KR940021341U - Heating Block Structure of Wire Bonding Machine - Google Patents
Heating Block Structure of Wire Bonding MachineInfo
- Publication number
- KR940021341U KR940021341U KR2019930002116U KR930002116U KR940021341U KR 940021341 U KR940021341 U KR 940021341U KR 2019930002116 U KR2019930002116 U KR 2019930002116U KR 930002116 U KR930002116 U KR 930002116U KR 940021341 U KR940021341 U KR 940021341U
- Authority
- KR
- South Korea
- Prior art keywords
- wire bonding
- block structure
- heating block
- bonding machine
- machine
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019930002116U KR960002552Y1 (en) | 1993-02-17 | 1993-02-17 | Heating block structure of wire-bonding machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019930002116U KR960002552Y1 (en) | 1993-02-17 | 1993-02-17 | Heating block structure of wire-bonding machine |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940021341U true KR940021341U (en) | 1994-09-24 |
KR960002552Y1 KR960002552Y1 (en) | 1996-03-27 |
Family
ID=19350850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019930002116U KR960002552Y1 (en) | 1993-02-17 | 1993-02-17 | Heating block structure of wire-bonding machine |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960002552Y1 (en) |
-
1993
- 1993-02-17 KR KR2019930002116U patent/KR960002552Y1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR960002552Y1 (en) | 1996-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NO933476L (en) | Flux-core wire | |
KR930003586U (en) | Wire bond heater block | |
KR900015298A (en) | Wire bonding method | |
KR950702255A (en) | GOLD-ALLOY BONDING WIRE for wire bonding | |
DE69500635T2 (en) | Single point bond process | |
KR940021341U (en) | Heating Block Structure of Wire Bonding Machine | |
DE69620999D1 (en) | KARDEN SET WIRE | |
KR950034344U (en) | Mega-bonding device of wire bonding machine | |
KR930016204U (en) | Wire Bonder Multi Heater Block | |
KR940021342U (en) | Heater Block for Wire Bonding | |
KR970019750U (en) | Heater block of wire bonding equipment | |
KR950015658U (en) | Wire bonding head | |
KR960003110U (en) | Block for wire bonding | |
KR970019749U (en) | Heater block structure for wire bonder | |
KR970019748U (en) | Heater block structure for wire bonder | |
KR970004599U (en) | Heat bonder | |
KR960009263U (en) | Transducer for Wire Bonder | |
KR970015427U (en) | Wire tie | |
KR920005328U (en) | Clamp for wire bonding | |
KR970011205U (en) | Heater block for wire bonding | |
FI1597U1 (en) | Stomkonstruktion Foer soffa bestaoende av moduldelar | |
KR950021409U (en) | Wire bonder capillaries | |
KR970046781U (en) | Wire Bonding Clamp | |
KR970007235U (en) | Leadframe Heater of Wire Bonding Equipment | |
KR960032746U (en) | Wire bonding tools |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20030218 Year of fee payment: 8 |
|
LAPS | Lapse due to unpaid annual fee |