KR960019619A - Semiconductor chip feeder - Google Patents

Semiconductor chip feeder Download PDF

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Publication number
KR960019619A
KR960019619A KR1019950039798A KR19950039798A KR960019619A KR 960019619 A KR960019619 A KR 960019619A KR 1019950039798 A KR1019950039798 A KR 1019950039798A KR 19950039798 A KR19950039798 A KR 19950039798A KR 960019619 A KR960019619 A KR 960019619A
Authority
KR
South Korea
Prior art keywords
needle
semiconductor chip
die
resin
collect
Prior art date
Application number
KR1019950039798A
Other languages
Korean (ko)
Other versions
KR0172024B1 (en
Inventor
다까끼미 지바
Original Assignee
가네꼬 히사시
닛본덴기 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가네꼬 히사시, 닛본덴기 가부시끼가이샤 filed Critical 가네꼬 히사시
Publication of KR960019619A publication Critical patent/KR960019619A/en
Application granted granted Critical
Publication of KR0172024B1 publication Critical patent/KR0172024B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Abstract

수지 박판으로부터 떼어내어진 반도체 칩을 다이 본더내에 포함된 스테이지로 이송하기 위한 장치가 개봉되었다. 본 장치는 칩을 미세 파손으로부터 방지하면서 다이 본더의 작동율을 향상시킨다.An apparatus for transferring a semiconductor chip removed from a resin thin plate to a stage included in a die bonder has been opened. The device improves the operation rate of the die bonder while preventing the chip from micro breakage.

Description

반도체 칩 이송 장치Semiconductor chip feeder

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명은 실시하는 반도체 칩 이송 장치의 도면.2 is a diagram of a semiconductor chip transfer device of the present invention.

Claims (2)

반도체 칩 이송 장치에 있어서, 앞면에 수직 및 수평 배열로 다수의 반도체 칩을 접착하기 위한 접착제가 도포되어 있고, 뒷면에는 도전 박막이 접착된 수지 박판; 상기 수지 박판에 접착된 다수의 반도체 칩을 둘러싸면서 상기 수지 박판의 가장자리를 잡아당겨서 수지 박판이 느슨해지는 것을 방지하기 위한 프레임 부재; 상기 프레임 부재를 지지하는 지지대; 상기 지지대 아래에 배치되며, 다수의 반도체 칩을 상기 수지 박판으로부터 한번에 하나씩 떼어내기 위해 소정의 높이까지 위로 이동가능한 니들; 상기 니들을 상하로 이동시키는 니들 구동 장치; 상기 니들에 의해 위로 융기된 상기 반도체 칩을, 진공에 의해 고정시키기 위한 다이 콜렉트를 상하로 이동시키는 콜렉트 구동 장치; 상기 니들이 상기 수지 박판의 상기 도전 박막과 접촉하는 것을 표시하는 신호를 출력하는 회로; 및 상기 회로부터 출력된 상기 신호에 응답하여 상기 다이 콜렉트를 상기 다이 콜렉트가 반도체칩의 상단부와 접촉할 때까지 내리면서 상기 니들이 위로 융기하는 것을 막고, 반도체 칩의 두께와 상기 다이 콜렉트의 바닥면의 높이를 더함으로써 높이를 계산하고, 다시 이전에 계산된 상기 니들이 상기 수직 박판 및 상기 도전 박막을 관통하여서 반도체 칩의 하단면과 접촉하게 되는 상기 위치로 상기 니들을 위로 융기시키고, 상기 니들 및 상기 다이 콜렉트가 반도체 칩을 그 사이에 끼운채로 소정의 위치로 들어올리게 하는 제어기를 포함하는 것을 특징으로 하는 반도체 칩 이송 장치.A semiconductor chip conveying apparatus, comprising: an adhesive for applying a plurality of semiconductor chips in a vertical and horizontal arrangement on a front surface thereof, and a resin thin plate on which a conductive thin film is adhered; A frame member for enclosing a plurality of semiconductor chips bonded to the resin thin plates and pulling the edges of the resin thin plates to prevent the resin thin plates from loosening; A support for supporting the frame member; A needle disposed below the support and movable up to a predetermined height to separate a plurality of semiconductor chips one at a time from the resin sheet; A needle driving device for moving the needle up and down; A collect drive device for moving a die collect up and down to fix the semiconductor chip raised up by the needle by vacuum; A circuit for outputting a signal indicating that the needle is in contact with the conductive thin film of the thin resin plate; And in response to the signal output from the circuit, preventing the needle from rising upward while lowering the die collect until the die collect contacts the upper end of the semiconductor chip, the thickness of the semiconductor chip and the bottom surface of the die collect. Calculate the height by adding the height, and again raise the needle to the position where the previously calculated needle penetrates the vertical thin plate and the conductive thin film and comes into contact with the bottom surface of the semiconductor chip, and the needle and the die And a controller for collecting the semiconductor chip to a predetermined position while sandwiching the semiconductor chip therebetween. 제1항에 있어서, 상기 융기가 정지한 후에는 상기 니들이 정지하기 전보다 낮은 속력으로 융기되는 것을 특징으로 하는 반도체 칩 이송 장치.2. The semiconductor chip transfer device according to claim 1, wherein after the bumping stops, the needle is raised at a lower speed than before the needle stops. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950039798A 1994-11-04 1995-11-04 Semiconductor chip mounter KR0172024B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-270923 1994-11-04
JP27092394A JP2658915B2 (en) 1994-11-04 1994-11-04 Semiconductor chip transfer equipment

Publications (2)

Publication Number Publication Date
KR960019619A true KR960019619A (en) 1996-06-17
KR0172024B1 KR0172024B1 (en) 1999-03-30

Family

ID=17492879

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950039798A KR0172024B1 (en) 1994-11-04 1995-11-04 Semiconductor chip mounter

Country Status (2)

Country Link
JP (1) JP2658915B2 (en)
KR (1) KR0172024B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100368625B1 (en) * 1999-06-17 2003-01-24 가부시키가이샤 신가와 Die holding mechanism, die packing device and die bonding apparatus

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JP4860274B2 (en) * 2006-01-24 2012-01-25 Ｊｕｋｉ株式会社 Wafer supply device thrust pin speed measuring device and surface mount device
JP5021548B2 (en) * 2008-04-08 2012-09-12 リンテック株式会社 Sheet peeling apparatus and peeling method
JP5627362B2 (en) * 2010-09-16 2014-11-19 富士機械製造株式会社 Die supply device
CN103220886B (en) * 2013-04-09 2015-10-21 阳程（佛山）科技有限公司 A kind of flexible PCB lamination patch machine and processing technology thereof
JP6563325B2 (en) * 2015-12-14 2019-08-21 株式会社ディスコ Pickup device
WO2017138102A1 (en) * 2016-02-10 2017-08-17 富士機械製造株式会社 Holding plate, detection method, and die supply device
CN108281373B (en) * 2017-12-15 2020-07-07 华灿光电（浙江）有限公司 Pickup device of light emitting diode chip
EP3998127A4 (en) 2019-08-26 2023-08-16 LINTEC Corporation Method of manufacturing laminate
US11600516B2 (en) * 2020-05-13 2023-03-07 Asmpt Singapore Pte. Ltd. Die ejector height adjustment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100368625B1 (en) * 1999-06-17 2003-01-24 가부시키가이샤 신가와 Die holding mechanism, die packing device and die bonding apparatus

Also Published As

Publication number Publication date
JPH08139114A (en) 1996-05-31
KR0172024B1 (en) 1999-03-30
JP2658915B2 (en) 1997-09-30

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