CN215988720U - Embedded structure of integrated circuit chip - Google Patents

Embedded structure of integrated circuit chip Download PDF

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Publication number
CN215988720U
CN215988720U CN202122302824.2U CN202122302824U CN215988720U CN 215988720 U CN215988720 U CN 215988720U CN 202122302824 U CN202122302824 U CN 202122302824U CN 215988720 U CN215988720 U CN 215988720U
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China
Prior art keywords
chip
baffle
integrated circuit
fixed
sliding
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CN202122302824.2U
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Chinese (zh)
Inventor
丁长兵
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Shenzhen Ruijiaxin Technology Co ltd
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Shenzhen Ruijiaxin Technology Co ltd
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Abstract

The utility model discloses an internal embedding structure of an integrated circuit chip, which comprises an integrated circuit board, wherein an embedding baffle is fixedly arranged on the upper surface of the integrated circuit board, a chip is movably arranged on the inner side of the embedding baffle, a moving groove is formed in the upper surface of the chip, a pinching piece is fixedly arranged on the inner side of the moving groove, and a fixed clamping rail is formed in the lower surface of the chip. Through the return spring who sets up, can press the baffle downwards when needs are installed the chip, make the baffle descend, install the back to the chip, produce reaction force to the cardboard, make the baffle resume position originally, cardboard through setting up, can block inside the mounting groove, can not lead to the baffle to take place to drop because of return spring's reason, the baffle can block a side surface of installation after installing the chip, can prevent dropping of chip, No. two return springs can press the transfer line and make its removal after the inboard, can produce reaction force, make it resume position originally.

Description

Embedded structure of integrated circuit chip
Technical Field
The utility model belongs to the technical field of integrated circuit chips, and particularly relates to an internal embedding structure of an integrated circuit chip.
Background
The integrated circuit chip is an electronic element comprising a silicon substrate, at least one circuit, a fixed seal ring, a grounding ring and at least one protective ring, wherein the circuit is formed on the silicon substrate and is provided with at least one output/input pad. The fixed seal ring is formed on the silicon substrate and surrounds the circuit and the input/output pad. The grounding ring is formed between the silicon substrate and the input/output pad and is electrically connected with the fixed seal ring. The protective ring is disposed on the silicon substrate and surrounds the I/O pads for electrical connection with the seal ring, and the IC chip is mounted on the circuit board by soldering.
For example, a method for mounting an ic chip disclosed in chinese patent publication No. CN201010232714.7 includes preparing a plurality of ic chips, the back surfaces of which are attached to the surface of a mounting tape; printing a conductive bump on a chip connection point of an integrated circuit chip; sticking a glue film on the front surface of the integrated circuit chip; tearing off the mounting adhesive tape; separating the integrated circuit chip to be mounted from the adhesive film, sucking the integrated circuit chip from the back side and conveying the integrated circuit chip to the substrate, and enabling the chip connecting point with the conductive bump on the front side of the integrated circuit chip to be in press fit connection with the welding spot on the substrate. The mounting method has high efficiency, long connecting wires are omitted from the product obtained by the method, the product can have an extremely small physical size, the production cost can be greatly reduced, and the connection reliability can be enhanced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an internal embedding structure of an integrated circuit chip, and aims to solve the problems that the chip is inconvenient to mount and the traditional mounting mode is not solved, the chip is inconvenient to maintain and replace after the chip is damaged in use, and the chip is inconvenient to protect in the prior mounting method of the integrated circuit chip in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides an embedded structure in integrated circuit chip, includes integrated circuit board, integrated circuit board upper surface fixed mounting has the baffle of inlaying, inlay the inboard movable mounting of baffle and have the chip, the shifting chute has been seted up to the chip upper surface, the inboard fixed mounting of shifting chute has the piece of kneading dough, the fixed card rail has been seted up to the chip lower surface.
Specifically, through the integrated circuit board that sets up, can install inlaying the baffle, thereby can make the chip install in the inboard of inlaying the baffle, the maintenance change in the later stage of being convenient for and the protection to the chip, the shifting chute can be installed nipping the piece, can clip it through the piece of nipping the piece that sets up through devices such as tweezers, be convenient for dismantle the installation of chip, and can not lead to the fact the harm to the body of chip, the fixing clip rail can be fixed it after the chip is installed and is inlayed the baffle inboard, can not make it take place to rock and influence the use inlaying the baffle inside.
Preferably, the integrated circuit board is internally provided with a mounting groove, and the upper surface of the mounting groove is provided with a sliding track.
Specifically, through the mounting groove that sets up, can install mounting structure such as return spring and cardboard, also can not occupy more ground spaces simultaneously, can not influence the use of device, can make the baffle slide on its surface through the slip track that sets up, be convenient for to the installation of chip.
Preferably, a return spring is fixedly mounted on the lower surface of the mounting groove, a clamping plate is fixedly mounted at one end of the return spring, and a baffle is fixedly mounted on the upper surface of the clamping plate.
Specifically, through the return spring who sets up, can press the baffle downwards when needs are installed the chip, make the baffle descend, install the back to the chip, produce the reaction force to the cardboard, make the baffle resume original position, through the cardboard that sets up, can block inside the mounting groove, can not lead to the baffle to take place to drop because of return spring's reason, the baffle can block a side surface of installation after installing the chip, can prevent dropping of chip.
Preferably, a fixed plate is fixedly mounted on the surface of one side of the embedded baffle, a sliding rail is arranged on the surface of the fixed plate, and a sliding groove is formed in the fixed plate.
Specifically, the fixed plate can be fixed to one side of inlaying the baffle, can prevent that the chip from coming off from inlaying the baffle inboard, through the slide rail that sets up, can make the transfer line slide in its inboard, is convenient for adjust the position of fixing clip pole, and the inside sliding base of being convenient for of slip recess removes.
Preferably, a clamping hole is formed in the surface of one side of the sliding groove, and a sliding base is movably mounted inside the sliding groove.
The clamping device comprises a clamping rod, a clamping column, a sliding base, a clamping rod, a fixing structure and a clamping hole, wherein the clamping column is clamped in the clamping hole, the sliding base cannot fall due to gravity, and therefore the effect of the fixing clamping rod is affected, the sliding base can be used for installing a transmission adjusting device, and the fixing structure can be used normally.
Preferably, a sliding hole is formed in the sliding base, a connecting plate is fixedly mounted on the lower surface of the sliding base, and a fixing clamping rod is fixedly mounted on the upper surface of the connecting plate.
The utility model discloses a chip fixing device, including fixing clamp rod, slide hole, connecting plate, fixing base, connecting plate, fixing clamp rod, fixing base, connecting plate, fixing base, connecting plate, fixing clamp rod, fixing base, fixing clamp rod, and fixing clamp rod, and fixing rod and fixing device and fixing rod.
Preferably, the inside movable mounting of sliding hole has the card post, card post one side fixed surface installs No. two return spring, card post fixed surface installs the transfer line, the atress recess has been seted up on the transfer line surface.
The clamping column can be clamped in the clamping hole, the sliding base can be integrally in a fixed state after the fixing clamping rod moves to the fixing clamping rail, the transmission rod can be pressed inwards and moved through the arranged second return spring, reaction force can be generated, the transmission rod is restored to the original position, and the stressed groove enables a user to press inwards to enable the transmission rod to move normally.
Compared with the prior art, the utility model has the beneficial effects that:
1. through the return spring who sets up, can press the baffle downwards when needs are installed the chip, make the baffle descend, install the back to the chip, produce reaction force to the cardboard, make the baffle resume original position, through the cardboard that sets up, can block inside the mounting groove, can not lead to the baffle to take place to drop because of return spring's reason, the baffle can block a side surface of installation after installing the chip, can prevent dropping of chip.
2. The sliding hole that sets up can make the card post slide at its inside under the effect of transfer line to can make the card post drop from the card hole, thereby can drive the sliding base and remove, carry out the transmission to the connecting plate simultaneously, thereby drive the fixing clip pole and remove in the fixing clip rail, thereby fix the chip, can carry out normal connection transmission to the fixing clip pole through the connecting plate that sets up, it is very convenient to use.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a partial schematic structural view of the present invention;
FIG. 3 is a schematic view of the overall structure of one side of the present invention;
FIG. 4 is an enlarged view of a portion of the structure of the present invention;
fig. 5 is a schematic cross-sectional view of the overall structure of the present invention.
In the figure: 1. an integrated circuit board; 2. embedding a baffle; 3. a chip; 4. a moving groove; 5. kneading the sheet; 6. fixing the clamping rail; 101. mounting grooves; 102. a sliding track; 103. a return spring; 104. clamping a plate; 105. a baffle plate; 201. a fixing plate; 202. a slide rail; 203. a sliding groove; 204. a clamping hole; 205. a slide base; 206. a slide hole; 207. a connecting plate; 208. fixing the clamping rod; 209. clamping the column; 210. a second return spring; 211. a transmission rod; 212. a force-bearing groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: the utility model provides an embedded structure in integrated circuit chip, includes integrated circuit board 1, and fixed surface installs and inlays baffle 2 on integrated circuit board 1, inlays 2 inboard movable mounting of baffle and has chip 3, and the shifting chute 4 has been seted up to chip 3 upper surface, and 4 inboard fixed mounting in shifting chute have the piece 5 of kneading the heart, and fixed card rail 6 has been seted up to 3 lower surfaces of chip.
In this embodiment, through integrated circuit board 1 that sets up, can install inlaying baffle 2, thereby can make chip 3 install the inboard at inlaying baffle 2, the maintenance in the later stage of being convenient for is changed and the protection to chip 2, shifting chute 4 can install piece 5 of kneading dough, piece 5 of kneading dough through setting can be cliied it through devices such as tweezers, be convenient for dismantle the installation of chip 3, and can not lead to the fact the harm to the body of chip 3, fixed card rail 6 can be installed at chip 3 and inlay 2 inboard back with it fixed, can not make it take place to rock and influence the use inlaying baffle 2 inside.
Wherein, in order to realize the purpose of being convenient for install in the use, this device adopts following technical scheme to realize: the integrated circuit board 1 is internally provided with a mounting groove 101, the upper surface of the mounting groove 101 is provided with a sliding rail 102, mounting structures such as a return spring 103 and a clamping plate 104 can be mounted through the arranged mounting groove 101, and meanwhile, the mounting structure does not occupy more space, the baffle 105 can slide on the surface of the sliding rail 102, so that the chip 3 can be conveniently mounted, the lower surface of the mounting groove 101 is fixedly provided with the return spring 103, one end of the return spring 103 is fixedly provided with the clamping plate 104, the upper surface of the clamping plate 104 is fixedly provided with the baffle 105, the baffle 105 can be pressed downwards when the chip 3 needs to be mounted through the arranged return spring 103, so that the baffle 105 descends, after the chip 3 is mounted, a reaction force is generated on the clamping plate 104, the baffle 105 is restored to the original position, and can be clamped inside the mounting groove 101 through the arranged clamping plate 104, the baffle 105 will not fall off due to the return spring 103, and the baffle 105 can block one side surface of the chip 3 after the chip is mounted, so as to prevent the chip 3 from falling off.
Wherein, in order to realize carrying out the fixed purpose of protection to the chip after the installation, this device adopts following technical scheme to realize: inlay 2 side fixed surface of baffle and have fixed plate 201, slide rail 202 has been seted up on fixed plate 201 surface, fixed plate 201 has seted up inside slip recess 203, fixed plate 201 can be fixed one side of inlaying baffle 2, can prevent that chip 3 from inlaying 2 inboard drops of baffle, slide rail 202 through setting up, can make transfer line 211 slide in it inboard, be convenient for adjust the position of fixing clip pole 208, slip recess 203 is convenient for inside sliding base 205 to remove, slip recess 203 a side surface has seted up calorie hole 204, the inside movable mounting of slip recess 203 has sliding base 205, through the calorie hole 204 that sets up, can make calorie post 209 card wherein, can not make sliding base 205 because the reason of gravity takes place to drop, thereby influence fixing clip pole 208's effect.
Wherein, in order to realize fixing the chip, prevent to take place the purpose of rocking in the use, this device adopts following technical scheme to realize: the inner part of the sliding base 205 is provided with a sliding hole 206, the lower surface of the sliding base 205 is fixedly provided with a connecting plate 207, the upper surface of the connecting plate 207 is fixedly provided with a fixed clamping rod 208, the sliding hole 206 can enable a clamping column 209 to slide in the sliding base under the action of a transmission rod 211, so that the clamping column 209 can fall off from the clamping hole 204, the sliding base 205 can be driven to move, meanwhile, the connecting plate 207 is driven, so that the fixed clamping rod 208 is driven to move into a fixed clamping rail, so that the chip 3 is fixed, the fixed clamping rod 208 can be normally connected and driven through the arranged connecting plate 207, the use is very convenient, the clamping column 209 is movably arranged in the sliding hole 206, the surface of one side of the clamping column 209 is fixedly provided with a second return spring 210, the surface of the clamping column 209 is fixedly provided with a transmission rod 211, the surface of the transmission rod 211 is provided with a stress groove 212, and the clamping column 209 can be clamped in the clamping hole 204, the sliding base 205 can be in a fixed state after the fixing clip rod 208 moves to the fixing clip rail 6, and a reaction force can be generated by the second return spring 210 after the transmission rod 211 is pressed inwards and moved, so that the transmission rod 211 can be restored to the original position, and the stressed groove 212 is convenient for a user to press inwards to enable the transmission rod 211 to move normally.
The working principle and the using process of the utility model are as follows: when the utility model is used, the installation structures such as the return spring 103 and the clamping plate 104 can be installed through the installation groove 101, and simultaneously, no more space is occupied, the baffle 105 can slide on the surface of the installation structure through the arranged sliding rail 102, so that the chip 3 is convenient to install, the baffle 105 can be pressed downwards through the arranged return spring 103 when the chip 3 needs to be installed, so that the baffle 105 descends, after the chip 3 is installed, the baffle 104 generates a reaction force, so that the baffle 105 is restored to the original position, the baffle 105 can be clamped in the installation groove 101 through the arranged clamping plate 104, the baffle 105 cannot fall off due to the return spring 103, the baffle 105 can block one side surface of the installation structure after the chip 3 is installed, so that the chip 3 can be prevented from falling, the sliding hole 206 can enable the clamping column 209 to slide in the installation structure under the action of the transmission rod 211, thereby can make card post 209 drop from calorie hole 204 to can drive sliding base 205 and remove, carry out the transmission to connecting plate 207 simultaneously, thereby drive fixing clip pole 208 and remove to the fixing clip rail in, thereby fix chip 3.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. An embedded structure in integrated circuit chip, includes integrated circuit board (1), its characterized in that: fixed surface installs on integrated circuit board (1) and inlays baffle (2), it has chip (3) to inlay baffle (2) inboard movable mounting, shifting chute (4) have been seted up to chip (3) upper surface, shifting chute (4) inboard fixed mounting has piece (5) of kneading dough, chip (3) lower surface has seted up fixing clip rail (6).
2. The damascene structure of claim 1, wherein: the integrated circuit board is characterized in that a mounting groove (101) is formed in the integrated circuit board (1), and a sliding track (102) is formed in the upper surface of the mounting groove (101).
3. The damascene structure of claim 2, wherein: the mounting groove (101) lower surface fixed mounting has return spring (103), return spring (103) one end fixed mounting has cardboard (104), fixed surface installs baffle (105) on cardboard (104).
4. The damascene structure of claim 1, wherein: fixed plate (201) is installed to inlay baffle (2) one side fixed surface, slide rail (202) have been seted up on fixed plate (201) surface, sliding groove (203) have been seted up to fixed plate (201) inside.
5. The damascene structure of claim 4, wherein: the surface of one side of the sliding groove (203) is provided with a clamping hole (204), and a sliding base (205) is movably arranged in the sliding groove (203).
6. The structure of claim 5, wherein: slide opening (206) have been seted up to sliding base (205) inside, sliding base (205) lower fixed surface installs connecting plate (207), fixed surface installs fixed clamping bar (208) on connecting plate (207).
7. The structure of claim 6, wherein: inside movable mounting of sliding hole (206) has card post (209), card post (209) one side fixed surface installs No. two return spring (210), card post (209) fixed surface installs transfer line (211), atress recess (212) have been seted up on transfer line (211) surface.
CN202122302824.2U 2021-09-23 2021-09-23 Embedded structure of integrated circuit chip Active CN215988720U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122302824.2U CN215988720U (en) 2021-09-23 2021-09-23 Embedded structure of integrated circuit chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122302824.2U CN215988720U (en) 2021-09-23 2021-09-23 Embedded structure of integrated circuit chip

Publications (1)

Publication Number Publication Date
CN215988720U true CN215988720U (en) 2022-03-08

Family

ID=80464675

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122302824.2U Active CN215988720U (en) 2021-09-23 2021-09-23 Embedded structure of integrated circuit chip

Country Status (1)

Country Link
CN (1) CN215988720U (en)

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