KR950006643Y1 - Wafer cleaning apparatus - Google Patents
Wafer cleaning apparatus Download PDFInfo
- Publication number
- KR950006643Y1 KR950006643Y1 KR92013378U KR920013378U KR950006643Y1 KR 950006643 Y1 KR950006643 Y1 KR 950006643Y1 KR 92013378 U KR92013378 U KR 92013378U KR 920013378 U KR920013378 U KR 920013378U KR 950006643 Y1 KR950006643 Y1 KR 950006643Y1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- ultrapure water
- cleaning apparatus
- cleaning
- wafer cleaning
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
Abstract
내용 없음.No content.
Description
제 1 도 : 종래의 웨이퍼 세척 장치를 설명하기 위한 도면.1 is a diagram for explaining a conventional wafer cleaning apparatus.
제 2 도 : 본 고안의 웨이퍼 세척 장치를 설명하기 위한 도면.2 is a view for explaining a wafer cleaning apparatus of the present invention.
제 3 도 : 본 고안의 웨이퍼 세척 장치를 설명하기 위한 도면.3 is a view for explaining a wafer cleaning apparatus of the present invention.
본 고안은 반도체 웨이퍼를 세척하는 장치에 관한 것으로서, 특히 초순수(Deionized water)사용을 절감하면서 세척효율을 높일 수 있는 세척장치에 관한 것이다.The present invention relates to a device for cleaning a semiconductor wafer, and more particularly to a cleaning device that can increase the cleaning efficiency while reducing the use of ultra-pure water (Deionized water).
제 1 도는 종래의 웨이퍼 세척기를 설명하기 위한 도면으로서, 제 1 도의 (a)는 초순수를 오버플로우시키는 방식이고, 제 1 도의 (b)는 덤프-스프레이-필 방식을 설명하기 위한 도면이다.1 is a view for explaining a conventional wafer cleaner, (a) of FIG. 1 is a method of overflowing ultrapure water, and (b) of FIG. 1 is a view for explaining a dump-spray-fill method.
현재까지 웨이퍼를 캐리어채로 세척하는 방법으로서, 제 1 도의 (a)와 같이 세척조(12)에 웨이퍼를 담는 캐리어를 넣으면 공급밸브(13)을 통하여 초순수가 차올라서 정해진 시간동안 유지하고, 한꺼번에 드레인밸브(14)를 통하여 덤퍼(배출)하는 싸이클을 정해진 횟수만큼 실시하는 것이다.As a method of cleaning a wafer with a carrier so far, as shown in (a) of FIG. 1, when a carrier containing a wafer is placed in the cleaning tank 12, ultrapure water is charged through the supply valve 13 to maintain a predetermined time, and the drain valve at once. The cycle to dump (discharge) through (14) is performed a predetermined number of times.
다른 방식은 제 1 도의 (b)와 같이 세척조(Rines Bath)에 웨이퍼(Wafer)를 담는 캐리어를 넣으면 초순수가 차올라서 정해진 시간동안 유지하고, 덤퍼시에 초순수가 노즐(15)을 통해서 스프레이된다.In another method, as shown in FIG. 1 (b), when a carrier containing a wafer is placed in a lining bath, ultrapure water is filled and maintained for a predetermined time, and ultrapure water is sprayed through the nozzle 15 at the time of dumping.
이런 사이클을 정해진 횟수만큼 실시한다. 초순수의 공급은 공급밸브(13)을 통하여 하고 배출은 드레인밸브(14)를 통하여 한다.Do this cycle a fixed number of times. Ultrapure water is supplied through the supply valve 13 and discharge is performed through the drain valve 14.
이러한 종래의 방식을 채택하는 웨이퍼 세척 장치에는 초순수가 조용히 차올라서 세척(Cleaning)하는 형식이기 때문에 웨이퍼 표면의 미세 패턴 세척이 부실하고 초순수의 낭비가 심하다.In the wafer cleaning apparatus adopting such a conventional method, since ultrapure water is quietly filled and cleaned, fine pattern cleaning of the wafer surface is poor and waste of ultrapure water is severe.
그리고 초순수의 스프레이시에 압력이 떨어지면 노즐의 분사가 약하여 물줄기로 밖에 되지 않는다. 초순수로 웨이퍼 표면이 고르게 세척하지 못하고 오히려 세척 효율을 떨어뜨린다.When the pressure drops during the spraying of ultrapure water, the injection of the nozzle is weak and becomes only water. Ultrapure water does not evenly clean the wafer surface, but rather reduces the cleaning efficiency.
본 고안은 종래 기술의 문제점을 해소 개선하고 세척의 효율과 초순수의 절감을 위해서 세척조를 개조하여 세척조에 초순수가 차오를 때 초순수의 흐름을 회전시키고, 정해진 시한 후 회전 방향을 바꾸어서 웨이퍼 패턴의 세척 효율 향상과 초순수의 절감을 기할수 있도록 한 것이다. 회전 방향을 바꾸는 횟수를 선택하여 작업을 실시하면 된다.The present invention is to solve the problem of the prior art and to improve the cleaning efficiency and ultra-pure water, the washing tank is modified to rotate the flow of ultra-pure water when the ultra-pure water fills the washing tank, the cleaning direction of the wafer pattern by changing the rotation direction after a predetermined time It is intended to improve and reduce ultrapure water. Select the number of times to change the direction of rotation to work.
본 고안은 밑에 드레인밸브(22)를 가지고 있는 세척조(20) 하부 바닥면에 회전 수류를 만들어주는 우회전 노즐판(30)과 좌회전 노즐판(40)을 설치하고, 순수 공급밸브(27)을 통하여 순수 공급관을 3로 밸브(Three Way Valve)에 연결하고, 이 3로밸브의 출구를 우회전 노즐판(30)과 좌회전 노즐판(40)에 각각 연결하여서 이루어진다. 이 좌, 우 회전 노즐판(40, 30)은 중심부위에 3로밸브로부터의 순수공급관이 연결되는 순수입구(42, 32)를 가지고 있고, 이 순수입구에서 좌, 우 회전 방향으로 순수를 분사시는 노즐까지를 연결하는 좌, 우회전 연결통로(44, 34)를 가지고 있다.The present invention is installed on the bottom surface of the lower side of the washing tank 20 having a drain valve 22 to install a right rotation nozzle plate 30 and a left rotation nozzle plate 40, through the pure water supply valve 27 The pure water supply pipe is connected to a three way valve, and the outlet of the three way valve is connected to the right rotating nozzle plate 30 and the left rotating nozzle plate 40, respectively. The left and right rotating nozzle plates 40 and 30 have pure inlets 42 and 32 through which a pure water supply pipe from a three-way valve is connected to the center, and when pure water is injected in the left and right rotation directions. It has left and right turn connecting passages 44 and 34 connecting the nozzles.
본 고안의 웨이퍼 세척장치를 이용하여 웨이퍼를 세척하는 과정을 설명하면, 먼저 웨이퍼 캐리어(도시 안함)를 세척조(20)속에 넣고, 초순수 공급 밸브(27)을 열어 초순수를 3로밸브까지 공급하고, 이 3로밸브에 미리 열려져 있는 출구를 통하여 좌회전 노즐판 또는 우회전 노즐판에 초순수를 공급한다. 그러면 초순수는 좌회전 또는 우회전 수류로 되면서 세정조(20)내로 공급된다. 일정시간 경과후에 3로밸브를 절환하면, 좌회전 노즐판에 공급되고 있었으면 우회전 노즐판으로, 또 우회전 노즐판에 초순수가 공급되고 있었으면 좌회전 노즐판으로 변경되면서 초순수가 공급된다. 이렇게 교대로 3로밸브를 절환시킴으로서 좌, 우 회전 수류가 웨이퍼의 미세패턴을 골고루 세척할 수 있게 된다. 또, 세척조(20)내에 초순수가 가득차면 넘치게 되는데 이 오버플로우시키는 시간을 조정하여 세척 완료시간을 정한다. 세척이 끝나면 초순수를 드레인시킨다.Referring to the process of cleaning the wafer using the wafer cleaning apparatus of the present invention, first put a wafer carrier (not shown) into the cleaning tank 20, open the ultra-pure water supply valve 27 to supply the ultra-pure water to the three-way valve, Ultrapure water is supplied to the left rotating nozzle plate or the right rotating nozzle plate through an outlet previously opened to the three-way valve. The ultrapure water is then supplied into the washing tank 20 while the left turn or the right turn flows. When the three-way valve is switched after a certain period of time, ultrapure water is supplied to the left rotating nozzle plate if it is being supplied to the left rotating nozzle plate and to the left rotating nozzle plate if ultrapure water was supplied to the right rotating nozzle plate. By switching the three-way valve in this way, the left and right rotation water flow can evenly wash the fine pattern of the wafer. In addition, when the ultrapure water is filled in the washing tank 20, the overflow occurs, and by adjusting the overflow time, the washing completion time is determined. After cleaning, drain the ultrapure water.
본 고안은 미세 패턴에서 특히 문제가 되는 구석진 부위의 웨이퍼 세척시에 효과를 발휘한다.The present invention has an effect when cleaning the wafer of the corner area, which is particularly problematic in fine patterns.
특히 웨이퍼를 캐리어에 가만히 놓아 두어도 전후 좌우 움직이는 것같은 효과를 발휘할 수 있고 종래와 같이 최종세척을 실시하려고 세척조를 바꾸어서 다시 2중으로 세척하는 횟수를 줄일 수 있어서 초순수의 상당량절감을 이룰 수 있다.In particular, even if the wafer is left in the carrier, it can exert the effect of moving back and forth and left and right, and the number of times of washing again by changing the washing tank to perform the final washing as in the prior art can reduce the amount of ultrapure water.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92013378U KR950006643Y1 (en) | 1992-07-20 | 1992-07-20 | Wafer cleaning apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92013378U KR950006643Y1 (en) | 1992-07-20 | 1992-07-20 | Wafer cleaning apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR940004332U KR940004332U (en) | 1994-02-24 |
| KR950006643Y1 true KR950006643Y1 (en) | 1995-08-16 |
Family
ID=19337010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR92013378U KR950006643Y1 (en) | 1992-07-20 | 1992-07-20 | Wafer cleaning apparatus |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR950006643Y1 (en) |
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1992
- 1992-07-20 KR KR92013378U patent/KR950006643Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR940004332U (en) | 1994-02-24 |
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