KR950032512A - 충전된 보로실라잔을 사용한 전자 피복물 - Google Patents
충전된 보로실라잔을 사용한 전자 피복물 Download PDFInfo
- Publication number
- KR950032512A KR950032512A KR1019950006963A KR19950006963A KR950032512A KR 950032512 A KR950032512 A KR 950032512A KR 1019950006963 A KR1019950006963 A KR 1019950006963A KR 19950006963 A KR19950006963 A KR 19950006963A KR 950032512 A KR950032512 A KR 950032512A
- Authority
- KR
- South Korea
- Prior art keywords
- filler
- coating
- borosilicate
- substrate
- coating composition
- Prior art date
Links
- 239000011248 coating agent Substances 0.000 title claims abstract 6
- 238000000576 coating method Methods 0.000 title claims abstract 6
- 238000000034 method Methods 0.000 claims abstract 9
- 239000000758 substrate Substances 0.000 claims abstract 8
- 239000000945 filler Substances 0.000 claims abstract 6
- 238000010438 heat treatment Methods 0.000 claims abstract 2
- 239000008199 coating composition Substances 0.000 claims 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- 150000001412 amines Chemical class 0.000 claims 1
- 229910021529 ammonia Inorganic materials 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 238000005524 ceramic coating Methods 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000011231 conductive filler Substances 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 239000011261 inert gas Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000012762 magnetic filler Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 239000005388 borosilicate glass Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/62222—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic coatings
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02142—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing silicon and at least one metal element, e.g. metal silicate based insulators or metal silicon oxynitrides
- H01L21/02145—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing silicon and at least one metal element, e.g. metal silicate based insulators or metal silicon oxynitrides the material containing aluminium, e.g. AlSiOx
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02219—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and nitrogen
- H01L21/02222—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and nitrogen the compound being a silazane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Structural Engineering (AREA)
- Paints Or Removers (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Inorganic Insulating Materials (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
본 발명은 피복물을 전자 기판상에 형성시키는 방법 및 이에 의해 피복된 기판에 관한 것이다.당해 방법에는 보로실라잔 및 충전제를 포함하는 피복물을 기판상에 적용한 다음,피복된 기판을 보로실라잔이 세라믹 피복물로 전환되기에 충분한 온도에서 가열하는 것이 포함된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (7)
- 보로실라잔 및 충전제를 포함하는 피복 조성물을 전자 기판상에 적용하고;기판상의 피복 조성물을 50 내지 1,000℃의 범위에서 6시간 이하 동안 가열함으로써 보로실리케이트 함유 세라믹 피복물로 전환시킴을 포함하여,전자 기판상에 피복물을 형성시키는 방법.
- 제1항에 있어서,피복 조성물을,기판을 용매,보로실라잔 및 충전제를 포함하는 액체 혼합물로 피복한 후,용매를 증발시킴을 포함하는 방법에 의해 기판에 적용하는 방법.
- 제1항에 있어서,피복 조성물을 공기,O2,산소 플라즈마,불활성 기체,질소,암모니아,아민,수분 및 N2O중에서 선택된 하나 이상의 화합물을 함유하는 환경에서 가열하는 방법.
- 제1항에 있어서,충전제가 분말,입자,필라멘트,플레이크 및 미소중공구 중에서 선택된 형태인 방법.
- 제4항에 있어서,충전제의 입자 크기가 500㎛미만인 방법.
- 제1항에 있어서,충전제가 자기 충전제 또는 전도성 충전제인 방법.
- 제1항의 방법에 의해 피복된 전자기판.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/223,297 US5436084A (en) | 1994-04-05 | 1994-04-05 | Electronic coatings using filled borosilazanes |
US08/223,297 | 1994-04-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950032512A true KR950032512A (ko) | 1995-12-22 |
Family
ID=22835900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950006963A KR950032512A (ko) | 1994-04-05 | 1995-03-30 | 충전된 보로실라잔을 사용한 전자 피복물 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5436084A (ko) |
EP (1) | EP0677871A3 (ko) |
JP (1) | JPH07323224A (ko) |
KR (1) | KR950032512A (ko) |
TW (1) | TW284748B (ko) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5448111A (en) * | 1993-09-20 | 1995-09-05 | Fujitsu Limited | Semiconductor device and method for fabricating the same |
US5558908A (en) * | 1994-11-07 | 1996-09-24 | Lanxide Technology Company, Lp | Protective compositions and methods of making same |
TW353108B (en) * | 1995-06-16 | 1999-02-21 | Dow Corning | Composite electronic coatings |
US5635240A (en) * | 1995-06-19 | 1997-06-03 | Dow Corning Corporation | Electronic coating materials using mixed polymers |
US5863595A (en) * | 1996-10-04 | 1999-01-26 | Dow Corning Corporation | Thick ceramic coatings for electronic devices |
US5776235A (en) * | 1996-10-04 | 1998-07-07 | Dow Corning Corporation | Thick opaque ceramic coatings |
US5807611A (en) * | 1996-10-04 | 1998-09-15 | Dow Corning Corporation | Electronic coatings |
US5730792A (en) * | 1996-10-04 | 1998-03-24 | Dow Corning Corporation | Opaque ceramic coatings |
US5711987A (en) * | 1996-10-04 | 1998-01-27 | Dow Corning Corporation | Electronic coatings |
US5855962A (en) * | 1997-01-09 | 1999-01-05 | International Business Machines Corporation | Flowable spin-on insulator |
US6417115B1 (en) * | 1998-05-26 | 2002-07-09 | Axeclis Technologies, Inc. | Treatment of dielectric materials |
KR100662061B1 (ko) * | 1998-09-29 | 2006-12-27 | 가부시끼가이샤 히다치 세이사꾸쇼 | 플라즈마 디스플레이 패널 및 기판 구조체의 제조 방법 |
US6225238B1 (en) * | 1999-06-07 | 2001-05-01 | Allied Signal Inc | Low dielectric constant polyorganosilicon coatings generated from polycarbosilanes |
US6426127B1 (en) * | 1999-12-28 | 2002-07-30 | Electron Vision Corporation | Electron beam modification of perhydrosilazane spin-on glass |
CA2480797A1 (en) * | 2002-04-15 | 2003-10-23 | Schott Ag | Method for producing a copy protection for an electronic circuit and corresponding component |
US7153754B2 (en) * | 2002-08-29 | 2006-12-26 | Micron Technology, Inc. | Methods for forming porous insulators from “void” creating materials and structures and semiconductor devices including same |
JP4588304B2 (ja) * | 2003-08-12 | 2010-12-01 | Azエレクトロニックマテリアルズ株式会社 | コーティング組成物、およびそれを用いて製造した低誘電シリカ質材料 |
US20060223937A1 (en) * | 2005-04-04 | 2006-10-05 | Herr Donald E | Radiation curable cycloaliphatic barrier sealants |
US20070219516A1 (en) * | 2006-03-14 | 2007-09-20 | Tyco Healthcare Group Lp | X-ray detectable element for association with surgical absorbent substrates and method of making |
EP2365038B1 (en) | 2006-12-19 | 2013-03-13 | Seiko Epson Corporation | Pigment dispersion, ink composition, inkset, and recording device |
EP3594292B1 (en) * | 2006-12-19 | 2021-06-23 | Seiko Epson Corporation | Inkjet recording method |
JP2010168412A (ja) * | 2009-01-20 | 2010-08-05 | Seiko Epson Corp | 表面処理顔料、インク組成物、及びインクジェット記録方法 |
JP2010168411A (ja) * | 2009-01-20 | 2010-08-05 | Seiko Epson Corp | 表面処理顔料、インク組成物、及びインクジェット記録方法 |
DE102009000885A1 (de) * | 2009-02-16 | 2010-08-26 | Semikron Elektronik Gmbh & Co. Kg | Halbleitermodul |
DE102009000884B3 (de) | 2009-02-16 | 2010-10-07 | Semikron Elektronik Gmbh & Co. Kg | Halbleitermodul mit Gehäuse aus präkeramischem Polymer |
JP2010229197A (ja) * | 2009-03-26 | 2010-10-14 | Seiko Epson Corp | 耐水化アルミニウム顔料分散液の製造方法、耐水化アルミニウム顔料およびそれを含有する水性インク組成物 |
JP2011140609A (ja) * | 2009-04-07 | 2011-07-21 | Seiko Epson Corp | 耐水化アルミニウム顔料および耐水化アルミニウム顔料分散液、それらを含有する水性インク組成物、ならびに耐水化アルミニウム顔料分散液の製造方法 |
JP2011132483A (ja) * | 2009-04-07 | 2011-07-07 | Seiko Epson Corp | 耐水化アルミニウム顔料分散液およびそれを含有する水性インク組成物、ならびに耐水化アルミニウム顔料分散液の製造方法 |
JP2010241976A (ja) * | 2009-04-07 | 2010-10-28 | Seiko Epson Corp | 耐水化アルミニウム顔料分散液の製造方法、耐水化アルミニウム顔料およびそれを含有する水性インク組成物 |
JP2010265422A (ja) * | 2009-05-18 | 2010-11-25 | Seiko Epson Corp | 表面処理顔料、インク組成物、及びインクジェット記録方法 |
CN116041073B (zh) * | 2023-01-16 | 2023-11-10 | 哈尔滨工业大学 | 一种改性SiBCN陶瓷材料及其制备方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4482689A (en) * | 1984-03-12 | 1984-11-13 | Dow Corning Corporation | Process for the preparation of polymetallo(disily)silazane polymers and the polymers therefrom |
JPH01221466A (ja) * | 1988-03-01 | 1989-09-04 | Toa Nenryo Kogyo Kk | コーティング用組成物及びコーティング方法 |
FR2637602B1 (fr) * | 1988-10-06 | 1990-12-14 | Rhone Poulenc Chimie | Procede de synthese de polymeres a base de bore et d'azote precurseurs de nitrure de bore et produits susceptibles d'etre ainsi obtenus |
US5179048A (en) * | 1988-10-24 | 1993-01-12 | Ethyl Corporation | Preceramic compositions and ceramic products |
US4910173A (en) * | 1989-04-14 | 1990-03-20 | Ethyl Corporation | Preceramic compositions and ceramic products |
JPH0352287A (ja) * | 1989-07-20 | 1991-03-06 | Tonen Corp | セラミック回路基板,パッケージ,その製法及び材料 |
US5171736A (en) * | 1989-10-16 | 1992-12-15 | Massachusetts Institute Of Technology | Preceramic organosilicon-boron polymers |
US4973526A (en) * | 1990-02-15 | 1990-11-27 | Dow Corning Corporation | Method of forming ceramic coatings and resulting articles |
JPH03250082A (ja) * | 1990-02-27 | 1991-11-07 | Tonen Corp | 導電性接着剤 |
US5258229A (en) * | 1990-10-15 | 1993-11-02 | Ethyl Corporation | Preceramic composition and ceramic product |
WO1993002472A1 (en) * | 1991-07-16 | 1993-02-04 | Catalysts & Chemicals Industries Co., Ltd. | Semiconductor device and production thereof |
CA2084243A1 (en) * | 1991-12-20 | 1993-06-21 | Daniel R. Petrak | Ceramic matrix composites and method for making same |
-
1994
- 1994-04-05 US US08/223,297 patent/US5436084A/en not_active Expired - Fee Related
-
1995
- 1995-03-23 TW TW084102811A patent/TW284748B/zh active
- 1995-03-27 EP EP95302023A patent/EP0677871A3/en not_active Withdrawn
- 1995-03-30 KR KR1019950006963A patent/KR950032512A/ko not_active Application Discontinuation
- 1995-03-31 JP JP7076265A patent/JPH07323224A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
TW284748B (ko) | 1996-09-01 |
EP0677871A3 (en) | 1997-05-14 |
US5436084A (en) | 1995-07-25 |
JPH07323224A (ja) | 1995-12-12 |
EP0677871A2 (en) | 1995-10-18 |
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