KR950702029A - 신호의 기울기 측정을 이용한 종점 감지 기법(Endpoint Detection Technique Using Singnal Slope Determinations) - Google Patents

신호의 기울기 측정을 이용한 종점 감지 기법(Endpoint Detection Technique Using Singnal Slope Determinations)

Info

Publication number
KR950702029A
KR950702029A KR1019940704490A KR19940704490A KR950702029A KR 950702029 A KR950702029 A KR 950702029A KR 1019940704490 A KR1019940704490 A KR 1019940704490A KR 19940704490 A KR19940704490 A KR 19940704490A KR 950702029 A KR950702029 A KR 950702029A
Authority
KR
South Korea
Prior art keywords
layer
signal
predetermined
measuring
values
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019940704490A
Other languages
English (en)
Korean (ko)
Inventor
허버트 이. 리트백
Original Assignee
메이 에이치선
럭스트론 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25405691&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR950702029(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 메이 에이치선, 럭스트론 코포레이션 filed Critical 메이 에이치선
Publication of KR950702029A publication Critical patent/KR950702029A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Drying Of Semiconductors (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Image Processing (AREA)
KR1019940704490A 1992-06-09 1993-05-24 신호의 기울기 측정을 이용한 종점 감지 기법(Endpoint Detection Technique Using Singnal Slope Determinations) Withdrawn KR950702029A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US89613792A 1992-06-09 1992-06-09
US07/896,137 1992-06-09
PCT/US1993/004936 WO1993025893A1 (en) 1992-06-09 1993-05-24 Endpoint detection technique using signal slope determinations

Publications (1)

Publication Number Publication Date
KR950702029A true KR950702029A (ko) 1995-05-17

Family

ID=25405691

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940704490A Withdrawn KR950702029A (ko) 1992-06-09 1993-05-24 신호의 기울기 측정을 이용한 종점 감지 기법(Endpoint Detection Technique Using Singnal Slope Determinations)

Country Status (5)

Country Link
EP (1) EP0645008A1 (forum.php)
JP (1) JP3375338B2 (forum.php)
KR (1) KR950702029A (forum.php)
TW (1) TW223176B (forum.php)
WO (1) WO1993025893A1 (forum.php)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738756A (en) * 1995-06-30 1998-04-14 Lam Research Corporation Method and apparatus for detecting optimal endpoints in plasma etch processes
US6010538A (en) * 1996-01-11 2000-01-04 Luxtron Corporation In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link
US6028669A (en) * 1997-07-23 2000-02-22 Luxtron Corporation Signal processing for in situ monitoring of the formation or removal of a transparent layer
US6570662B1 (en) 1999-05-24 2003-05-27 Luxtron Corporation Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers
WO2000071971A1 (en) 1999-05-24 2000-11-30 Luxtron Corporation Optical techniques for measuring layer thicknesses
CN114112944A (zh) * 2022-01-25 2022-03-01 武汉精立电子技术有限公司 一种显示面板测量方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4679938A (en) * 1985-06-03 1987-07-14 International Business Machines Corporation Defect detection in films on ceramic substrates
US5021362A (en) 1989-12-29 1991-06-04 At&T Bell Laboratories Laser link blowing in integrateed circuit fabrication
US5196285A (en) * 1990-05-18 1993-03-23 Xinix, Inc. Method for control of photoresist develop processes
US5160576A (en) * 1991-03-05 1992-11-03 Lam Research Corporation Method of end point detection in a plasma etching process

Also Published As

Publication number Publication date
WO1993025893A1 (en) 1993-12-23
JP3375338B2 (ja) 2003-02-10
JPH07507904A (ja) 1995-08-31
TW223176B (forum.php) 1994-05-01
EP0645008A1 (en) 1995-03-29

Similar Documents

Publication Publication Date Title
EP0108794B1 (en) End point detection method
US4208240A (en) Method and apparatus for controlling plasma etching
EP0552175B1 (en) Photographic processing apparatus
US6200822B1 (en) Method for detecting the transition between different materials in semiconductor structures
DE60127673D1 (de) Dickemessvorrichtung, dickemessverfahren und nassätzvorrichtung und nassätzverfahren damit
KR101377774B1 (ko) 광학식 이물질 검출 장치 및 이것을 탑재한 처리액 도포 장치
JPH04196529A (ja) プラズマ処理装置
KR950702029A (ko) 신호의 기울기 측정을 이용한 종점 감지 기법(Endpoint Detection Technique Using Singnal Slope Determinations)
US4179622A (en) Method and system for in situ control of material removal processes
KR960002535A (ko) 반도체장치의 제조방법 및 장치
GB2151352A (en) Inspection of photomasks to detect defects
US6342704B1 (en) Method and apparatus for detecting nitride residue on semiconductor wafers
KR970012022A (ko) 얼라이먼트 방법
US4462856A (en) System for etching a metal film on a semiconductor wafer
JP2656869B2 (ja) ドライエッチングにおける終点検出方法
KR100374549B1 (ko) 식각상태 감시장치
JPH0514858B2 (forum.php)
JPS62159431A (ja) エツチング終点判定方法
JPS5647836A (en) Coordinate input method of weighing detective coordinate input unit
JPS61264728A (ja) ドライエツチング終点検出方法
JPH02230698A (ja) プラズマ計測方法
JPS6295829A (ja) エツチング終点検出方法
JPH0513922A (ja) エツチング検査板
JPH0428224A (ja) 薄膜のエッチング方法
JPH066797B2 (ja) エツチングの終点検出方法

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 19941209

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid