KR960032691A - 압력접촉 하우징 및 파워 반도체부품 - Google Patents

압력접촉 하우징 및 파워 반도체부품 Download PDF

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Publication number
KR960032691A
KR960032691A KR1019950061546A KR19950061546A KR960032691A KR 960032691 A KR960032691 A KR 960032691A KR 1019950061546 A KR1019950061546 A KR 1019950061546A KR 19950061546 A KR19950061546 A KR 19950061546A KR 960032691 A KR960032691 A KR 960032691A
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KR
South Korea
Prior art keywords
gate electrode
pressure contact
contact housing
power semiconductor
housing
Prior art date
Application number
KR1019950061546A
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English (en)
Inventor
볼기아니 파비오
Original Assignee
게르트 릭크
아세아 브라운 보베리 매니지먼트 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 게르트 릭크, 아세아 브라운 보베리 매니지먼트 악티엔게젤샤프트 filed Critical 게르트 릭크
Publication of KR960032691A publication Critical patent/KR960032691A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Thyristors (AREA)

Abstract

반도체부품용 압력접촉 하우징에 있어서, 게이트전극 접촉링(4)이 나선형 리세스(5)를 갖는다. 상기 나선형 리세스는 하우징의 조립중에 일어나는 축방향 움직임을, 부재에 하중을 가하지 않고서 흡수할 수가 있다. 따라서, 게이트전극과 게이트 전극 접촉링 간에 양호한, 내구성을 갖는 전지접점이 이루어진다.

Description

압력접촉 하우징 및 파워 반도체부품
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 게이트전극 접촉링의 평면도.

Claims (4)

  1. 제1 및 제2주전극과 게이트전극을 가지며, 그 제1 및 제2주전극은 두 개의접촉플런저(3)사이에 배열되어 이 플런저에 의해 압력을 받고, 게이트전극은 하우징 밖으로 통하는 게이트전극 접촉링(4)에 접속되는 반도체부품용 압력접촉 하우징(1)에 있어서, 게이트전극 접촉링(4)이 나선형 리세스(5)를 갖는 것을 특징으로 하는 압력접촉 하우징.
  2. 제1항에 있어서, 상기 리세스(5)의 가장자리가 인벌류우트 서클을 따라 진행하는 것을 특징으로 하는 압력접촉 하우징.
  3. 제2항에 있어서, 상기 리세스의 가장자리의 인벌류우트가 원호에 근접하는 것을 특징으로 하는 압력접촉 하우징.
  4. 파워 반도체부품에 있어서, 제1항 내지 제3항 중 어느 한 항에 따른 하우징을 포함하는 것을 특징으로 하는 파워 반도체부품.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950061546A 1995-02-17 1995-12-28 압력접촉 하우징 및 파워 반도체부품 KR960032691A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19505387A DE19505387A1 (de) 1995-02-17 1995-02-17 Druckkontaktgehäuse für Halbleiterbauelemente
DE19505387.7 1995-02-17

Publications (1)

Publication Number Publication Date
KR960032691A true KR960032691A (ko) 1996-09-17

Family

ID=7754241

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950061546A KR960032691A (ko) 1995-02-17 1995-12-28 압력접촉 하우징 및 파워 반도체부품

Country Status (6)

Country Link
US (1) US5739556A (ko)
EP (1) EP0729179B1 (ko)
JP (1) JPH08241956A (ko)
KR (1) KR960032691A (ko)
CN (1) CN1073286C (ko)
DE (2) DE19505387A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19711965C2 (de) * 1997-03-21 1999-01-14 Siemens Ag Vorrichtung zur niederinduktiven Anbindung eines abschaltbaren Thyristors an seine Ansteuereinrichtung
JP3344552B2 (ja) * 1997-09-17 2002-11-11 株式会社東芝 圧接型半導体装置
US6081039A (en) * 1997-12-05 2000-06-27 International Rectifier Corporation Pressure assembled motor cube
JP3480901B2 (ja) * 1998-06-18 2003-12-22 株式会社東芝 圧接形半導体素子および電力変換装置
JP4129082B2 (ja) * 1998-07-30 2008-07-30 三菱電機株式会社 圧接型半導体装置及びそのリング状ゲート端子並びに電力応用装置
US6423988B1 (en) 1998-09-10 2002-07-23 Mitsubishi Denki Kabushiki Kaisha Pressure-contact semiconductor device
US6445013B1 (en) * 2000-04-13 2002-09-03 Mitsubishi Denki Kabushiki Kaisha Gate commutated turn-off semiconductor device
US7132698B2 (en) * 2002-01-25 2006-11-07 International Rectifier Corporation Compression assembled electronic package having a plastic molded insulation ring
WO2013038493A1 (ja) * 2011-09-13 2013-03-21 トヨタ自動車株式会社 半導体モジュール
WO2014184061A1 (en) * 2013-05-13 2014-11-20 Abb Technology Ag Spacer system for a semiconductor switching device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL270438A (ko) * 1960-11-02 1900-01-01
GB1465328A (en) * 1973-06-19 1977-02-23 Westinghouse Electric Corp Compression bond assembly for a planar semiconductor device
US4238761A (en) * 1975-05-27 1980-12-09 Westinghouse Electric Corp. Integrated gate assisted turn-off, amplifying gate thyristor with narrow lipped turn-off diode
US4092703A (en) * 1977-03-15 1978-05-30 Kabushiki Kaisha Meidensha Gate controlled semiconductor device
DE3118365A1 (de) * 1981-05-08 1982-11-25 Siemens AG, 1000 Berlin und 8000 München Thyristor mit in den emitter eingefuegten steuerbaren emitter-kurzschlusspfaden
US4529999A (en) * 1982-07-09 1985-07-16 Motorola, Inc. Gate controlled switch
JPS60194565A (ja) * 1984-03-15 1985-10-03 Mitsubishi Electric Corp 半導体装置
JPS61113249A (ja) * 1984-11-08 1986-05-31 Mitsubishi Electric Corp 半導体装置
DE3880730D1 (de) * 1987-03-25 1993-06-09 Bbc Brown Boveri & Cie Halbleiterbauelement mit einer steuerelektrode.
JPH0760893B2 (ja) * 1989-11-06 1995-06-28 三菱電機株式会社 半導体装置およびその製造方法
DE4227063A1 (de) * 1992-08-15 1994-02-17 Abb Research Ltd Abschaltbares Hochleistungs-Halbleiterbauelement

Also Published As

Publication number Publication date
EP0729179B1 (de) 2000-07-05
DE59605529D1 (de) 2000-08-10
CN1136221A (zh) 1996-11-20
EP0729179A1 (de) 1996-08-28
CN1073286C (zh) 2001-10-17
DE19505387A1 (de) 1996-08-22
JPH08241956A (ja) 1996-09-17
US5739556A (en) 1998-04-14

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