KR960009127A - 민감한 집적회로 소자에 대한 신호를 향상시키기 위하여 외부 기억 커패시터를 가진 집적회로 패키지 - Google Patents
민감한 집적회로 소자에 대한 신호를 향상시키기 위하여 외부 기억 커패시터를 가진 집적회로 패키지 Download PDFInfo
- Publication number
- KR960009127A KR960009127A KR1019950025872A KR19950025872A KR960009127A KR 960009127 A KR960009127 A KR 960009127A KR 1019950025872 A KR1019950025872 A KR 1019950025872A KR 19950025872 A KR19950025872 A KR 19950025872A KR 960009127 A KR960009127 A KR 960009127A
- Authority
- KR
- South Korea
- Prior art keywords
- integrated circuit
- external memory
- memory capacitors
- sensitive
- enhance signals
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29408094A | 1994-08-22 | 1994-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR960009127A true KR960009127A (ko) | 1996-03-22 |
Family
ID=23131800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950025872A KR960009127A (ko) | 1994-08-22 | 1995-08-22 | 민감한 집적회로 소자에 대한 신호를 향상시키기 위하여 외부 기억 커패시터를 가진 집적회로 패키지 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5598035A (ko) |
| JP (1) | JPH08172160A (ko) |
| KR (1) | KR960009127A (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100772670B1 (ko) * | 2001-12-28 | 2007-11-02 | 다이니폰 인사츠 가부시키가이샤 | 전자파 차폐용 시트 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6049470A (en) * | 1997-05-30 | 2000-04-11 | Dalsa, Inc. | Package with reticulated bond shelf |
| US6067594A (en) | 1997-09-26 | 2000-05-23 | Rambus, Inc. | High frequency bus system |
| TW583405B (en) * | 2002-12-23 | 2004-04-11 | Via Tech Inc | Signal detection method suitable for integrated circuit chip |
| US20060077002A1 (en) * | 2004-10-08 | 2006-04-13 | White Richard T | Apparatus and methods for saving power and reducing noise in integrated circuits |
| US8866556B2 (en) | 2009-02-27 | 2014-10-21 | Analog Bits, Inc. | Phase shift phase locked loop |
| WO2012083086A1 (en) | 2010-12-15 | 2012-06-21 | Analog Bits, Inc. | Encoder/decoder for balanced transmission of variables over few multi-variable channels |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4551746A (en) * | 1982-10-05 | 1985-11-05 | Mayo Foundation | Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation |
| US5388028A (en) * | 1993-07-28 | 1995-02-07 | Kaman Electromagnetics Corporation | Low impedance interconnection assembly for high frequency switching power semiconductor devices and low inductance modular capacitor |
-
1995
- 1995-08-21 JP JP7234770A patent/JPH08172160A/ja active Pending
- 1995-08-22 KR KR1019950025872A patent/KR960009127A/ko not_active Application Discontinuation
-
1996
- 1996-04-29 US US08/639,721 patent/US5598035A/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100772670B1 (ko) * | 2001-12-28 | 2007-11-02 | 다이니폰 인사츠 가부시키가이샤 | 전자파 차폐용 시트 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08172160A (ja) | 1996-07-02 |
| US5598035A (en) | 1997-01-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |