KR960000215B1 - Ic cad type package - Google Patents

Abstract

a base film of insulating quality; a metal wire which is exposed to the outer part of the card body and is fabricated on one side of the base film; a device hole which is formulated by eliminating the base film for the purpose of the metal wire being exposed; a semiconductor chip which is equipped on the metal wire exposed by the device hole; a slot exposing the axis of the metal wire by eliminating a base film of the device hole side; wires which connects a metal wire exposed by the slot with a bonding pads of a semiconductor chip; a package body formed by the molding method for the purpose of protecting the metal wire surface exposed by eliminating the semiconductor chip, wire and the base film.

Description

Semiconductor Packages for Integrated Circuit Cards

1 is a plan view of a typical integrated circuit card.

2 (a) and 2 (b) are partial cross-sectional views of an integrated circuit card and a cross-sectional view of one embodiment of a semiconductor package according to the prior art.

3 (a) and 3 (b) are a partial cross-sectional view of an integrated circuit card according to the prior art and a cross-sectional view of another embodiment of a semiconductor package.

4 is a partial cross-sectional view of an integrated circuit card on which a semiconductor package of another embodiment according to the prior art is mounted.

5 (a) and 5 (b) are a plan view of a tape carrier and a package state used in the semiconductor package of FIG.

6 is a schematic diagram illustrating a reel-to-reel mounting method using the tape carrier of FIG.

7 is a partial cross-sectional view of an integrated circuit card according to the present invention.

8 is a bottom view of the strip used in the semiconductor package of FIG.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package for an integrated circuit (hereinafter referred to as an IC) card, and more particularly to forming a tape carrier in a strip shape capable of mounting a plurality of semiconductor chips and forming a package body by a molding process. The present invention relates to a semiconductor package for an IC card that can reduce manufacturing costs and improve reliability.

In general, a semiconductor chip such as an IC or a large scale IC is sealed in a package and mounted on a printed circuit board (hereinafter, referred to as a PCB). The basic type of the package is that the chip is mounted on a die pad, which is a heat dissipating metal plate, and bonding pads and leads of the chip are connected by bonding wires, and an epoxy molding compound (hereinafter referred to as EMC) by a molding process. The molded body is protected by wrapping the chip and the wire. Since a large amount of heat is generated in the chip as the signal processing speed and power consumption of the chip are increased, a separate heat sink is attached to the package in order to dissipate the heat, or the package body is formed of a material having high thermal conductivity. In addition, as the chip becomes more versatile, a package having various functions is required. The method of stacking semiconductor chips and packages according to the requirements of high-density packaging, or the direct connection of semiconductor chips with internal leads. Five. Seed on chip (LOC) or seed. Five. A chip on lead (COL) method and a semiconductor chip directly mounted on a printed circuit board (hereinafter referred to as a PCB). Five. The method of chip (chip on board, hereinafter referred to as COB) has been studied.

According to the above trend, many kinds of semiconductor packages, for example, tee. cue. F. Thin Quad Flat Package (hereinafter referred to as TQFP); s. Five. Packages such as Thin Small Out Line Package (hereinafter referred to as TSOP) and Tab (TAB) Tape Automated Bonding (TAB) have been developed. Packages such as TQFP and TSOP can be manufactured using existing package assembly processes such as wire bonding, molding and trimming.

However, in the tab package, a metal pattern serving as a lead frame and a wire is formed on an insulating base film, and the metal pattern on the base film and the bonding pad of the semiconductor chip are formed by a bump made of a conductive material. It is a kind of surface-mounted package technology that is bonded and is completely different from the conventional method of using a bonding wire. It is widely used in small calculators, liquid crystal displays, and notebook computers. have.

According to the development of various packages as described above, the use of products using semiconductor packages is diversified, and among them, IC cards are recently attracting attention. The IC card is a credit card or a child. As a card capable of providing data about an individual mainly, such as an ID card, such as an ID card, such as an identification card, and providing a code number, a program, and an ID code for proving the identity of the person. Compared to the magnetic card, the manufacturing cost is high, but a large amount of information can be easily and quickly inputted and outputted by the voltage applied to the IC, and above all, the reliability of the operation is high. .

1 is a plan view of a general IC card 10. As shown in FIG.

A rectangular card body 11 is formed of a plastic material, and a recess 12 is formed at one side of the card body 11, and a semiconductor chip for input / output (not shown) is set on the recess 12. The semiconductor package 13 is mounted so as to close the opening of the groove 12. The card number display part 15 is formed in the lower part of the other side of the said card main body 11 by punching, and the memo part 17 which is roughly surface-treated is formed in the upper part, and an IC card is provided between them. An arrow 19 indicating the insertion direction of 10 is printed.

Looking at the semiconductor package for the IC card according to the prior art in detail as follows.

2 (a) and 2 (b) are partial cross-sectional views of an integrated circuit card and a cross-sectional view of one embodiment of a semiconductor package according to the prior art.

A groove 22 is formed on one side of the card body 21 to have a step, and the semiconductor package 23 is formed by an adhesive member 25, for example, an insulating adhesive or a double-sided adhesive tape to cover the opening of the groove 22. ) Is mounted. The semiconductor package 23 includes a PCB 26 having grooves formed at one side thereof, upper and lower wirings 27a and 27b formed at upper and lower sides of the PCB 26, and the PCB 25. The semiconductor chip 24 mounted in the recess of the wire, the wire 28 connecting the bonding pads of the semiconductor chip 24 to the lower wiring 27b, and the wire 28 and the semiconductor chip 24 It is composed of a package body 29 is molded molded to protect the wrap.

Nickel 27a is sequentially coated with nickel (Ni) and gold (Au), and the exposed upper wiring 27a of the semiconductor package 23 is exposed to the outside air at the end of the card body 21. It is connected to a data reading device and becomes an input / output path of data. The upper wiring 27a and the lower wiring 27b are electrically connected by a through conductive layer (not shown) passing through the PCB 26. The package body 29 is formed to have a jaw on the periphery of the PCB 26, and is caught by the end of the groove 22 formed in the jaw and the card body 21 when the semiconductor package 23 is mounted. It is intended to be.

3 (a) and 3 (b) are partial cross-sectional views of the integrated circuit card 30 and other embodiments of the semiconductor package 33 according to the prior art.

A rectangular groove 32 is formed on one surface of the rectangular card body 31 without a step, and the semiconductor package 33 is insulated and bonded to the groove 32. The semiconductor package 33 includes a PCB 36 having upper and lower wirings 37a and 37b formed at both sides thereof, and a semiconductor chip mounted on grooves formed at one side of the PCB 36. 34, a wire 38 connecting the lower wiring 37b of the PCB 36 to the semiconductor chip 34, and a dam 35 formed on the lower wiring 37b at the edge of the PCB 36. ) And a molding body such as EMC is filled in the tam 35 by a potting method to package the semiconductor chip 34 and the wire 38 to enclose the semiconductor chip 34 and the wire 38.

4 is a partial cross-sectional view of an integrated circuit card 40 on which a semiconductor package 43 of another embodiment according to the prior art is mounted.

A hemispherical groove 42 having a step is formed on one surface of the card body 41, and the semiconductor package 43 is insulated and bonded to the groove 42. In the semiconductor package 43, a metal wiring 47 having a metal thin film etched on one surface of the base film 46 is formed, and a metal wire 47 having a central portion of the base film 46 removed therefrom is exposed. The semiconductor chip 44 is adhered with an adhesive such as epoxy, and the metal wiring 47 and the bonding pads of the semiconductor chip 44 are exposed by removing other portions of the base film 46. Connected to (48). In addition, the hemispherical package body 49 is formed by the potting method so as to cover the semiconductor chip 44 and the wire 48 on the base film 46.

5 (a) and 5 (b) are a plan view of the tape carrier 50 for forming the semiconductor package of FIG. 4 and a plan view of the package state, and the same parts as those in FIG. 4 are given the same reference numerals.

Tape carrier 50 is the base film 46 is continuously connected in two rows and wound on a reel, and the base film 46 on both sides is punched at regular intervals, and mechanical needs such as alignment during transportation and mounting processes are required. In accordance with the sprocket hole (sprocket hole) 51 is formed. In addition, the exposed wires 47 which are connected to the outside are geometrically arranged so that the outside is suitable for contact with a data reader (not shown). The semiconductor chip 44 is mounted on the center portion of the wiring 47.

As shown in FIG. 6, the semiconductor chip 44, the wire 48, and the package body 49 are continuously formed on a long tape-shaped tape carrier 50 and wound around a cylindrical reel 60. Are kept. The semiconductor package 43 is sequentially unwound in the reel 60 to align the semiconductor package 43 on the groove 42 of the card body 55, and then cut the base film 46 to cut the groove ( After the insulating mounting in 42, the process of winding the remaining base film 46 on the opposite reel 62 irrelevant to the mounting of the semiconductor chip 44 is repeated. In addition, although not shown, buffer devices are installed throughout the process to control the speed of the tape carrier 50.

In the above-described conventional IC card semiconductor package, a package body is formed by mounting a semiconductor chip on a recess of a PCB and then molding or potting the inside of the dam. These semiconductor packages have a complicated structure such as wiring formed at upper and lower parts of the PCB and connected to the through conductive material layer, thereby increasing the manufacturing cost, and the size of the PCB may be smaller than or equal to that of a conventional metal lead frame. Since the number of semiconductor chips is limited, there is a problem that the productivity is lowered.

In addition, the semiconductor package mounted by the reel-to-reel method of the tape carrier by the tape carrier is similar to a general tap package process and can use conventional manufacturing equipment such as wire bonder, thereby reducing the manufacturing cost. , The length of the assembly line is lengthened because a plurality of buffer devices are required at various stages of the assembly line to control the speed of the mounting process between or before and after the reel and the reel. Since the shape of the height and the width of the non-uniform, there is a problem in that the reliability is low during the mounting process.

In order to improve productivity among the above problems, Japanese Laid-Open Patent Publication No. Hei 1-84192 includes a substrate in which a semiconductor chip is mounted in a central portion and a frame is formed around the substrate, and a substrate connected to a plurality of substrates and connecting portions. A method of manufacturing an IC card package is disclosed in which a semiconductor chip is mounted on the substrate, resin is injected into the mold, the connection portion is cut, and each package is mounted on a card body. The semiconductor package is advantageous in that mass productivity is improved and reliability is improved, but the manufacturing cost of the semiconductor package is increased due to the complicated structure of the substrate.

The present invention is to solve the above problems, an object of the present invention is to simplify the structure using a tape carrier in the strip state, IC card that can reduce the manufacturing cost by utilizing the conventional package manufacturing equipment To provide a semiconductor package for.

Another object of the present invention is to provide a semiconductor package for an IC card that can shorten the length of the assembly line, thereby limiting the location and improving productivity by performing the process in units of strips having a relatively long length.

It is still another object of the present invention to provide a semiconductor package for an IC card which can improve the reliability during the mounting process due to the uniform shape of the package body.

A feature of the present invention for achieving the above objects is a semiconductor package for an integrated circuit card is mounted so as to cover the opening of the groove formed on one side of the card body formed in a rectangular shape; An insulating material base film; Metal wires formed on one side of the base film and exposed to the outside of the card body; A device hole in which the base film is removed so that one side of the metal wiring is exposed; A semiconductor chip mounted on a metal wiring exposed by the device hole; A slot for removing the base flim on one side of the device hole to expose the other side of the metal wiring; Wires connecting the metal wires exposed by the slots to the bonding pads of the semiconductor chip; The semiconductor chip and the semiconductor package for an integrated circuit card having a package body formed by a molding method so as to surround and protect the exposed metal wiring surface by removing the semiconductor chip and wire and base film.

EMBODIMENT OF THE INVENTION Hereinafter, one preferred embodiment of the IC card semiconductor package which concerns on this invention is described in detail with reference to an accompanying drawing.

7 is a sectional view of an embodiment of a semiconductor package 73 for an IC card 70 according to the present invention.

A rectangular card body 71 is formed of a plastic material, for example, polyvinyl chloride, vinyl chloride acetate, or the like, and one side of the card body 71 has a recess 72 for mounting the semiconductor package 73. The jaw is formed so that the semiconductor package 73 is attached via an adhesive layer 75 such as an adhesive or a double-sided adhesive tape so as to close the opening of the groove 72.

The semiconductor package 73 is one surface of a base film 76 formed of an insulating material used for a tab package, for example, polyimide, polyester, polyether sulfone (PES), polyparanic acid (PPA), or the like. A metal thin film, for example, a thin copper (Cu) thin film of about 70 μm is photographed by an adhesive layer having a thickness of about 20 μm to form metal wires 77. On the outer surface of the metallization 77, the metal plating layers may further have a nickel (Ni) plating layer 77a and 0.2 having an appropriate thickness, for example, about 3 µm, in order to improve contact and wear resistance with an external data reader. A gold (Au) plating layer 77b having a thickness of about μm is sequentially formed.

In addition, a device hole 80 is formed in which the center portion of the base film 76 is removed in a rectangular shape slightly larger than the size of the half-cell chip to be mounted, and the metal wiring 77 exposed by the device hole 80 is formed. The semiconductor chip 74 is mounted on a die bonder with an adhesive member, for example, a silver (Ag) epoxy layer 82, and then the base film 76 on which the semiconductor chip 74 is mounted is mounted. The silver epoxy layer 82 is cured by heat treatment at 1 ° C. for 1 hour.

In addition, both sides of the base film 76 around the device hole 80 are removed by a punching or chemical angle such as about 1 to 2 mm in width to form a slot 84 exposing a predetermined portion of the metal wiring 77. The base film 76 is placed on the heater block, and the exposed metal wiring 77 and the bonding pads of the semiconductor chip 74 are heated at a temperature of about 170 ° C. by the high-frequency thermocompression bonding method. )

Then, the base film 76 is mounted in a mold cavity of a conventional molding equipment, and then wrapped around the semiconductor chip 74 and the wire 78 by a transfer molding method at a temperature of about 175 ° C with a molding member such as EMC. The package body 79 is formed. In this case, a material having a small difference in thermal expansion coefficient between the base film 76 and the molding member such as EMC may be used to prevent defects such as warping and bending due to heat.

FIG. 8 is a bottom view of a strip 90 used in the semiconductor package 73 of FIG. 7, which is not a long tape carrier but allows mounting of a predetermined number of semiconductor chips like a conventional metal lead frame. Since the base film 76 is cut into strips 90 which are connected to a plurality of base films 76, the molding process is possible after the semiconductor chip mounting and wire bonding processes. In addition, at both edges of the strip 90, sprocket holes 92 necessary for transportation and mechanical alignment are formed at regular intervals. Therefore, after mounting the plurality of strips 90 in the mold die, the package body 79 is formed in one molding process, thereby improving work efficiency.

As described above, according to the semiconductor package for an IC card according to the present invention, a metal wiring is formed on a base film of a tab package cut into strips so that a plurality of semiconductor chips are mounted, and the base film of the metal wiring is formed. Since the semiconductor chip is mounted on the exposed metal wiring by removing one side and the bonding pad and the metal wiring of the semiconductor chip are connected by wires, the package body surrounding the semiconductor chip and the wire is protected by a transfer molding method. It is formed by the base film and die bonder process, wire bonding process, and transfer molding process of the tab package, so the structure of the semiconductor package is simple, and the conventional package manufacturing equipment can be used, thus reducing the manufacturing cost, and stripping Can be cut to a suitable length to proceed with the process. As it is possible to improve the productivity, a plurality of buffer devices because there is no need to install on the assembly line becomes the length of the assembly line shorter effective receives less restriction of the place for regulating the speed of the packaging process. In addition, since the package body is formed by a molding process, the shape of the package body is uniformly formed, thereby improving the reliability during the mounting process.

Claims (7)

A semiconductor package for an integrated circuit card mounted so as to cover an opening of a recess formed in one side of a card body formed in a rectangle; An insulating material base film; Metal wires formed on one side of the base film and exposed to the outside of the card body; A device hole in which the base film is removed so that one side of the metal wiring is exposed; A semiconductor chip mounted on a metal wiring exposed by the device hole; A slot for removing the base film on one side of the device hole and exposing the other side of the metal wiring; Wires connecting the metal wires exposed by the slots to the bonding pads of the semiconductor chip; And a package body formed by a molding method so as to surround and protect the exposed metal wiring surface by removing the semiconductor chip, wire, and base film. The semiconductor package of claim 1, wherein the base package is formed of one insulating material selected from the group consisting of polyimide, polyester, polyether sulfone (PES), and polyparanic acid (PPA). . The semiconductor package for an integrated circuit card according to claim 1 or 2, wherein the metal wiring is formed of a copper thin film. 4. The semiconductor package of claim 3, wherein the metal wiring has a nickel and gold plated layer formed on the copper thin film in order to improve contact and wear resistance with an external data reader. The semiconductor package according to claim 1 or 2, wherein the semiconductor chip is mounted with silver epoxy. The semiconductor package of claim 1, wherein the wires are bonded by an ultrasonic thermocompression ball bonding method. The semiconductor package of claim 1 or 2, wherein the base film and the metal wirings are formed in a strip shape in which a plurality of the plurality of semiconductor chips are connected so as to mount a plurality of semiconductor chips.