493U KR 970064186 U KR970064186 U KR 970064186U
Authority
KR
South Korea
Prior art keywords
semiconductor package
inspection device
package lead
lead inspection
semiconductor
Prior art date
Application number
KR2019960013493U
Other languages
Korean (ko)
Other versions
KR200146347Y1 (en
Inventor
김경화
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019960013493U priority Critical patent/KR200146347Y1/en
Publication of KR970064186U publication Critical patent/KR970064186U/en
Application granted granted Critical
Publication of KR200146347Y1 publication Critical patent/KR200146347Y1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR2019960013493U 1996-05-29 1996-05-29 Lead inspection equipment of semiconductor package KR200146347Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019960013493U KR200146347Y1 (en) 1996-05-29 1996-05-29 Lead inspection equipment of semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019960013493U KR200146347Y1 (en) 1996-05-29 1996-05-29 Lead inspection equipment of semiconductor package

Publications (2)

Publication Number Publication Date
KR970064186U true KR970064186U (en) 1997-12-11
KR200146347Y1 KR200146347Y1 (en) 1999-06-15

Family

ID=19457085

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019960013493U KR200146347Y1 (en) 1996-05-29 1996-05-29 Lead inspection equipment of semiconductor package

Country Status (1)

Country Link
KR (1) KR200146347Y1 (en)

Also Published As

Publication number Publication date
KR200146347Y1 (en) 1999-06-15

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