KR960002575A - Metal wiring formation method of semiconductor device - Google Patents
Metal wiring formation method of semiconductor device Download PDFInfo
- Publication number
- KR960002575A KR960002575A KR1019940014820A KR19940014820A KR960002575A KR 960002575 A KR960002575 A KR 960002575A KR 1019940014820 A KR1019940014820 A KR 1019940014820A KR 19940014820 A KR19940014820 A KR 19940014820A KR 960002575 A KR960002575 A KR 960002575A
- Authority
- KR
- South Korea
- Prior art keywords
- metal wiring
- semiconductor device
- forming
- photosensitive film
- formation method
- Prior art date
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- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
본 발명은 반도체 소자의 금속배선 형성방법에 관한 것으로, 안정된 형상(profile)을 갖는 금속배선을 형성하기 위하여, 패턴화된 감광막을 이용한 금속층 식각시 주식각공정(main etch step)에서 Cℓ2와 BCℓ3개스 비율을 1:1로 하고, 과도식각공정(over etch step)에서 RF 레벨을 주식각공정보다 200~300W 상향 조정하여, 금속배선에서 발생되는 브릿지(bridge)현상 및 넥킹(necking)을 방지하므로써 안정된 형상을 갖는 금속배선을 형성하는 방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming metal wirings in a semiconductor device. In order to form metal wirings having a stable profile, Cl 2 and BCl in a main etch step in etching a metal layer using a patterned photosensitive film The ratio of 3 gas is 1: 1, and the RF level is increased 200 ~ 300W from the stock etching process in the over etch step to prevent bridge phenomenon and necking occurring in the metal wiring. Therefore, the present invention relates to a method of forming a metal wiring having a stable shape.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2A도 내지 제2D도는 본 발명에 의한 반도체 소자의 금속배선 형성방법을 설명하기 위한 소자의 단면도.2A to 2D are cross-sectional views of a device for explaining a method for forming metal wirings of a semiconductor device according to the present invention.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940014820A KR100284142B1 (en) | 1994-06-27 | 1994-06-27 | Metal wiring formation method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940014820A KR100284142B1 (en) | 1994-06-27 | 1994-06-27 | Metal wiring formation method of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960002575A true KR960002575A (en) | 1996-01-26 |
KR100284142B1 KR100284142B1 (en) | 2001-04-02 |
Family
ID=66686448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940014820A KR100284142B1 (en) | 1994-06-27 | 1994-06-27 | Metal wiring formation method of semiconductor device |
Country Status (1)
Country | Link |
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KR (1) | KR100284142B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101011531B1 (en) * | 2008-11-24 | 2011-01-27 | 이수정 | A structural to sepatating the storeroom of a refrigerator |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100450567B1 (en) * | 2001-12-26 | 2004-09-30 | 동부전자 주식회사 | Method for manufacturing line |
-
1994
- 1994-06-27 KR KR1019940014820A patent/KR100284142B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101011531B1 (en) * | 2008-11-24 | 2011-01-27 | 이수정 | A structural to sepatating the storeroom of a refrigerator |
Also Published As
Publication number | Publication date |
---|---|
KR100284142B1 (en) | 2001-04-02 |
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E701 | Decision to grant or registration of patent right | ||
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