KR960012347A - 피가공물의 표면 광택처리 방법 및 장치 - Google Patents

피가공물의 표면 광택처리 방법 및 장치 Download PDF

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Publication number
KR960012347A
KR960012347A KR1019950029477A KR19950029477A KR960012347A KR 960012347 A KR960012347 A KR 960012347A KR 1019950029477 A KR1019950029477 A KR 1019950029477A KR 19950029477 A KR19950029477 A KR 19950029477A KR 960012347 A KR960012347 A KR 960012347A
Authority
KR
South Korea
Prior art keywords
workpiece
surface gloss
gloss processing
processing
gloss
Prior art date
Application number
KR1019950029477A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR960012347A publication Critical patent/KR960012347A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1019950029477A 1994-09-08 1995-09-11 피가공물의 표면 광택처리 방법 및 장치 KR960012347A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24064294 1994-09-08

Publications (1)

Publication Number Publication Date
KR960012347A true KR960012347A (ko) 1996-04-20

Family

ID=17062541

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950029477A KR960012347A (ko) 1994-09-08 1995-09-11 피가공물의 표면 광택처리 방법 및 장치

Country Status (2)

Country Link
US (1) US5651724A (ko)
KR (1) KR960012347A (ko)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6024630A (en) 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
JP3724869B2 (ja) * 1995-10-09 2005-12-07 株式会社荏原製作所 ポリッシング装置および方法
JP3129172B2 (ja) * 1995-11-14 2001-01-29 日本電気株式会社 研磨装置及び研磨方法
USRE38854E1 (en) * 1996-02-27 2005-10-25 Ebara Corporation Apparatus for and method for polishing workpiece
JP3183388B2 (ja) * 1996-07-12 2001-07-09 株式会社東京精密 半導体ウェーハ研磨装置
US5769692A (en) * 1996-12-23 1998-06-23 Lsi Logic Corporation On the use of non-spherical carriers for substrate chemi-mechanical polishing
EP0868973B1 (en) * 1997-02-04 2003-06-25 Ebara Corporation Workpiece holding device and polishing apparatus therewith
JPH10235552A (ja) * 1997-02-24 1998-09-08 Ebara Corp ポリッシング装置
US6120352A (en) * 1997-03-06 2000-09-19 Keltech Engineering Lapping apparatus and lapping method using abrasive sheets
US5967882A (en) * 1997-03-06 1999-10-19 Keltech Engineering Lapping apparatus and process with two opposed lapping platens
US5910041A (en) * 1997-03-06 1999-06-08 Keltech Engineering Lapping apparatus and process with raised edge on platen
US6149506A (en) * 1998-10-07 2000-11-21 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
US6077385A (en) * 1997-04-08 2000-06-20 Ebara Corporation Polishing apparatus
US5868609A (en) * 1997-04-14 1999-02-09 I C Mic-Process, Inc. Wafer carrier rotating head assembly for chemical-mechanical polishing apparatus
US5885135A (en) * 1997-04-23 1999-03-23 International Business Machines Corporation CMP wafer carrier for preferential polishing of a wafer
US5882243A (en) * 1997-04-24 1999-03-16 Motorola, Inc. Method for polishing a semiconductor wafer using dynamic control
JP3231659B2 (ja) 1997-04-28 2001-11-26 日本電気株式会社 自動研磨装置
US5964653A (en) 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
WO1999009588A1 (en) * 1997-08-21 1999-02-25 Memc Electronic Materials, Inc. Method of processing semiconductor wafers
US6080040A (en) * 1997-11-05 2000-06-27 Aplex Group Wafer carrier head with inflatable bladder and attack angle control for polishing
US6142857A (en) * 1998-01-06 2000-11-07 Speedfam-Ipec Corporation Wafer polishing with improved backing arrangement
US6102777A (en) * 1998-03-06 2000-08-15 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
JPH11300608A (ja) * 1998-04-20 1999-11-02 Nec Corp 化学機械研磨装置
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
US6089960A (en) * 1998-06-03 2000-07-18 One Source Manufacturing Semiconductor wafer polishing mechanism
US6145849A (en) * 1998-11-18 2000-11-14 Komag, Incorporated Disk processing chuck
US6113466A (en) * 1999-01-29 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for controlling polishing profile in chemical mechanical polishing
US6276998B1 (en) * 1999-02-25 2001-08-21 Applied Materials, Inc. Padless substrate carrier
US6645050B1 (en) * 1999-02-25 2003-11-11 Applied Materials, Inc. Multimode substrate carrier
US6231428B1 (en) 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6368189B1 (en) 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
EP1283089A3 (en) * 1999-03-26 2003-03-26 Ibiden Co., Ltd. Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
US6203408B1 (en) * 1999-08-26 2001-03-20 Chartered Semiconductor Manufacturing Ltd. Variable pressure plate CMP carrier
US6325696B1 (en) 1999-09-13 2001-12-04 International Business Machines Corporation Piezo-actuated CMP carrier
US6585572B1 (en) * 2000-08-22 2003-07-01 Lam Research Corporation Subaperture chemical mechanical polishing system
US6540590B1 (en) 2000-08-31 2003-04-01 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a rotating retaining ring
US6527625B1 (en) 2000-08-31 2003-03-04 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a soft backed polishing head
JP3969069B2 (ja) * 2000-12-04 2007-08-29 株式会社東京精密 ウェーハ研磨装置
US6612590B2 (en) * 2001-01-12 2003-09-02 Tokyo Electron Limited Apparatus and methods for manipulating semiconductor wafers
JP3294600B1 (ja) * 2001-02-28 2002-06-24 不二越機械工業株式会社 ウェーハの研磨装置
US6786809B1 (en) * 2001-03-30 2004-09-07 Cypress Semiconductor Corp. Wafer carrier, wafer carrier components, and CMP system for polishing a semiconductor topography
US6910949B1 (en) * 2001-04-25 2005-06-28 Lam Research Corporation Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers
US6761619B1 (en) * 2001-07-10 2004-07-13 Cypress Semiconductor Corp. Method and system for spatial uniform polishing
US20060180486A1 (en) * 2003-04-21 2006-08-17 Bennett David W Modular panel and storage system for flat items such as media discs and holders therefor
US9199354B2 (en) * 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313284A (en) * 1980-03-27 1982-02-02 Monsanto Company Apparatus for improving flatness of polished wafers
US4918869A (en) * 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
JPH073634Y2 (ja) * 1987-12-28 1995-01-30 株式会社トムコ ウェハ液洗乾燥装置
JPH079896B2 (ja) * 1988-10-06 1995-02-01 信越半導体株式会社 研磨装置
EP0408499A3 (en) * 1989-07-13 1992-08-19 Ciba-Geigy Ag Method of conditioning organic pigments
JPH0691522A (ja) * 1992-09-09 1994-04-05 Hitachi Ltd 研磨装置
JP3370112B2 (ja) * 1992-10-12 2003-01-27 不二越機械工業株式会社 ウエハーの研磨装置
US5449316A (en) * 1994-01-05 1995-09-12 Strasbaugh; Alan Wafer carrier for film planarization

Also Published As

Publication number Publication date
US5651724A (en) 1997-07-29

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