KR950032544A - 불투과성 피복물을 적용시키는 방법 - Google Patents

불투과성 피복물을 적용시키는 방법 Download PDF

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KR950032544A
KR950032544A KR1019950008335A KR19950008335A KR950032544A KR 950032544 A KR950032544 A KR 950032544A KR 1019950008335 A KR1019950008335 A KR 1019950008335A KR 19950008335 A KR19950008335 A KR 19950008335A KR 950032544 A KR950032544 A KR 950032544A
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integrated circuit
coated
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coating
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알. 베어링거 클레이톤
차알스 캐밀레티 로버트
앤드류 할러스카 로렌
원톤 마이클 키이쓰
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노만 에드워드 루이스
다우 코닝 코포레이션
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Publication of KR950032544A publication Critical patent/KR950032544A/ko

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    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
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    • H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
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  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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Abstract

본 발명은 직접회로 상에 불투과성 피복물을 형성시키는 방법에 관한 것이다. 본 방법은 집적회로 상에 실리카 전구체 수지 및 충전재 피복물을 선택적으로 적용시키고, 피복시킨 회로를 충분한 온도로 가열하여 실리카 전구체 수지를 실리카 함유 세라믹 매트릭스로 전환시킴을 포함한다.

Description

불투과성 피복물을 적용시키는 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. 실리카 전구체 수지 및 중금속의 불용성 염을 포함하는 충전재를 포함하는 피복 조성물을 집적회로의 표면에 상호 연결에 사용되는 결합 패드(pad) 및 스트리트(Street)가 피복되지 않도록 선택적으로 적용시키고, 피복된 집적회로를 50 내지 1000°C의 온도로 6시간 내에 가열시켜 피복 조성물을 세라믹 피복물로 전환시킴을 특징으로 하여 집적회로 상에 방사선 불투과성 피복물을 형성시키는 방법.
  2. 제1항에 있어서, 충전재가 바륨, 납, 은 ,금, 카드뮴, 안티몬, 주석, 팔라듐, 스트론튬, 텅스텐 및 비스무트의 탄산염, 황산염 및 산화물로부터 선택되는 방법.
  3. 실리카 전구체 수지 및 광학적 불투과성 충전재를 포함하는 피복 조성물을 집적회로 상에 상호 연결에 사용되는 결합 패드 및 스트리트가 피복되지 않도록 선택적으로 적용시키고, 피복시킨 전자 기판을 50 내지 1000°C의 온도에서 6시간 내에 가열시켜 피복 조성물을 세라믹 피복물로 전환시킴을 특징으로 한여 집적회로 상에 광학적 불투과성 피복물을 형성시키는 방법.
  4. 제3항에 있어서, 충전재가 규소 또는 알루미나의 산화물, 질화물 및 탄화물; 금속 및 무기 안료로부터 선택되는 방법.
  5. 제1항 또는 제3항에 있어서, 실리카 전구체 수지가 수소 실세스실록산 수지 및 가수분해되거나 부분적으로 가수분해된 RnSi(OR)4-n〔여기서, R은 탄소수 1내지 20의 지방족, 지환족 또는 방향족 치환체이고 n은 0내지 3이다〕 로부터 선택되는 방법.
  6. 제1항 또는 제3항에 있어서, 피복된 집적회로를 공기, O2산소 플라즈마, 불활성 가스, 질소, 암모니아, 아민, 수분 및 N2O 로부터 선택된 환경 중에서 3시간 미만 동안 50내지 800°C의 온도에서 가열시키는 방법.
  7. 제1항 또는 제3항에 있어서, 피복 조성물이 또한 충전재 표면 개질제, 현탁제 및 내마모제로부터 선택된 물질을 함유하는 방법.
  8. 제1항 또는 제3항에 있어서, 충전재가 분말, 입자, 필라멘트, 플레이크(flake) 및 마이크로볼룬(microballoon)으로 이루어진 그룹으로부터 선택된 형태인 방법.
  9. 제1항 또는 제3항에 있어서,충전재가 5 내지 80 중량%의 양으로 피복 조성물 중에 존재하는 방법.
  10. 제1항 또는 제3항에 방법에 의해 피복된 집적회로.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950008335A 1994-04-12 1995-04-11 불투과성 피복물을 적용시키는 방법 KR950032544A (ko)

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US8/226,585 1994-04-12
US08/226,585 US5399441A (en) 1994-04-12 1994-04-12 Method of applying opaque coatings

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EP (1) EP0684636A1 (ko)
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