KR940021341U - Heating Block Structure of Wire Bonding Machine - Google Patents

Heating Block Structure of Wire Bonding Machine

Info

Publication number
KR940021341U
KR940021341U KR2019930002116U KR930002116U KR940021341U KR 940021341 U KR940021341 U KR 940021341U KR 2019930002116 U KR2019930002116 U KR 2019930002116U KR 930002116 U KR930002116 U KR 930002116U KR 940021341 U KR940021341 U KR 940021341U
Authority
KR
South Korea
Prior art keywords
wire bonding
block structure
heating block
bonding machine
machine
Prior art date
Application number
KR2019930002116U
Other languages
Korean (ko)
Other versions
KR960002552Y1 (en
Inventor
이병우
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019930002116U priority Critical patent/KR960002552Y1/en
Publication of KR940021341U publication Critical patent/KR940021341U/en
Application granted granted Critical
Publication of KR960002552Y1 publication Critical patent/KR960002552Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR2019930002116U 1993-02-17 1993-02-17 Heating block structure of wire-bonding machine KR960002552Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930002116U KR960002552Y1 (en) 1993-02-17 1993-02-17 Heating block structure of wire-bonding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930002116U KR960002552Y1 (en) 1993-02-17 1993-02-17 Heating block structure of wire-bonding machine

Publications (2)

Publication Number Publication Date
KR940021341U true KR940021341U (en) 1994-09-24
KR960002552Y1 KR960002552Y1 (en) 1996-03-27

Family

ID=19350850

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930002116U KR960002552Y1 (en) 1993-02-17 1993-02-17 Heating block structure of wire-bonding machine

Country Status (1)

Country Link
KR (1) KR960002552Y1 (en)

Also Published As

Publication number Publication date
KR960002552Y1 (en) 1996-03-27

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20030218

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee