KR960012387A - 큐어장치 - Google Patents

큐어장치 Download PDF

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Publication number
KR960012387A
KR960012387A KR1019950024074A KR19950024074A KR960012387A KR 960012387 A KR960012387 A KR 960012387A KR 1019950024074 A KR1019950024074 A KR 1019950024074A KR 19950024074 A KR19950024074 A KR 19950024074A KR 960012387 A KR960012387 A KR 960012387A
Authority
KR
South Korea
Prior art keywords
sample
gas supply
casing
heating chamber
chamber casing
Prior art date
Application number
KR1019950024074A
Other languages
English (en)
Other versions
KR0172004B1 (ko
Inventor
미츠오 아라이
도시하루 스가누마
Original Assignee
후지야마 겐지
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지야마 겐지, 가부시키가이샤 신가와 filed Critical 후지야마 겐지
Publication of KR960012387A publication Critical patent/KR960012387A/ko
Application granted granted Critical
Publication of KR0172004B1 publication Critical patent/KR0172004B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
    • F26B15/10—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions
    • F26B15/12—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/18—Drying solid materials or objects by processes involving the application of heat by conduction, i.e. the heat is conveyed from the heat source, e.g. gas flame, to the materials or objects to be dried by direct contact
    • F26B3/20—Drying solid materials or objects by processes involving the application of heat by conduction, i.e. the heat is conveyed from the heat source, e.g. gas flame, to the materials or objects to be dried by direct contact the heat source being a heated surface, e.g. a moving belt or conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microbiology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Drying Of Solid Materials (AREA)
  • Die Bonding (AREA)

Abstract

시료의 반송불량이 생겼을때 시료제거, 반송와이어 절단의 경우의 반송와이어의 교환작업, 반송와이어 및 히트블록의 청소작업등을 단시간에 능률좋게 행한다.
시료를 가열하기 위한 복수개의 히트블록을 내부에 갖는 시료가열실용 케이싱(4)과, 시료가열실용 케이싱(4)상에 설치되고, 상기 히트블록에 대응하여 형성된 가스공급 슬릿 형성판의 가스공급슬릿을 통하여 히트블록상에 고온가스를 공급하는 가스공급실용 케이싱(5)을 가지고, 가스공급실용 케이싱(5)을 시료가열실용 케이싱(4)에 대하여 개폐가 자유롭게 구성하였다.

Description

큐어장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 큐어장치의 일실시예를 나타내는 정면도.
제2도는 좌측면도.
제3도는 평면도.
제4도는 케이싱부분의 종단면도.

Claims (1)

  1. 리드프레임에 페이스트를 통하여 칩이 본딩된 시료의 상기 페이스트를 건조시키는 큐어장치에 있어서, 상기 시료반송방향으로 간극을 가지고 설치되고, 상기 시료를 가열하기 위한 복수개의 히트블록을 내부에 갖는 시료가열실용 케이싱과, 이 시료가열실용 케이싱상에 설치되고, 상기 히트블록에 대응하여 가스공급슬릿이 형성된 가스공급슬릿 형성판을 가지고, 상기 가스공급슬릿을 통하여 상기 히트블록상에 고온가스를 공급하는 가스공급실용 케이싱과, 상기 시료를 상기 각 히트블록상에 순차적으로 재치되도록 반송하는 반송수단과, 상기 시료가열실용 케이싱에서 발생하는 유해가스를 배기하는 배기관을 구비하고 있고, 상기 가스공급실용 케이싱은 상기 시료가열실용 케이싱에 대하여 개폐가 자유롭게 구성되어 있는 것을 특징으로 하는 큐어장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950024074A 1994-09-05 1995-08-04 큐어장치 KR0172004B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-235895 1994-09-05
JP6235895A JPH0878443A (ja) 1994-09-05 1994-09-05 キュア装置

Publications (2)

Publication Number Publication Date
KR960012387A true KR960012387A (ko) 1996-04-20
KR0172004B1 KR0172004B1 (ko) 1999-03-30

Family

ID=16992838

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950024074A KR0172004B1 (ko) 1994-09-05 1995-08-04 큐어장치

Country Status (4)

Country Link
US (1) US5697777A (ko)
JP (1) JPH0878443A (ko)
KR (1) KR0172004B1 (ko)
TW (1) TW303983U (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009070963A (ja) * 2007-09-12 2009-04-02 Nidec Tosok Corp ヒートレール構造
BE1019531A5 (nl) * 2010-10-08 2012-08-07 Clercq Stefaan Dirk De Drooginrichting.
CN110227653A (zh) * 2018-09-27 2019-09-13 上海冠镁智能物流科技有限公司 一种高效物流柔性分拣装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5154604A (en) * 1990-04-23 1992-10-13 Kabushiki Kaisha Shinkawa Curing apparatus
JP2841136B2 (ja) * 1991-10-15 1998-12-24 株式会社新川 キュア装置
JP2922726B2 (ja) * 1992-07-01 1999-07-26 株式会社フジタ 掘削機のバケット誘導システム

Also Published As

Publication number Publication date
US5697777A (en) 1997-12-16
JPH0878443A (ja) 1996-03-22
TW303983U (en) 1997-04-21
KR0172004B1 (ko) 1999-03-30

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