KR960015612U - 디바이스 로딩장치 - Google Patents
디바이스 로딩장치Info
- Publication number
- KR960015612U KR960015612U KR2019940026108U KR19940026108U KR960015612U KR 960015612 U KR960015612 U KR 960015612U KR 2019940026108 U KR2019940026108 U KR 2019940026108U KR 19940026108 U KR19940026108 U KR 19940026108U KR 960015612 U KR960015612 U KR 960015612U
- Authority
- KR
- South Korea
- Prior art keywords
- loading
- loading device
- device loading
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Specific Conveyance Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940026108U KR200177249Y1 (ko) | 1994-10-06 | 1994-10-06 | 디바이스 로딩장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940026108U KR200177249Y1 (ko) | 1994-10-06 | 1994-10-06 | 디바이스 로딩장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960015612U true KR960015612U (ko) | 1996-05-17 |
KR200177249Y1 KR200177249Y1 (ko) | 2000-04-15 |
Family
ID=19394967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019940026108U KR200177249Y1 (ko) | 1994-10-06 | 1994-10-06 | 디바이스 로딩장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR200177249Y1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100708433B1 (ko) * | 2006-03-06 | 2007-04-18 | 삼정엔지니어링 (주) | 기기에 카드를 장착하기 위한 카드장착유닛 및 이를 이용한카드장착방법 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100869533B1 (ko) * | 2007-06-04 | 2008-11-19 | 최인혁 | 봉지 자동 공급장치 |
-
1994
- 1994-10-06 KR KR2019940026108U patent/KR200177249Y1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100708433B1 (ko) * | 2006-03-06 | 2007-04-18 | 삼정엔지니어링 (주) | 기기에 카드를 장착하기 위한 카드장착유닛 및 이를 이용한카드장착방법 |
Also Published As
Publication number | Publication date |
---|---|
KR200177249Y1 (ko) | 2000-04-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20041230 Year of fee payment: 6 |
|
LAPS | Lapse due to unpaid annual fee |