KR940027102A - Chip on Grass (COG) Panel Layer Structure - Google Patents

Chip on Grass (COG) Panel Layer Structure Download PDF

Info

Publication number
KR940027102A
KR940027102A KR1019930008609A KR930008609A KR940027102A KR 940027102 A KR940027102 A KR 940027102A KR 1019930008609 A KR1019930008609 A KR 1019930008609A KR 930008609 A KR930008609 A KR 930008609A KR 940027102 A KR940027102 A KR 940027102A
Authority
KR
South Korea
Prior art keywords
metal film
aluminum
film
cog
chip
Prior art date
Application number
KR1019930008609A
Other languages
Korean (ko)
Inventor
최성림
Original Assignee
박경팔
삼성전관 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 박경팔, 삼성전관 주식회사 filed Critical 박경팔
Priority to KR1019930008609A priority Critical patent/KR940027102A/en
Publication of KR940027102A publication Critical patent/KR940027102A/en

Links

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

본 발명은 평판용 디스플레이의 COG 구조에 관한 것으로 패널의 패턴부분은 유리기판 상에 형성된 ITO위에 알루미늄이 증착되고 상기 알루미늄 전체를 크롬막으로 도포한 뒤 본딩될 부위만을 에치시켜 와이어가 본딩될 부위만 알루미늄막의 표면이 드러나도록 패터닝시키고, 회로패턴 부분은 글라스 상에 알루미늄을 증착하고 그 위에 다시 크롬막을 상기와 동일한 방법으로 증착시키고 와이어가 본딩될 부위만 알루미늄막이 드러나도록 상기 크롬을 식각시킨뒤, 칩 전극과 상기 노출된 알루미늄막을 금(Au) 및 알루미늄(Al) 와이어로 본딩시키므로써, 알루미늄막의 긁힘 및 산화를 방지할 수 있을 뿐 아니라 단선이나 저항이 변화되는 것을 줄일 수 있는 고신뢰성의 COG 패널 층 구조를 실현할 수 있게 된다.The present invention relates to a COG structure of a flat panel display, wherein the pattern portion of the panel is deposited on ITO formed on a glass substrate, and the entire aluminum is coated with a chromium film, and only the portion to be bonded is etched by etching only the portion to be bonded. The surface of the aluminum film is patterned so that the surface of the aluminum film is exposed, the circuit pattern portion is deposited with aluminum on the glass, and the chromium film is deposited thereon in the same manner as above, and the chromium is etched so that only the portion where the wire is to be bonded is exposed. Bonding the electrode and the exposed aluminum film with gold (Au) and aluminum (Al) wires, a highly reliable COG panel layer that not only prevents scratching and oxidation of the aluminum film but also reduces disconnection or resistance change The structure can be realized.

Description

칩 온 그래스(COG) 패널 층 구조Chip on Grass (COG) Panel Layer Structure

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 종래 기술에 따른 COG 패널 층 구조를 도시한 단면도, 제2도는 본 발명에 따른 COG 패널 층 구조를 도시한 단면도이다.1 is a cross-sectional view showing a COG panel layer structure according to the prior art, and FIG. 2 is a cross-sectional view showing a COG panel layer structure according to the present invention.

Claims (5)

유리기판 상에 패널부와 회로부 및 칩부착부로 구분되어 서로 분리되게 형성된 제1금속막과, 상기 패널부인 제1금속막의 일측에 상기 제1금속막보다 낮은 높이로 상기 제1금속막과 일부 중첩되게 유리기판상에 형성된 투명도전막과, 상기 칩부착부인 제1금속막 상에 형성된 제2금속막과, 상기 패널부에 형성된 투명도전막과 제1금속막 및 상기 회로부에 형성된 제1금속막 상에 도포된 뒤 본딩될 부위가 식각되어 제1금속막의 일부가 드러나도록 형성된 제2금속막과, 상기 칩부착부에 중착된 제2금속막 상에 다이 본딩된 칩과, 상기 칩 상의 양측에 서로 분리되게 형성된 칩전극과, 상기 칩전극과 상기 패널부 및 회로부 표면의 개구된 제1금속막 사이에 각각 본딩되는 본딩와이어로 이루어짐을 특징으로 하는 COG 패널 층 구조.The first metal film, which is divided into a panel part, a circuit part, and a chip attaching part on a glass substrate, is formed to be separated from each other, and partially overlaps the first metal film at a height lower than that of the first metal film on one side of the first metal film, which is the panel part. The transparent conductive film formed on the glass substrate, the second metal film formed on the first metal film serving as the chip attaching part, the transparent conductive film formed on the panel part, the first metal film and the first metal film formed on the circuit part. And a portion to be bonded is etched to expose a portion of the first metal film, a chip die-bonded on the second metal film intermediately attached to the chip attaching portion, and separated from each other on both sides of the chip. And a bonding wire bonded between the formed chip electrode and the first metal film opened on the surface of the panel electrode and the circuit part. 제1항에 있어서, 상기 제1금속막은 알루미늄으로 이루어짐을 특징으로 하는 COG 패널 층 구조.The COG panel layer structure according to claim 1, wherein the first metal film is made of aluminum. 제2항에 있어서, 상기 알루미늄막은 1-3μ의 두께로 도포됨을 특징으로 하는 COG 패널 층 구조.3. The COG panel layer structure according to claim 2, wherein the aluminum film is coated with a thickness of 1-3 mu. 제1항에 있어서, 상기 제2금속막을 크롬 및 니켈중 어느 하나로 이루어짐을 특징으로 하는 COG 패널 층 구조.The COG panel layer structure according to claim 1, wherein the second metal film is made of any one of chromium and nickel. 제4항에 있어서, 상기 크롬막은 1-2μ의 두께로 도포됨을 특징으로 하는 COG 패널 층 구조.5. The COG panel layer structure according to claim 4, wherein the chromium film is applied to a thickness of 1-2 mu. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019930008609A 1993-05-19 1993-05-19 Chip on Grass (COG) Panel Layer Structure KR940027102A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019930008609A KR940027102A (en) 1993-05-19 1993-05-19 Chip on Grass (COG) Panel Layer Structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930008609A KR940027102A (en) 1993-05-19 1993-05-19 Chip on Grass (COG) Panel Layer Structure

Publications (1)

Publication Number Publication Date
KR940027102A true KR940027102A (en) 1994-12-10

Family

ID=67137449

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930008609A KR940027102A (en) 1993-05-19 1993-05-19 Chip on Grass (COG) Panel Layer Structure

Country Status (1)

Country Link
KR (1) KR940027102A (en)

Similar Documents

Publication Publication Date Title
KR870008381A (en) Semiconductor devices
JP2004521494A5 (en)
KR970063769A (en) Photovoltaic Devices with Opaque Substrates of Specific Irregular Surface Structure
KR960019629A (en) Semiconductor devices
US5808710A (en) Liquid crystal display tile interconnect structure
KR940027102A (en) Chip on Grass (COG) Panel Layer Structure
JPS60220317A (en) Liquid crystal display element
KR900015279A (en) Chip carrier
JPH05119706A (en) Manufacture of led display device
KR970007429A (en) Pad structure of LCD device and manufacturing method thereof
CN219960931U (en) Copper circuit structure based on transparent substrate
JPS63114081A (en) Construction of wire pattern
JPH0540499Y2 (en)
JPH0236278Y2 (en)
JPS63147339A (en) Semiconductor device
JP2984152B2 (en) Semiconductor element mounting method
JPS6234466Y2 (en)
JPS6037257U (en) photovoltaic element
KR100570080B1 (en) Liquid crystal display module
JPH02153543A (en) Flexible printed board
JPS63197987A (en) Electrode plate for display device
JPS6215586A (en) Display elememt
JPH0729531U (en) Liquid crystal display
KR970073258A (en) Mounting structure of chip type device and method thereof
JPH1031423A (en) Liquid crystal display panel

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination