KR950030289A - 와이어 본딩장치 - Google Patents
와이어 본딩장치 Download PDFInfo
- Publication number
- KR950030289A KR950030289A KR1019950007261A KR19950007261A KR950030289A KR 950030289 A KR950030289 A KR 950030289A KR 1019950007261 A KR1019950007261 A KR 1019950007261A KR 19950007261 A KR19950007261 A KR 19950007261A KR 950030289 A KR950030289 A KR 950030289A
- Authority
- KR
- South Korea
- Prior art keywords
- gas
- gas guide
- wire
- guide plate
- nozzle
- Prior art date
Links
- 238000007664 blowing Methods 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 238000011109 contamination Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
기체흐름이 안정화되어 와이어의 진동이 작아지고, 또 기체가이드판의 오염이 한눈에 알 수 있는 동시에 청소가 대단히 용이하며, 또한 제작코스트의 경감을 도모한다.
와이어(14)가 감겨진 스플(15)과 캐피러리와의 사이에 배열설치되어서 와이어(14)에 텐션을 부여하는 텐션 부여수단(20)은 기체를 분출하는 노즐(21)과 노즐(21)로 부터 분출된 기체의 흐름방향에 따라 설치된 1매의 기체가이드판(24)으로 이루어진다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명으로 이루어진 와이어 본딩장치에 사용하는 텐션부여수단부분의 1실시예를 예시하는 주요부정면도, 제2도는 제1도의 측면도.
Claims (2)
- 기체를 분출하는 노즐과, 이 노즐로 부터 분출된 기체의 흐름방향에 따라 설치된 기체가이드판으로 이루어지며, 와이어가 감겨진 스풀과 캐피러리와의 사이에 배열설치되어서 와이어에 텐션을 부여하는 텐션부여수단을 가진 와이어 분딩장치에 있어서, 상기 기체가이드판은 1매로 이루어지는 것을 특징으로 하는 와이어 본딩장치.
- 기체를 분출하는 노즐과, 이 노즐로 부터 분출된 기체의 흐름방향에 따라 설치된 기체가이판으로 이루어지며, 와이어가 감겨진 스풀과 캐피러리와의 사이에 배열설치되어서 와이어에 텐션을 부여하는 텐션부여순단을 가진 와이어 본딩장치에 있어서, 상기 기체가이드판은 1매로 이루어지고, 상기 스플로 부터 풀려나온 와이어가 상기 기체가이드판의 기체가이드면에 따라 움직이도록 기체가이드판의 윗쪽에 배치되고, 또한 노즐중심의 양쪽에 일정간격을 유지하여 상기 기체가이드판의 기체가이드면의 평면과 평행으로 배치된 한쌍의 와이어가 이드핀과, 상기 기체가이드판 아래쪽에 배치되고, 기체 가이드판의 기체가이드면의 평면과 평행으로 측면부가 기체가이드판의 기체가이드면과 동일 평면에 배치된 와이어가이드부재를 구비한 것을 특징으로 하는 와이어 본딩장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP94-93792 | 1994-04-07 | ||
JP09379294A JP3180205B2 (ja) | 1994-04-07 | 1994-04-07 | ワイヤボンデイング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950030289A true KR950030289A (ko) | 1995-11-24 |
KR0161329B1 KR0161329B1 (ko) | 1999-02-01 |
Family
ID=14092274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950007261A KR0161329B1 (ko) | 1994-04-07 | 1995-03-31 | 와이어 본딩장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5564616A (ko) |
JP (1) | JP3180205B2 (ko) |
KR (1) | KR0161329B1 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001151413A (ja) * | 1999-11-29 | 2001-06-05 | Shinkawa Ltd | ワイヤボンダにおけるスプールホルダ構造 |
JP2001156104A (ja) | 1999-11-30 | 2001-06-08 | Shinkawa Ltd | ワイヤボンデイング装置 |
US6513696B1 (en) * | 2000-08-28 | 2003-02-04 | Asm Assembly Automation Ltd. | Wedge bonding head |
US6520400B2 (en) * | 2001-03-30 | 2003-02-18 | Kulicke & Soffa Investments, Inc. | Wire tensioning apparatus |
US7597235B2 (en) * | 2007-11-15 | 2009-10-06 | Infineon Technologies Ag | Apparatus and method for producing a bonding connection |
KR20130026805A (ko) * | 2011-09-06 | 2013-03-14 | 삼성전자주식회사 | 반도체 패키지의 와이어 본딩 시스템 |
CN105895543B (zh) * | 2014-12-01 | 2019-09-13 | 恩智浦美国有限公司 | 接合引线进给系统及其方法 |
KR20230000535U (ko) | 2021-09-06 | 2023-03-14 | 최용택 | 발열 용기받침대 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5310425B2 (ko) * | 1974-09-13 | 1978-04-13 | ||
JPS539949A (en) * | 1976-07-13 | 1978-01-28 | Jiyoujifu Teiraa Goodon | Bush |
JPS5310425A (en) * | 1976-07-16 | 1978-01-30 | Minolta Camera Co Ltd | Objective lens system free from deterioration due to aberration during close-up photography |
US4498638A (en) * | 1983-06-24 | 1985-02-12 | Fairchild Camera & Instrument Corporation | Apparatus for maintaining reserve bonding wire |
JPS6141231A (ja) * | 1984-08-02 | 1986-02-27 | Matsushita Electric Ind Co Ltd | ステレオモ−ド表示装置 |
US4763826A (en) * | 1986-05-14 | 1988-08-16 | Kulicke And Soffa Ind., Inc. | Automatic wire feed system |
EP0342358A1 (de) * | 1988-05-18 | 1989-11-23 | Esec Sa | Verfahren und Einrichtung zum Bereitstellen eines Bonddrahtes |
JPH088271B2 (ja) * | 1988-11-01 | 1996-01-29 | 株式会社新川 | ワイヤボンデイング装置 |
-
1994
- 1994-04-07 JP JP09379294A patent/JP3180205B2/ja not_active Expired - Fee Related
-
1995
- 1995-03-31 KR KR1019950007261A patent/KR0161329B1/ko not_active IP Right Cessation
- 1995-04-05 US US08/416,995 patent/US5564616A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR0161329B1 (ko) | 1999-02-01 |
US5564616A (en) | 1996-10-15 |
JPH07283264A (ja) | 1995-10-27 |
JP3180205B2 (ja) | 2001-06-25 |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20070719 Year of fee payment: 12 |
|
LAPS | Lapse due to unpaid annual fee |