KR950007078A - 전기도금법에 의한 고집적회로 미세패턴의 구리충전방법 - Google Patents
전기도금법에 의한 고집적회로 미세패턴의 구리충전방법 Download PDFInfo
- Publication number
- KR950007078A KR950007078A KR1019930016096A KR930016096A KR950007078A KR 950007078 A KR950007078 A KR 950007078A KR 1019930016096 A KR1019930016096 A KR 1019930016096A KR 930016096 A KR930016096 A KR 930016096A KR 950007078 A KR950007078 A KR 950007078A
- Authority
- KR
- South Korea
- Prior art keywords
- copper
- thin film
- electroplating
- electrolyte
- micropattern
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
- H01L21/76873—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroplating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
본 발명은 전기도금법에 의해 구리금속선을 형성하는 방법에 관한 것으로 전해액과 음극에서 전기화학반응을 이용하여 기판의 기하학적 모양에 큰 영향을 받지 않고 실리콘위에만 선택적으로 평탄한 박막을 형성하며, 좁고 깊어진 서브마이크론의 접촉창이나 다층배선의 바이어를 구리로 선택적 충전하는 방법에 관한 것이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 관련된 다층 배선구조로 구리가 선택적으로 충전된 형상을 도시하는 단면도.
제2도는 구리도금장치의 구조를 나타내는 개략도.
제3도는 제2도의 음극기판을 나타내는 상세도.
Claims (3)
- 전기도금법에 의한 고집적회로 미세패턴의 선택적 구리충전방법에 있어서, 미세접촉장 구조를 갖는 실리콘 웨이퍼뒷면에 알루미늄 박막을 형성하는 단계; 도금장치의 구조에 따라 알루미늄 박막층위에 절연체를 도포하는 단계; 도금부위인 접촉창의 자연산화막을 제거하기 위해서 50 : l의 불산에 1분간 산세척한 후 이온교환수 세척을 거쳐 질소로 건조시키는 단계; 실리콘 기판인 음극과 구리양극 사이에 정전류를 가해 전해액내의 구리이온이 기판표면에 환원되면서 구리박막을 형성하는 단계; 및 상기 구리박막층 부위를 이온교환수 세척을 거쳐 질소로 건조하는 단계로 구성되는 것을 특징으로 하는 미세접촉창의 선택적 충전방법.
- 제1항에 있어서, 전해액에 젤라틴을 첨가하는 것을 특징으로 하는 미세접촉창의 선택적 충전방법.
- 제1항에 또는 2항에 있어서, 상기 전기도금은 상온에서 이루어지며, 전해액교반상태에서 정전류도금을 행하는 것을 특징으로 하는 미세접촉창의 선택적 충전방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930016096A KR960016482B1 (ko) | 1993-08-19 | 1993-08-19 | 전기도금법에 의한 고집적회로 미세패턴의 구리충전방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930016096A KR960016482B1 (ko) | 1993-08-19 | 1993-08-19 | 전기도금법에 의한 고집적회로 미세패턴의 구리충전방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950007078A true KR950007078A (ko) | 1995-03-21 |
KR960016482B1 KR960016482B1 (ko) | 1996-12-12 |
Family
ID=19361564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930016096A KR960016482B1 (ko) | 1993-08-19 | 1993-08-19 | 전기도금법에 의한 고집적회로 미세패턴의 구리충전방법 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960016482B1 (ko) |
-
1993
- 1993-08-19 KR KR1019930016096A patent/KR960016482B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR960016482B1 (ko) | 1996-12-12 |
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