KR950015658U - Wire bonding head - Google Patents

Wire bonding head

Info

Publication number
KR950015658U
KR950015658U KR2019930025848U KR930025848U KR950015658U KR 950015658 U KR950015658 U KR 950015658U KR 2019930025848 U KR2019930025848 U KR 2019930025848U KR 930025848 U KR930025848 U KR 930025848U KR 950015658 U KR950015658 U KR 950015658U
Authority
KR
South Korea
Prior art keywords
wire bonding
bonding head
head
wire
bonding
Prior art date
Application number
KR2019930025848U
Other languages
Korean (ko)
Other versions
KR0136527Y1 (en
Inventor
이창배
Original Assignee
삼성항공산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업주식회사 filed Critical 삼성항공산업주식회사
Priority to KR2019930025848U priority Critical patent/KR0136527Y1/en
Publication of KR950015658U publication Critical patent/KR950015658U/en
Application granted granted Critical
Publication of KR0136527Y1 publication Critical patent/KR0136527Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR2019930025848U 1993-11-30 1993-11-30 Wire bonding head KR0136527Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930025848U KR0136527Y1 (en) 1993-11-30 1993-11-30 Wire bonding head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930025848U KR0136527Y1 (en) 1993-11-30 1993-11-30 Wire bonding head

Publications (2)

Publication Number Publication Date
KR950015658U true KR950015658U (en) 1995-06-19
KR0136527Y1 KR0136527Y1 (en) 1999-03-20

Family

ID=19369376

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930025848U KR0136527Y1 (en) 1993-11-30 1993-11-30 Wire bonding head

Country Status (1)

Country Link
KR (1) KR0136527Y1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101004205B1 (en) 2008-12-17 2010-12-24 동아제약주식회사 The controlled released pharmaceutical compsitions of udenafil for sustained release property

Also Published As

Publication number Publication date
KR0136527Y1 (en) 1999-03-20

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20071029

Year of fee payment: 10

EXPY Expiration of term